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SemI40 hosted the 2nd International Workshop on Science, Application and Methods in Industry 4.0 (SAMI40) – after a successful first edition within the i-KNOW conference in 2016. The workshop was organized by Roman Kern and Rene Kaiser of the Know-Center (research center for Data-Driven Business and...

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Together with our academic partners, we started the Power2020 project.

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The Lindau Laureate Meetings are annual occasions giving 400 dedicated young scientists from all over the world the chance to meet Nobel Laureates. In various talks attendees have the opportunity to get an insight in the research topics the Laureates were honoured for by the Nobel Prize Committee....

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The annual IEEE conference for Electronic Components and Technology (ECTC) is the No.1 conference when it comes to semiconductor packaging. This year’s conference took place in Orlando USA, and was attended by over 800 participants.

Stefan Schwab has given an oral presentation at 2017th ECTC in...

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EUROCORR, the annual event of the European Federation of Corrosion, is the premier Corrosion Congress in Europe, attracting an ever increasing international audience. It was held in Montpellier, France, from 11 to 15 September 2016.

On this occasion the Young Author's EFC Poster Prize was presented...

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After the official ceremony insights were given into the various fields of research during a tour through KAI which has been expanded this year.

Among the large number of guests we could welcome Peter Schiefer, President of the Automotive Division, Sabine Herlitschka, Chair of the Executive Board,...

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In this project led by Infineon Technologies Austria 37 partners from five countries will carry out research into further developing autonomous factories. The common goal is the next stage in the development of  Industry 4.0 applications. With a volume of 62 million euros, the research project is...

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PhD student Andreas Kleinbichler won a “Best Poster Award” at the Material for Advanced Metallization conference (MAM) 2016 held in Brussels on March 20th-23th 2016 for the poster titled “Mechanical Adhesion Testing Techniques for Metal Dielectric Interfaces”. The topic of the study was adhesion...

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Research paper 'Modular Test System Architecture for Device, Circuit and System Level Reliability Testing' presented at the APEC 2016 in Long Beach, California, March 20-24, 2016.

The proposed architecture is suitable for a broad range of power devices and can easily be adapted to future test...

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