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IEEE Electronic Components and Technology Conference

The annual IEEE conference for Electronic Components and Technology (ECTC) is the No.1 conference when it comes to semiconductor packaging. This year’s conference took place in Orlando USA, and was attended by over 800 participants.

Stefan Schwab has given an oral presentation at 2017th ECTC in Orlando, USA. His talk was about a new approach to measure sodium migration in semiconductor encapsulation materials with the title: "Measuring sodium migration in mold compounds using a sodium amalgam electrode as an infinite source".