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Our Publications

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2017

  • Dženana Alagić. A statistical measure for fatigue induced degradation in metal layers. Master's thesis, Alpen-Adria-Universität Klagenfurt, April 2017.
  • Vedo Alagić. Test pattern extraction for semiconductor wafer test data. Master's thesis, Alpen-Adria-Universität Klagenfurt, September 2017.
  • Antonio D’Amico, Christian Djelassi, Octavian Barbu, Dieter Haerle, Luca Petruzzi, and Andrea Baschirotto. A mixed-signal multi-functional system for current measurement and stress detection. In 13th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), 2017. (doi:10.1109/PRIME.2017.7974099)
  • Alexander Fritzer. Design and evaluation of a new method for speed improved fault injection simulations in analog circuits. Master's thesis, FH Kärnten, 2017.
  • Germano Galasso. Modelling the Nanosecond LASER Ablation of a Silicon Target. PhD thesis, Vienna University of Technology, Vienna, 2017.
  • Michael Glavanovics, Sybille Ofner, Roland Sleik, Michael Nelhiebel, Abhimanyu Madan, and Oliver Haeberlen. Application Related Reliability Test Concept for GaN HEMT Power Devices. In Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE), pages 93–94, May 2017.
  • Ramin Hasani, Dieter Haerle, Baumgartner, Christian F., and Radu Grosu. Behavioral modeling of a CMOS band-gap voltage reference circuit by neural networks. In IJCNN2017, 2017.
  • Ramin Hasani, Dieter Haerle, and Radu Grosu. Behavioral modeling of a CMOS band-gap voltage reference circuit using narx neural networks. In DATE 2017, 2017.
  • T. Islam, J. Zechner, M. Bernardoni, M. Nelhiebel, and R. Pippan. A novel setup for wafer curvature measurement at very high heating rates. Review of Scientific Instruments, 88(2):024709, February 2017. (doi:10.1063/1.4975378)
  • Andreas Kleinbichler, Johannes Zechner, and M.J. Cordill. Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces. Microelectronic Engineering, 167:63–68, January 2017. (doi:10.1016/j.mee.2016.10.020)
  • Christof Kofler. Interfacing digital diagnostic gate-drivers in a high voltage application stress test. Master's thesis, Fachhochschule Kärnten, 2017.
  • Christian Koller, Gregor Pobegen, Clemens Ostermaier, Martin Huber, and Dionyz Pogany. The interplay of blocking properties with charge and potential redistribution in thin carbon-doped GaN on n-doped GaN layers. Applied Physics Letters, 111(3):032106, 2017. (doi:10.1063/1.4993571)
  • Andrea Lavarda, Bernd Deutschmann, and Dieter Haerle. Enhancement of the dpi method for IC immunity characterization. In 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMCCompo), 2017. (doi:10.1109/EMCCompo.2017.7998106)
  • Andrea Lavarda, Bernd Deutschmann, and Dieter Haerle. On the robustness of CMOS chopped operational amplifiers to conducted electromagnetic interferences. IEEE Transactions on Electromagnetic Compatibility, PP(99), 2017. (doi:10.1109/TEMC.2017.2729781)
  • Niveditha Manjunath, Mario Heindl, Dieter Haerle, Stephen Sabanal, Herbert Eichinger, Hermann Tauber, Andreas Machne, Christian Manthey, Mikko Vaeaenaenen, RAdu Grosu, and Dejan Nickovic. Production tests coverage analysis in the simulation environment. In DATE, 2018.
  • Bastian Philippi, Kurt Matoy, Johannes Zechner, Christoph Kirchlechner, and Gerhard Dehm. Microcantilever fracture testing of intermetallic cu3sn in lead-free solder interconnects. Journal of Electronic Materials, 46(3):1607–1611, January 2017. (doi:10.1007/s11664-016-5203-0)
  • Arpitha Prabhakara. Design and implementation of a bootloader applied in a distributed microcontroller network for power semiconductor stress test system. Master's thesis, Hochschule Darmstadt - University of Applied Sciences, 2017.
  • Florian Peter Pribahsnik, Michael Nelhiebel, Marianne Mataln, Mirko Bernardoni, Gerhard Prechtl, Frank Altmann, David Poppitz, and Andreas Lindemann. High temperature failure mode in power GaN devices. In Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE), May 2017.
  • Florian Peter Pribahsnik, Michael Nelhiebel, Marianne Mataln, Mirko Bernardoni, Gerhard Prechtl, Frank Altmann, David Poppitz, and Andreas Lindemann. Exploring the thermal limit of GaN power devices under extreme overload conditions. Microelectronics Reliability, 76(Supplement C):304–308, 2017. (doi:10.1016/j.microrel.2017.07.046)
  • Gerald Rescher, Gregor Pobegen, Thomas Aichinger, and Tibor Grasser. Improved interface trap density close to the conduction band edge of a-face 4H-SiC mosfets revealed using the charge pumping technique. Materials Science Forum, 897:143–146, 2017. (doi:10.4028/www.scientific.net/MSF.897.143)
  • Christoph Rhinow. Development and validation of a diagnostic gate-driver for high-voltage transistors. Master's thesis, Politecnico di Milano, 2017.
  • Stefan Schwab. Ion Diffusion and Migration in Semiconductor Passivation and Encapsulation Materials. PhD thesis, Technische Universität Wien, Wien, 2017.
  • Roland Sleik, Michael Glavanovics, Yevhen Nikitin, Marco Di Bernardo, Annette Muetze, and Klaus Krischan. Performance enhancement of a modular test system for power semiconductors for htol testing by use of an embedded system. In Proceedings of EPE'17 ECCE Europe. IEEE, September 2017. (doi:10.23919/EPE17ECCEEurope.2017.8098933)
  • Roland Sleik, Michael Glavanovics, Sascha Einspieler, Annette Muetze, and Klaus Krischan. Modular test system architecture for device, circuit and system level reliability testing and condition monitoring. IEEE Transactions on Industry Applications, 53:5698–5708, November 2017. (doi:10.1109/TIA.2017.2724501)
  • Imane Souli, Velislava L. Terziyska, Jozef Keckes, Werner Robl, Johannes Zechner, and Christian Mitterer. Effect of growth conditions on interface stability and thermophysical properties of sputtered cu films on si with and without WTi barrier layers. Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, 35(2):022201, March 2017. (doi:10.1116/1.4975805)
  • Roberta Stradiotto, Gregor Pobegen, Clemens Ostermaier, Michael Waltl, Alexander Grill, and Tibor Grasser. Characterization of interface defects with distributed activation energies in GaN-based MIS-HEMTs. IEEE Transactions on Electron Devices, 64(3):1045–1052, March 2017. (doi:10.1109/ted.2017.2655367)
  • Alexander Ulbing. Grade zero - evaluation of an advanced per site thermal management system for power device qualification under grade-zero conditions. Master's thesis, Carinthia University of Applied Sciences, 2017.
  • Anja Zernig, Olivia Bluder, Jürgen Pilz, Andre Kästner, and Alban Krauth. Identification of risk devices using independent component analysis for semiconductor measurement data. International Journal of Industrial Engineering: Theory, Applications and Practice, 23(5), 2017.

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