Michael Reisinger, researcher in the KAI Materials Science and Simulation group, attended as invited speaker at the “International conference on Frontiers of Characterization and Metrology for Nanoelectronics” (FCMN 2024), held in Monterey, California, USA from 15 to 18 April 2024.

Michael´s talk, entitled ”Understanding the Damage and Microstructural Evolution in Cu Metallizations during Thermo-mechanical Fatigue“, presented key findings from the MultiCharm and AddMorePower projects. At the conference he contributed significantly by exchanging knowledge about the opportunities and application of novel characterization techniques in the semiconductor industry.