Publications

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2026 ▾

• Liz Karanja, Sebastian Moser, Michael Reisinger, and Marc Legros. In-situ TEM investigation of thermomechanical fatigue of thick copper metallizations. Microelectronics Reliability, 179:116050, April 2026. (doi:10.1016/j.microrel.2026.116050)
• Dominik Karasin. Distribution shift detection for wafer test data. Bachelor’s thesis, Johannes Kepler University Linz, 2026.
• Sebastian Moser, Liz Karanja, Michael Reisinger, Manuel Petersmann, Peter Imrich, Michael Nelhiebel, Megan Cordill, and Marc Legros. In-situ electron microscopy investigation of cu thermo-mechanical fatigue. In MecaNano In-Situ Electron Microscopy Workshop, Toulouse, France, January 2026.
• Konstantin Posch, Maximilian Arbeiter, Christian Truden, Martin Pleschberger, and Jürgen Pilz. Feature selection using nearest neighbor gaussian processes. Mathematics, 14(3):476, January 2026. (doi:10.3390/math14030476)
• Gerald Josef Kamillo Schaffar. Advancing the micromechanical characterization of silicon with a focus on high temperatures. PhD thesis, Montanuniversität Leoben, 2026. (doi:10.34901/mul.pub.2026.072)

2025 ▾

• Lena Bergmann. Electrical characterization of point defects in silicon high voltage diodes. PhD thesis, FAU Erlangen-Nuremberg, 2025.
• Massimo Boldrin. Programming the AURIX microcontroller through Simulink: A framework for rapid prototyping and comparison with Speedgoat systems. Master’s thesis, University of Padova, 2025. (doi:20.500.12608/87530)
• Nadine Buchebner, Julius F. Keckes, Verena Maier-Kiener, Peter-Julian Imrich, and Daniel Kiener. A comprehensive methodological approach towards the micromechanical characterization of lead-free solder joints. JOM, Open Access, March 2025. (doi:10.1007/s11837-025-07289-z)
• Boris Butej. Electrical Characterization and Modeling of Charge Accumulation and Transport Processes in GaN HEMTs. PhD thesis, TU Wien, 2025.
• Cedric Corley-Wiciak and Michael Reisinger. Multi-scale strain landscape of Al1-xGaxN/GaN/Si heterostructures probed by X-ray diffraction microscopy. In International Conference on Solid State Devices and Materials, 2025.
• Charlotte Cui, Fereshteh Falah Chamasemani, Michael Reisinger, Peter Imrich, Walter Hartner, Werner Robl, and Roland Brunner. A generative diffusion-based AI-model to scrutinise the microstructural degradation of isothermally aged Cu-SAC305 interfaces. npj Materials Degradation, 9(1), May 2025. (doi:10.1038/s41529-025-00603-9)
• Charlotte Cui, Bernhard Sartory, Michael Reisinger, Peter Imrich, Walter Hartner, and Roland Brunner. Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling. Scientific Reports, 15(1), August 2025. (doi:10.1038/s41598-025-25169-z)
• Charlotte Cui, Sebastian Krauß, Hooman Hosseinkhannazer, Julien Magnien, Olena Vertsanova, Michael Reisinger, Peter Imrich, Walter Hartner, and Roland Brunner. Unravelling Cu_6Sn_5 precipitate coarsening mechanisms in SAC solders under thermomechanical cycling. Scientific Reports, 15(1), October 2025. (doi:10.1038/s41598-025-21633-y)
• Charlotte Cui. Microstructural changes in Cu – SAC – Cu interconnects during isothermal, mechanical and thermo-mechanical load. PhD thesis, Montanuniversität, Leoben, 2025.
• Wolfgang Flachberger, Jiri Svoboda, Peter Lutz, Charlotte Cui, Thomas Antretter, Manuel Petersmann, Swaroop Gaddikere-Nagaraja, Daniel Kiener, and Roland Brunner. On the impact of inhomogeneities on vacancy diffusion controlled void and crack formation in sac305 solder joints. Next Materials, 9:101163, 2025. (doi:10.1016/j.nxmate.2025.101163)
• Wolfgang Flachberger. Numerical simulation of thermomechanical material behavior and damage in lead-free solders. PhD thesis, Montanuniversität Leoben, 2025.
• Gianluca Guglielmo and Marc Masana. Leveraging intermediate representations for better out-of-distribution detection. In 28^th Computer Vision Winter Workshop. Verlag der Technischen Universität Graz, 2025. (doi:10.3217/978-3-99161-022-9-005)
• Sergei Hammer. Cybersecurity Enhancement for Safety Related Low-End Automotive Electronics. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2025.
• Alexander Huber, Manuel Petersmann, and Thomas Antretter. Modeling microstructure sensitive degradation of electroplated copper during short circuit power pulsing. In 26^th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, April 2025. (doi:10.1109/eurosime65125.2025.11006557)
• Jakob Koenig. FAIR data exchange in EU projects – use case All2GaN. In DESY ISM 2025, Hamburg, Germany, January 2025.
• Johannes Kügler. Reliability study on SiC trench MOSFETs with high-k gate dielectrics. Master’s thesis, Universität Wien, 2025.
• Maximilian Moser, Gregor Pobegen, Mischa Nelhiebel, Iwona Jozwik, and Jürgen Smoliner. Refined physical model for understanding the secondary electron doping contrast mechanism. Journal of applied physics, 138(23), December 2025. (doi:10.1063/5.0289224)
• Sybille Ofner and Michael Glavanovics. Versatile modular WBG stress test system for MHz hard and soft switching operation modes. In International Conference on Electrical Drives and Power Electronics (EDPE), Dubrovnik, Croatia, September 2025. (doi:10.1109/EDPE66853.2025.11224241)
• Jacob Otasowie. Custom automated system for offline MOSFET characterization. Master’s thesis, Carinthia University of Applied Sciences, Villach, AUT, July 2025.
• Thomas Poll. Electrical characterization of p-GaN gate HEMTs: The role of intentional hole injection for dynamic RDS,on recovery. Master’s thesis, TU Wien, 2025.
• Michael Reisinger, Tobias Ziegelwanger, Cedric Corley-Wociac, Boris Butej, Nicolas Sammler, Laura Neumann, Tobias Ziegelwanger, Sebastian Moser, and Jozef Keckes. Advanced operando X-ray diffraction to explore power electronics in space and time. In EUROMAT, 2025.
• Bernhard Ruch, Rajarshi Roy Chaudhuri, Boris Butej, Joao Gomes, Manuel Stabentheiner, Korbinian Reiser, Christian Koller, Dionyz Pogany, Clemens Ostermaier, and Michael Waltl. Evidence for 2D hole gas in GaN gate injection transistors and its role in Rdson recovery. In 2025 IEEE International Reliability Physics Symposium (IRPS). IEEE, March 2025. (doi:10.1109/irps48204.2025.10983056)
• Gerald J.K. Schaffar, Michael Burtscher, Aidan A. Taylor, Daniel Schrittwieser, Daniel Tscharnuter, Daniel Kiener, Peter J. Imrich, and Verena Maier–Kiener. From nano-twinning to the glide of full dislocations: Micropillar compression tests on silicon up to 900 °c. Materials & Design, 258:114730, September 2025. (doi:10.1016/j.matdes.2025.114730)
• Michael Georg Stadt, Silvia Larisegger, Michael Nelhiebel, Florian Fahrnberger, Herbert Hutter, and Günter Fafilek. High-temperature electrochemical studies of metal diffusion through noble metal layers. Journal of the Electrochemical Society, Open Access, April 2025. (doi:10.1149/1945-7111/adce3d)
• Julian Vega. Characterization of laser-diced si power device recast layers using advanced SEM techniques. Master’s thesis, Università delgli studi di Padova, 2025.
• Andreas Warmuth, Kevin Kapaj, and Alexander Ulbing. Novel control methodologies of back-to-back B6 bridges for an application-related stress test setup. EPE 2025, Early Access, April 2025.
• Dominik Wieland, Boris Butej, Manuel Stabentheiner, Christian Koller, Dionyz Pogany, and Clemens Ostermaier. Analyzing the role of hole injection on the short circuit performance of p-GaN gate power HEMTs. Microelectronics Reliability, 169:115722, June 2025. (doi:10.1016/j.microrel.2025.115722)
• Tobias Ziegelwanger, Michael Reisinger, Vedad Babic, Kostya Hlushko, Steven Van Petegem, Juraj Todt, Michael Meindlhumer, and Jozef Keckes. 20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates. Materials & Design, 251:113664, March 2025. (doi:10.1016/j.matdes.2025.113664)
• Tobias Ziegelwanger, Michael Reisinger, Manuel Petersmann, Steven Van Petegem, Raquel Rodriguez-Lamas, Juraj Todt, Michael Meindlhumer, Jozef Keckes, and Can Yildirim. Intragranular strain and mosaicity in cu thin films during fast thermomechanical fatigue. npj Materials Degradation, 9(1), July 2025. (doi:10.1038/s41529-025-00629-z)

2024 ▾

• Birgit Achleitner, David Ken Gibbs, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. Employing reduced pressure to analyze challenging elements in LIBS. In 2024 Winter Conference on Plasma Spectrochemistry (WCPS), Tucson, Arizona, January 2024.
• Birgit Achleitner, Laurie Girault, Silvia Larisegger, Michael Nelhiebel, Patrick Knaack, and Andreas Limbeck. LIBS as a novel tool for the determination of the imidization degree of polyimides. Analytical and Bioanalytical Chemistry, 416(7):1623–1633, February 2024. (doi:10.1007/s00216-024-05163-6)
• Birgit Achleitner, Tobias Huber, Silvia Larisegger, Michael Nelhiebel, Patrick Knaack, and Andreas Limbeck. Monitoring the imidization reaction of polyimide thin films using an in-situ LIBS approach. Polymer Testing, 141:108647, December 2024. (doi:10.1016/j.polymertesting.2024.108647)
• Birgit Achleitner. Advanced analytical approaches to characterize ion mobility and structural changes in polyimide. PhD thesis, Vienna University of Technology, 2024.
• Avijit Bhattacharya. Application relevant power cycling of next generation SiC MOSFETs. Master’s thesis, Politecnico di Milano, 2024.
• Keven Brugger and Dorian Kerschbaumer. Speedgoat graphical user interface for visualisation and brakeout PCB. HTL Diploma thesis, HTL Mössignerstraße, 2024.
• Boris Butej, Dominik Wieland, Dionyz Pogany, Amgad Gharib, Gregor Pobegen, Clemens Ostermaier, and Christian Koller. Evidence-based understanding of lateral hole transport during OFF-state stress completing dynamic GaN-on-Si buffer charging model. physica status solidi (a) – applications and materials science, Early View, May 2024. (doi:10.1002/pssa.202400089)
• Andre Clausner, Martin Diehl, Michael Reisinger, Manuel Petersmann, Marc Legros, and Cedric Corley-Wiciak. Advanced Characterisation and Modelling for Degradation Processes in Copper BEoL Stacks of next generation Power Devices. In MAM – Materials for Advanced Metallization Conference, Milan, Italy, March 2024.
• Cedric Corley-Wiciak, Michael Reisinger, and Laura Neumann. Revealing the full strain tensor for semiconductor technology. In 16^th International Conference on X-Ray Microscopy, 2024.
• Charlotte Cui, Fereshteh Falah Chamasemani, Priya Paulachan, Rahulkumar Sinojiya, Jördis Rosc, Michael Reisinger, Peter Imrich, Walter Hartner, and Roland Brunner. Correlative, ML-based and non-destructive 3d-analysis of intergranular fatigue cracking in SAC305-Bi solder balls. npj Materials Degradation, 8(1), April 2024. (doi:10.1038/s41529-024-00456-8)
• Charlotte Cui, Michael Tkadletz, Michael Reisinger, Peter Imrich, Walter Hartner, and Roland Brunner. Effective preparation of low-melting solder materials for atom probe tomography. Scientific Reports, 14(1), November 2024. (doi:10.1038/s41598-024-79753-w)
• Charlotte Cui. Fatigue mechanisms in sustainable solder balls: An ml-assisted, correlative study. In Integrated Computational Materials, Process and Product Engineering (IC-MPPE 2024), 2024.
• Laurenz A. Farthofer. StreamGen: a Python framework for generating streams of labeled data. Journal of Open Source Software, 9(104):7206, 2024. (doi:10.21105/joss.07206)
• Maximilian W. Feil, Magdalena Weger, Hans Reisinger, Thomas Aichinger, André Kabakow, Dominic Waldhör, Andreas C. Jakowetz, Sven Prigann, Gregor Pobegen, Wolfgang Gustin, Michael Waltl, Michel Bockstedte, and Tibor Grasser. Time-gated optical spectroscopy of field-effect-stimulated recombination via interfacial point defects in fully processed silicon carbide power MOSFETs. Physical Review Applied, 22(2), August 2024. (doi:10.1103/physrevapplied.22.024075)
• Maximilian W. Feil, Katja Waschneck, Hans Reisinger, Judith Berens, Thomas Aichinger, Sven Prigann, Gregor Pobegen, Paul Salmen, Gerald Rescher, Dominic Waldhör, Aleksandr Vasilev, Wolfgang Gustin, Michael Waltl, and Tibor Grasser. Gate switching instability in silicon carbide MOSFETs—part i: Experimental. IEEE Transactions on Electron Devices, Early Access, 2024. (doi:10.1109/ted.2024.3397636)
• Wolfgang Flachberger, Alexander Huber, Cui Charlotte, Brunner Roland, Leitner Silvia, Petersmann Manuel, and Antretter Thomas. The role of mechanical driving forces for segregation phenomena in microelectronic solders. In 43^rd Solid Mechanics Conference: SolMech 2024, Wroclaw, Poland, September 2024.
• Vasileios Fotopoulos, Jack Strand, Manuel Petersmann, and Alexander L. Shluger. First principles study on the segregation of metallic solutes and non-metallic impurities in cu grain boundary. In TMS 2024 153^rd Annual Meeting & Exhibition Supplemental Proceedings, pages 989–999, 2024. (doi:10.1007/978-3-031-50349-8_85)
• Vasileios Fotopoulos. Atomistic modelling of defects and impurities in polycrystalline copper. PhD thesis, University College London, 2024.
• Fabian Froech, Sabine Kubicek, Werner Artner, Michael Nelhiebel, Silvia Larisegger, and Guenter Fafilek. A versatile electrochemical cell for in-situ GI-XRD measurements on lab-scale XRD devices. Journal of Electroanalytical Chemistry, 971:118591, October 2024. (doi:10.1016/j.jelechem.2024.118591)
• David Ken Gibbs, Silvia Larisegger, Michael Nelhiebel, Johannes Frank, and Andreas Limbeck. Studying the influence of UV radiation on the water uptake behavior of polymer films by LA-ICP-MS. In 2024 Winter Conference on Plasma Spectrochemistry (WCPS), Tucson, Arizona, January 2024.
• David Ken Gibbs, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. Quantification of deuterium in polymeric materials with LIBS. In 2024 Winter Conference on Plasma Spectrochemistry (WCPS), Tucson, Arizona, January 2024.
• David Ken Gibbs, Maximilian Podsednik, Patrick Tapler, Maximilian Weiss, Alexander Karl Opitz, Michael Nelhiebel, Charles Derrick Quarles Jr, Silvia Larisegger, and Andreas Limbeck. Improving spatial resolution by reinterpreting dosage for laser-induced breakdown spectroscopy imaging: Conceptualization and limitations. Chemical & Biomedical Imaging, Open Access, July 2024. (doi:10.1021/cbmi.4c00045)
• Tibor Grasser, Maximilian W. Feil, Katja Waschneck, Hans Reisinger, Judith Berens, Dominic Waldhör, Aleksandr Vasilev, Michael Waltl, Thomas Aichinger, Michel Bockstedte, Wolfgang Gustin, and Gregor Pobegen. A recombination-enhanced-defect-reaction-based model for the gate switching instability in SiC MOSFETs. In 2024 IEEE International Reliability Physics Symposium (IRPS). IEEE, April 2024. (doi:10.1109/irps48228.2024.10529465)
• Tibor Grasser, Maximilian W. Feil, Katja Waschneck, Hans Reisinger, Judith Berens, Dominic Waldhör, Aleksandr Vasilev, Michael Waltl, Thomas Aichinger, Michel Bockstedte, Wolfgang Gustin, and Gregor Pobegen. Gate switching instability in silicon carbide MOSFETs—part ii: Modeling. IEEE Transactions on Electron Devices, Early Access, 2024. (doi:10.1109/ted.2024.3397629)
• Jakob Hauser. Elektrische Charakterisierung des Ladungseinfangs in der Gate-Region von GaN High-Electron-Mobility Transistoren (HEMTs). Bachelor’s thesis, Graz University of Technology, 2024.
• Jessica Hautz, Andreas Klemmt, and Lars Mönch. Scheduling jobs on a single stress test machine in a reliability laboratory. In 2024 Winter Simulation Conference (WSC), pages 1797–1808. IEEE, December 2024. (doi:10.1109/wsc63780.2024.10838938)
• Alexander Huber. Mean-field-model development for void formation in SAC305-solder bumps. Master’s thesis, Montanuniversität Leoben, 2024.
• Ana Maria Jaramillo. Analysis of damage structures in microelectronics using computer vision. Master’s thesis, Carinthia University of Applied Sciences, 2024.
• Kevin Kapaj. Investigation of a high-power pulse test system to improve control strategies and the electrical performance for full-bridge inverter stress testing. Master’s thesis, Carinthia University of Applied Sciences, Villach, September 2024.
• Corinna Kofler and Isabell Dicillia-Kovatsch. The power of computer vision: enhancing manufacturing quality control by automated image classification. In WiDS Villach, Villach, AUT, April 2024.
• Corinna Kofler, Sabrina Strauß, Anja Zernig, Ernesto Lazaro Garcia, Michael Boxleitner, Beatrix Mayr, Isabell Dicillia-Kovatsch, and Claudia Anna Dohr. Carinthia dataset, February 2024. (doi:10.5281/zenodo.10715190)
• Corinna Kofler, Francisco López de la Rosa, Dominic Zarre, Gianluca Guglielmo, Claudia Anna Dohr, Judith Dohr, Anja Zernig, and Antonio Fernández-Caballero. Recent Advances in Microelectronics Reliability, chapter Automated Classification of Semiconductor Defect Density SEM Images Using Deep Learning, pages 99–116. Springer International Publishing, 2024. (doi:10.1007/978-3-031-59361-1_4)
• Christian Koller, Matthias Kasper, Boris Butej, Dominik Wieland, Borja Alberdi, Oliver Häberlen, and Clemens Ostermaier. Catalyzing innovation: Bridging system efficiency to fundamental device physics. In 2024 IEEE International Electron Devices Meeting (IEDM). IEEE, December 2024. (doi:10.1109/iedm50854.2024.10873485)
• Peter Kolter. Feasibility study for the estimation of the junction temperature for power cycling test setups. Master’s thesis, Carinthia University of Applied Sciences, 2024.
• René Lenz. Optimal control with radial force compensation for multiphase permanent magnet synchronous machines under multiple open-circuit faults. PhD thesis, Vienna University of Technology, 2024.
• Katharina Mairhofer, Silvia Larisegger, Annette Foelske, Markus Sauer, Gernot Friedbacher, and Günter Fafilek. New insights into the photoassisted anodic reactions of n-type 4H SiC semiconductors. Monatshefte für Chemie – Chemical Monthly, Open Access, May 2024. (doi:10.1007/s00706-024-03212-5)
• Maximilian Moser, Gregor Pobegen, Michael Nelhiebel, Iwona Jozwik, and Jürgen Smoliner. Using in-situ nanoprobing in the scanning electron microscope to visualize the local potential on a biased SiC p-n junction. In International Conference on Silicon Carbide and related Materials, Raleigh, North Carolina, USA, September 2024.
• Sebastian Moser, Michael Reisinger, Tobias Ziegelwanger, Michael Nelhiebel, Jozef Keckes, and Megan J. Cordill. Study of thermo-mechanical fatigue of metallizations using correlative in-situ methodologies. In Nanomechanical Testing in Materials Research and Development IX, Giardini Naxos, Italy, October 2024.
• Laura Neumann, Andre Clausner, Michael Reisinger, Cedric Corley-Wiciak, Can Yildrim, and Carsten Detlefs. Nanoscale examination of degradation in copper metallization layers using lab-based nanotxm and dfxm. In 16^th International Conference on X-Ray Microscopy, 2024.
• Sara Morgante Piano. Disjunctive graph heuristics for semiconductor scheduling applications. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2024.
• Maximilian Podsednik, Birgit Achleitner, Jakob Willner, Ahmed Bahr, Helmut Riedl, Paul Mayrhofer, Tobias Huber, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. Application of an in-situ LIBS heating stage for material characterization. In 2024 Winter Conference on Plasma Spectrochemistry (WCPS), Tucson, Arizona, January 2024.
• Maximilian Podsednik, David Ken Gibbs, Maximilian Weiss, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. The impact of dosage on the image quality of laser-induced breakdown spectroscopy. In 2024 Winter Conference on Plasma Spectrochemistry (WCPS), Tucson, Arizona, January 2024.
• Maximilian Podsednik, Maximilian Weiss, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. The next advancement in online-laser ablation of solids in liquids (LASIL) cell design: the stethoscope cell. In 2024 Winter Conference on Plasma Spectrochemistry (WCPS), Tucson, Arizona, January 2024.
• Maximilian Podsednik, Florian Fahrnberger, David Ken Gibbs, Birgit Achleitner, Silvia Larisegger, Michael Nelhiebel, Herbert Hutter, and Andreas Limbeck. Quantitative depth profile analysis using short single pulse responses in LA-ICP-Q-MS experiments. Journal of Analytical Atomic Spectrometry, Accepted, 2024. (doi:10.1039/D4JA00082J)
• Michael Reisinger, Laura Neumann, Tobias Ziegelwanger, Sebastian Moser, Kristina Kutukova, Bartlomjej Lechowski, Jozef Keckes, and Ehrenfried Zschech. Understanding the Damage and Microstructural Evolution in Cu Metallizations during Thermo-mechanical Fatigue. In FCMN – Frontiers of Characterization and Metrology for Nanoelectronics, Monterey, CA USA, April 2024.
• Bernhard Ruch, Valeria Padovan, Dionyz Pogany, Clemens Ostermaier, Boris Butej, Christian Koller, and Michael Waltl. Influence of Hole Injection on Associated Recovery Phenomena in GaN-Based GITs Subjected to Hot Electron Trapping. Proceedings of the 2024 Austrochip Workshop on Microelectronics, Accepted, October 2024. (doi:10.1109/Austrochip62761.2024.10716239)
• Ze F. Scales, Christian Koller, Liverios Lymperakis, Michael Nelhiebel, and Michael Stoeger-Pollach. The role of carbon segregation in the electrical activity of dislocations in carbon doped GaN. Journal of Applied Physics, 136(4), July 2024. (doi:10.1063/5.0213275)
• Gerald Schaffar, Daniel Tscharnuter, Peter Imrich, and Verena Maier-Kiener. The plasticity of silicon at high temperatures and small length scales. In ECI, Messina, October 2024.
• Gerald J.K. Schaffar, Daniel Tscharnuter, Peter J. Imrich, and Verena MaierKiener. Extracting high-temperature stress-strain curves from a 1.2 µm silicon film using spherical nanoindentation. Thin Solid Films, In Press:140597, December 2024. (doi:10.1016/j.tsf.2024.140597)
• Michael Scheiber. On the use of AI to identify issues during wafer test. In European IS-Test Workshop (ITWS), Munich, Germany, September 2024.
• Niahm Smith, Judith Berens, Gregor Pobegen, Tibor Grasser, and Alexander Shluger. Al-O-Al defect complexes as possible candidates for channel electron mobility reducing trapping centers in 4H-SiC metal-oxide-semiconductor field-effect transistors. Journal of Applied Physics, 136(8), August 2024. (doi:10.1063/5.0213528)
• Michael Georg Stadt, Silvia Larisegger, Michael Nelhiebel, and Günter Fafilek. Identification of electrochemically formed metal oxides by coupling high-temperature cyclic voltammetry with Raman spectroscopy. Journal of Electroanalytical Chemistry, In Press:118373, May 2024. (doi:10.1016/j.jelechem.2024.118373)
• Michael Georg Stadt, Silvia Larisegger, Michael Nelhiebel, and Günter Fafilek. In-situ impedance spectroscopy on copper oxide scales under potential controlled oxidation at high temperatures. Electrochimica Acta, 497:144572, September 2024. (doi:10.1016/j.electacta.2024.144572)
• Daniel Tscharnuter. App for the thermal simulation of power electronics test devices. In COMSOL European Conference, Firenze, October 2024.
• Michael Verissimo. Design of a sensor fusion network to extend the control of a reliability test system. Master’s thesis, Budapest University of Technology and Economics, 2024.
• Tong Vivian, Manuel Petersmann, and Vedad Babic. New mtex tools: Trueebsd distortion correction and grain boundary smoothing – case study 1: voids in copper. In MTEX workshop, TUB Freiberg, March 2024.
• Andreas Vratanar. Correlation between microstructure and lifetime of metallic materials in semiconductor application. Master’s thesis, Montanuniversität Leoben, 2024.
• Magdalena Weger, Michel Bockstedte, and Gregor Pobegen. Emission of trapped electrons from the 4H-SiC/SiO_2-interface via photon-irradiance at cryogenic temperatures. Defect and Diffusion Forum, 434:61–66, August 2024. (doi:10.4028/p-f0soli)
• Magdalena Weger, Johannes Kuegler, Michael Nelhiebel, Maximilian Moser, Michel Bockstedte, and Gregor Pobegen. Photon-assisted electron depopulation of 4h-sic/sio2 interface states in n-channel 4h-sic metal-oxide-semiconductor field effect transistors. Journal of Applied Physics, 136:034502, 2024. (doi:10.1063/5.0203724)
• Magdalena Weger. Opto-Electrical Methods to Characterize Charge Carrier Accumulations in SiC MOSFETs. PhD thesis, Johannes Kepler University Linz, 2024.
• Jakob Willner, Lukas Brunnbauer, Lars Varain, Patrick Knaack, Michael Nelhiebel, Silvia Larisegger, Günter Fafilek, and Andreas Limbeck. Examining differences in the uptake of corrosive gases in polymer films and its dependence on temperature and relative humidity using a novel procedure combining sample weathering and LA-ICP-MS analysis. Polymer Degradation and Stability, 225:110792, July 2024. (doi:10.1016/j.polymdegradstab.2024.110792)
• Jakob Willner. Tools for the assessment of polymer film degradation in harsh corrosive environments: Development of a weathering setup and LA-ICP-MS & LIBS methods for advanced chemical characterization. PhD thesis, TU Wien, 2024.
• Tobias Ziegelwanger, Michael Reisinger, Kostya Hlushko, Steven Petegem, Michael Meindlhumer, Juraj Todt, and Jozef Keckes. Thermomechanical fatigue of Cu thin films at high strain rates characterized by 20 kHz X-ray diffraction_02. In European Conference on Residual Stresses, Altaussee, Austria, February 2024.
• Tobias Ziegelwanger, Michael Reisinger, Kostya Hlushko, Steven Petegem, Raquel Rodriguez Lamas, Michael Meindlhumer, Juraj Todt, Can Yildirim, and Jozef Keckes. Thermomechanical fatigue of Cu thin films at high strain rates characterized by 20 kHz X-ray diffraction. In NESY Winterschool, Prag, Czech Republic, May 2024.
• Tobias Ziegelwanger, Michael Reisinger, Kurt Matoy, Asma Aicha Medjahed, Jakub Zálešák, Manuel Gruber, Michael Meindlhumer, and Jozef F. Keckes. Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si. Materials Science in Semiconductor Processing, 181:108579, October 2024. (doi:10.1016/j.mssp.2024.108579)

2023 ▾

• Birgit Achleitner, Maximilian Podsednik, Jakob Willner, Silvia Larisegger, Michael Nelhiebel, Tobias Huber, Patrick Knaack, and Andreas Limbeck. In-situ study of temperature related changes in polymers using LIBS. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Birgit Achleitner, Lars Varain, Michael Nelhiebel, Guenter Fafilek, Silvia Larisegger, and Andreas Limbeck. A 3D approach to visualize ion diffusion in polymers using LA-ICP-MS and LIBS. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Birgit Achleitner, Lars Varain, Michael Nelhiebel, Günter Fafilek, Silvia Larisegger, and Andreas Limbeck. Determination of chlorine migration in polymers using LIBS. In 12^th Euro-Mediterranean Symposium on Laser-induced Breakdown Spectroscopy (EMSLIBS), Porto, Portugal, September 2023.
• Birgit Achleitner, Jakob Willner, Maximilian Podsednik, Silvia Larisegger, Michael Nelhiebel, Tobias Huber, Patrick Knaack, and Andreas Limbeck. In-situ LIBS study of temperature induced processes in material analysis. In 12^th Euro-Mediterranean Symposium on Laser-induced Breakdown Spectroscopy (EMSLIBS), Porto, Portugal, September 2023.
• Birgit Achleitner, Maximilian Podsednik, Jakob Willner, Silvia Larisegger, Michael Nelhiebel, Tobias Huber, Patrick Knaack, and Andreas Limbeck. In-situ investigation of the thermal behaviour of polymers using laser induced breakdown spectroscopy. In ANAKON 2023, 2023.
• Dženana Alagić and Jürgen Pilz. Microstructure image segmentation using patch-based clustering approach. In Contributions to Statistics, pages 223–235. Springer International Publishing, 2023. (doi:10.1007/978-3-031-40055-1_12)
• Dibakar Bala, Alexander Ulbing, and Shivam Pathak. Advantages of system level testing and modelling for automotive smart power switches. In 2023 International Conference on Electrical Drives and Power Electronics (EDPE), High Tatras, Slovakia, September 2023.
• Manar Barahmeh. Ontology development for cross-sectional nanoindentation: Enhancing data integration and knowledge representation in materials science. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2023.
• Lena Bergmann, Bianca Kurz, Gregor Pobegen, Daniel Schlögl, Holger Schulze, Heiko B. Weber, and Michael Krieger. Annealing behavior of Pt and PtH defects in fully process 1.2kV Si diodes covering the whole substrate thickness. In ISPS’23 Proceedings, ISPS, pages 94–99. Czech Technical University in Prague, 2023. (doi:10.14311/isps.2023.016)
• Sebastian Bichelmaier, Jesús Carrete, and Georg K. H. Madsen. Evaluating the efficiency of power-series expansions as model potentials for finite-temperature atomistic calculations. International Journal of Quantum Chemistry, Early View, February 2023. (doi:10.1002/qua.27095)
• Sebastian Bichelmaier, Jesús Carrete, Ralf Wanzenböck, Florian Buchner, and Georg K. H. Madsen. Neural-network-backed effective harmonic potential study of the ambient pressure phases of hafnia. Physical Review B, 107(18), May 2023. (doi:10.1103/physrevb.107.184111)
• Sebastian Bichelmaier. Ab-Initio Modelling of Material Properties Using Elements of Artificial Intelligence. PhD thesis, TU Wien, March 2023. (doi:10.34726/hss.2023.90200)
• Lukas Brunnbauer, Jakob Willner, Guenter Fafilek, Silvia Larisegger, and Andreas Limbeck. Characterization of the corrosion behavior of copper in sulfur-containing environments using LA-ICP-MS and LIBS. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Lukas Brunnbauer, Veronika Zeller, Zuzana Gajarska, Silvia Larisegger, Stefan Schwab, Hans Lohninger, and Andreas Limbeck. Classification of epoxy molding compounds by tandem LA-ICP-MS/LIBS to enhance the reliability of electronic devices. Spectrochimica Acta Part B: Atomic Spectroscopy, 207:106739, September 2023. (doi:10.1016/j.sab.2023.106739)
• Elias Bumbaris. Polymides – Non-classical synthesis and comprehensive correlation of material properties with chemical structure. PhD thesis, TU Wien, 2023. (doi:10.34726/hss.2023.92323)
• Boris Butej, Christian Koller, Dominik Wieland, Gregor Pobegen, Dionyz Pogany, and Clemens Ostermaier. Role of lateral hole transport and evacuation in dRDS,on during OFF-state stress in p-GaN gate HEMTs. In ICNS 14: International Conference on Nitride Semiconductors, Fukuoka, Japan, November 2023.
• Alessandro Casotto. Control concepts of a load emulation module for testing fully integrated bridge circuits. Master’s thesis, Politecnico di Torino, 2023.
• Zaid Dabash. Development and evaluation of a reliability stress test system for multiphase point of load converters. Master’s thesis, Carinthia University of Applied Sciences, 2023.
• Luiza Dobre, Adrian Bojita, Marius Purcar, Daniel Tscharnuter, and Manuel Petersmann. Study on non-conformal mesh approach applied on layered microelectronic structure. In 2023 10^th International Conference on Modern Power Systems (MPS), 2023. (doi:10.1109/MPS58874.2023.10187503)
• Diana Farthofer. Porenbildung bei thermo-mechanischer ermüdung von polykristallinen kupferschichten. In 57. Metallographie-Tagung, Leoben, Österreich, September 2023.
• Diana Farthofer. Untersuchung der Porenverteilung in Kupferschichten bei thermo-mechanischer Ermüdung. Bachelor’s thesis, FH Kärnten, 2023.
• Bettina Findenig. Productive implementation and validation of a high-power pulse test system. Master’s thesis, Carinthia University of Applied Sciences, 2023.
• Wolfgang Flachberger and Manuel Petersmann. Numerical simulation of thermomechanical material behavior and damage in lead-free solders. In GAMM 2023: S07: Coupled problems & Fenics user conference 2023, 2023.
• Wolfgang Flachberger, Jiri Svoboda, Thomas Antretter, Manuel Petersmann, and Silvia Leitner. Numerical treatment of reactive diffusion using the discontinuous galerkin method. Continuum Mechanics and Thermodynamics, Open access, 2023. (doi:10.1007/s00161-023-01258-0)
• Mohamed Ghoneim. Modelling degradation of semiconductor devices for lifetime prediction based on stress test data. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2023.
• David Gibbs, Lukas Brunnbauer, Jakob Willner, Silvia Larisegger, and Andreas Limbeck. Investigating the corrosion of copper in H2S containing atmosphere using LIBS. In NAWLA 2023, 2023.
• Matthias Grabner. Void-microstructure correlation in thin film copper power semiconductor metallization using MTEX. Master’s thesis, Graz University of Technology, 2023.
• Gianluca Guglielmo. Open-set recognition to detect novelties in defect density sem images. Master’s thesis, Università degli Studi di Trieste, 2023.
• Moritz Hartleb, Peter Imrich, Johannes Zechner, Thomas Walter, and Golta Khatibi. Cross-sectional nanoindentation: Applicability for testing polyimide adhesion in semiconductor components. In 2023 46^th International Spring Seminar on Electronics Technology (ISSE). IEEE, May 2023. (doi:10.1109/isse57496.2023.10168521)
• Jessica Hautz. Standardization of semiconductor scheduling applications. Bachelor’s thesis, Alpen-Adria-Universität Klagenfurt, 2023.
• Wieland Heyn. Micromechanical studies of interface properties in on-chip interconnect structures. PhD thesis, Technische Universität Dresden, August 2023.
• Kostya Hlushko, Tobias Ziegelwanger, Michael Reisinger, Juraj Todt, Michael Meindlhumer, Susanne Beuer, Mathias Rommel, Imke Greving, Silja Flenner, Jaromir Kopecek, Jozef Keckes, Carsten Detlefs, and Can Yildirim. Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding. Acta Materialia, 253:118961, April 2023. (doi:10.1016/j.actamat.2023.118961)
• Paul Hoffmann. Thermo-mechanical induced fatigue damage in thin metal films: simulation, comparison to experiments and fatigue damage parameter calibration. PhD thesis, TU Wien, 2023.
• Jasmin Hämmerle. Parameter estimation and uncertainty quantification of the three parameter Weibull distribution in the context of the Castillo-Canteli fatigue lifetime model including runouts. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2023.
• Curran Kalha, Pardeep K. Thakur, Tien-Lin Lee, Michael Reisinger, Johannes Zechner, Michael Nelhiebel, and Anna Regoutz. Capturing the dynamics of Ti diffusion across Ti_xw_1-x/Cu heterostructures using x-ray photoelectron spectroscopy. Advanced Physics Research, 2(12), May 2023. (doi:10.1002/apxr.202300008)
• Bianca Kurz. Annealing behavior of platinum and platinum-hydrogen defects in silicon high voltage diodes. Bachelor’s thesis, TU Wien, 2023.
• Katharina Mairhofer, Silvia Larisegger, and Günter Fafilek. Clarification of the reaction mechanism of the photoassisted anodic oxidation of SiC in a newly developed inverted rotating disk electrode cell setup. In 243^rd ECS Meeting, 2023.
• Katharina Mairhofer. Photoassisted Anodic Reactions of n–type 4H–SiC Semiconductors in Alkaline Solutions. PhD thesis, TU Wien, 2023.
• Juraj Marek, Gregor Pobegen, and Ulrike Grossner, editors. International Conference on Silicon Carbide and Related Materials ICSCRM 2022. Trans Tech Publications Ltd, June 2023. (doi:10.4028/b-6b8z99)
• Andrea Matteazzi. Error cause analysis of laboratory results with the help of ai. Master’s thesis, Universita Degli Studi di Parma, 2023.
• Maximilian Moser, Gregor Pobegen, and Jürgen Smoliner. Quantification of secondary electron doping contrast in the scanning electron microscope on 4h-SiC. Materials Science Forum, 1089:23–29, May 2023. (doi:10.4028/p-ike7kj)
• Sebastian Moser, Diana Farthofer, Michael Reisinger, and Peter J. Imrich. Study of pore formation in copper films due to thermo-mechanical fatigue. In 93^rd IUVSTA Workshop: International Union for Vacuum Science, Technique and Applications, Seggau, Austria, October 2023.
• Domenico Pagliaro, Martin Pleschberger, Olivia Pfeiler, Thomas Freislich, and Konstantin Schekotihin. Working time prediction and workflow mining at failure analysis. In ISTFA 2023 – 49^th Interanational Symposium for Testing and Failure Analysis Conference. ASM International, 2023. (doi:10.31399/asm.cp.istfa2023p0121)
• Shivam Pathak. HYDRA : A modular system level power distribution test bench. Master’s thesis, Carinthia University of Applied Sciences, 2023.
• Manuel Petersmann, Lennart Hucht, Matthias Grabner, Peter Imrich, Michael Reisinger, Werner Robl, and Charlotte Chui. Use cases of mtex in semiconductor industry. In MTEX workshop Freiberg, 2023.
• Maximilian Podsednik, Birgit Achleitner, Jakob Willner, Silvia Larisegger, Michael Nelhiebel, Tobias Huber, and Andreas Limbeck. Time-resolved investigation of copper scaling at different temperatures by in-situ LIBS measurements. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Maximilian Podsednik, Silvia Larisegger, Michael Nelhiebel, Ahmed Bahr, Helmut Riedl, Paul Heinz Mayrhofer, and Andreas Limbeck. Depth-resolved analysis of technologically relevant materials by simultaneous LA-ICP-MS & LIBS measurements. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Maximilian Podsednik, Maximilian Weiss, Silvia Larisegger, Johannes Frank, Gregor Pobegen, Michael Nelhiebel, and Andreas Limbeck. Quantitative analysis of trace elements in technological materials using online-laser ablation of solids in liquids (online-LASIL). Spectrochimica Acta Part B: Atomic Spectroscopy, 205:106705, July 2023. (doi:10.1016/j.sab.2023.106705)
• Maximilian Podsednik, Ahmed Bahr, Helmut Riedl, Paul Mayrhofer, Tobias Huber, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. In-situ LIBS measurements: characterization of the oxidation and diffusion behavior of technologically relevant materials at operating conditions. In Conference on Applied Surface and Solid Material Analysis AOFKA 2023, Zurich, Switzerland, September 2023.
• Maximilian Podsednik, Maximilian Weiss, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. Improved online-laser ablation of solids in liquids (LASIL) cell design: the stethoscope cell. In Conference on Applied Surface and Solid Material Analysis AOFKA 2023, Zurich, Switzerland, September 2023.
• Maximilian Podsednik, Birgit Achleitner, Jakob Willner, Silvia Larisegger, Michael Nelhiebel, Tobias Huber, and Andreas Limbeck. Time-resolved analysis of copper scaling by in-situ LIBS measurements at elevated temperatures in different oxygen partial pressures. In ANAKON 2023, 2023.
• Tim Rainer. Data conversion and anomaly detection. HTL Diploma thesis, HTBLVA Villach, 2023.
• Fabian Rasinger. Electrical Characterization of Point Defects in 4H Silicon Carbide Power Devices. PhD thesis, University of Erlangen-Nuremberg, 2023.
• Michael Reisinger, Sebastian Moser, Manuel Kleinbichler, Tobias Ziegelwanger, Kostya Hlushko, and Jozef Keckes. Characterization of the thermo-mechanical behavior of cu metallizations in microelectronic applications. In IRSP 2023, Bad Schandau, Germany, April 2023.
• Philipp Rosenauer, Christoph Kratzer, Silvia Larisegger, and Stefan Radl. Extraction of mechanical parameters via MD simulation: Application to polyimides. In EMMC 2023, 2023.
• Philipp Rosenauer, Silvia Larisegger, Michael Nelhiebel, and Stefan Radl. Innovative polymer design with molecular dynamics simulations to improve the corrosion protective properties. In 7^th International Symposium Frontiers in Polymer Science, 2023.
• Ze Scales, Christian Koller, Stephan Schoemann, Michael Nelhiebel, Michael Reisinger, Jorg Jatzkowski, Patrick Diehle, and Michael Stoeger-Pollach. Identifying electrically active dislocations in GaN and the challenge of cross-correlative physical characterization. In STFA 2023: 49^th International Symposium for Testing and Failure Analysis, Phoenix, Arizona, USA, November 2023.
• Gerald Josef Kamillo Schaffar, Daniel Tscharnuter, and Verena Maier-Kiener. Characterizing pressure-induced phase transformations during unloading using CSM – a study on silicon. In Nanoindenter User Meeting Europe, Darmstadt, Germany, March 2023.
• Gerald Josef Kamillo Schaffar, Daniel Tscharnuter, and Verena Maier-Kiener. Extracting high-temperature stress-strain curves and assessing transformation pressures: The spherical indentation of silicon. In 49^th International Conference on Metallurgical Coatings & Thin Films, San Diego, CA, USA, May 2023.
• Gerald Josef Kamillo Schaffar, Daniel Tscharnuter, and Verena Maier–Kiener. Exploring the high-temperature deformation behavior of monocrystalline silicon – an advanced nanoindentation study. Materials & Design, 233:112198, September 2023. (doi:10.1016/j.matdes.2023.112198)
• Markus Sievers. Robust Multi-Channel Application Stress Concepts for SiC MOSFET Technologies. PhD thesis, Graz University of Technology, 2023.
• Rahulkumar Jagdishbhai Sinojiya, Priya Paulachan, Fereshteh Falah Chamasemani, Rishi Bodlos, René Hammer, Jakub Zálešák, Michael Reisinger, Daniel Scheiber, Jozef Keckes, Lorenz Romaner, and Roland Brunner. Probing the composition dependence of residual stress distribution in tungsten-titanium nanocrystalline thin films. Communication Materials, 4(1), 2023. (doi:10.1038/s43246-023-00339-6)
• Elio Skënderaj. Automated FEM model generation for the simulation of microheaters. Master’s thesis, TU Wien, 2023. (doi:10.34726/hss.2023.111425)
• Niamh Smith, Magdalena Weger, Gregor Pobegen, and Alexander L Shluger. P-type impurities in 4H-SiC calculated using density functional theory. In Defect and Diffusion Forum, volume 426, pages 35–42. Trans Tech Publ, 2023.
• Michael Georg Stadt, Michael Nelhiebel, Silvia Larisegger, and Günter Fafilek. In-situ Raman spectroscopy of defined oxide layers in an electrochemical solid-state setup. In 10^th International Conference on Advanced Applied Raman Spectroscopy (RamanFest2023), Paris, France, November 2023.
• Michael Georg Stadt, Michael Nelhiebel, Silvia Larisegger, and Günter Fafilek. In-situ raman spectroscopy of defined copper oxide surfaces formed by electrochemically controlled high-temperature oxidation. In 243^rd ECS Meeting, 2023.
• Sabina Sušnik, Gregor Pobegen, and Tibor Grasser. Hot-carrier-degradation measured with charge-pumping in trench devices despite deep contacts. In IIRW 2023: IEEE International Integrated Reliability Workshop, Fallen Leaf Lake, CA, USA, October 2023.
• Marcello Tettamanti, Albino Pidutti, Paolo Del Croce, and Andrea Baschirotto. An asynchronous constant T_OFF, 10 A, buck converter with peak current mode control for automotive applications. In 18^th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), Valencia, Spain, June 2023.
• Daniel Tscharnuter. Signal-based meta-modelling of temperature in short-circuit testing of power semiconductors. In WOST 2023, Weimar, June 2023.
• Alexander Ulbing, Andreas Warmuth, and Markus Sievers. Flexible load emulation using a rapid control prototyping system and power electronics for automotive power IC reliability investigations. In 25^th European Conference on Power Electronics and Applications (EPE), Aalborg, Denmark, September 2023.
• Marike van Orden. Electro-optical characterization of point defects in Si, SiC and GaN devices. Master’s thesis, Graz University of Technology, 2023.
• Lars Varain, Silvia Larisegger, Michael Nelhiebel, and Günter Fafilek. Investigation of hydroxide formation and resulting degradation at the polymer-metal interface in advanced DS cells. In 24^th International Conference on Advanced Batteries, Accumulators, Fuel Cells and Special Electrochemical Technologies (ABAF), Brno, Czech Republic, August 2023.
• Lars Varain, Silvia Larisegger, Michael Nelhiebel, and Günter Fafilek. Simultaneous measurement and ODE-modeling of ion- and water permeability through ion exchange membranes. Journal of Membrane Science, 684:121847, October 2023. (doi:10.1016/j.memsci.2023.121847)
• Aleksandr Vasilev, Maximilian Wolfgang Feil, Christian Schleich, Bernhard Stampfer, Gerhard Rzepa, Gregor Pobegen, Tibor Grasser, and Michael Waltl. Oxide and interface defect analysis of lateral 4h-SiC MOSFETs through CV characterization and TCAD simulations. Materials Science Forum, 1090:119–126, May 2023. (doi:10.4028/p-k93y93)
• Andreas Warmuth, Alexander Ulbing, and Markus Sievers. Mission profile parameter extraction for automotive body power devices with rapid control prototyping systems. In 2023 International Conference on Electrical Drives and Power Electronics (EDPE), High Tatras, Slovakia, September 2023.
• Magdalena Weger, Dominik Biermeier, Maximilian Wolfgang Feil, Jonathon Cottom, Michel Bockstedte, and Gregor Pobegen. Electroluminescence spectra of a gate switched MOSFET at cryogenic and room temperatures agree with ab initio calculations of 4H-SiC/SiO2-interface defects. Materials Science Forum, 1091:15–23, June 2023. (doi:10.4028/p-050q7w)
• Magdalena Weger, Maximilian Wolfgang Feil, Marike Van Orden, Jonathon Cottom, Michel Bockstedte, and Gregor Pobegen. Temperature-dependent electroluminescence of a gate pulsed silicon carbide metal textendash oxide textendash semiconductor field-effect transistor: Insight into interface traps. Journal of Applied Physics, 134(3), July 2023. (doi:10.1063/5.0152337)
• Dominik Wieland, Sybille Ofner, Manuel Stabentheiner, Boris Butej, Christian Koller, Jinming Sun, Andrea Minetto, Korbinian Reiser, Oliver Häberlen, Michael Nelhiebel, Michael Glavanovics, Dionz Pogany, and Clemens Ostermaier. A common hard-failure mechanism in GaN HEMTs in accelerated switching and single-pulse short-circuit tests. In 2023 IEEE International Reliability Physics Symposium (IRPS). IEEE, March 2023. (doi:10.1109/irps48203.2023.10117943)
• Melanie Willfurth. Filter design for a wide bandgap stress test system. Master’s thesis, Graz University of Technology, 2023.
• Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, and Andreas Limbeck. A versatile approach for the preparation of matrix-matched standards for LA-ICP-MS analysis textendash standard addition by the spraying of liquid standards. Talanta, 256:124305, January 2023. (doi:10.1016/j.talanta.2023.124305)
• Jakob Willner, Maximilian Podsednik, Birgit Achleitner, Tobias Huber, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Implementation of a new heating stage for in-situ LIBS analysis of temperature induced processes. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Investigation of metal diffusion into polymer films by measurement of quantitative LA-ICP-MS depth profiles. In European Winter Conference on Plasma Spectrochemistry (EWCPS), Ljubljana, Slovenia, January 2023.
• Jakob Willner, Lukas Brunnbauer, C. Derrick Quarles, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Development of a simultaneous LA-ICP-MS & LIBS method for the investigation of polymer degradation. Journal of Analytical Atomic Spectrometry, Open Access, 2023. (doi:10.1039/d3ja00237c)
• Dominic Zarre. Identification and analysis of weak-performing subsets to enhance data-centric model development. Master’s thesis, Carinthia University of Applied Sciences, 2023.
• Tobias Ziegelwanger, Michael Reisinger, Kurt Matoy, Juraj Todt, Michael Meindlhumer, and Jozef Keckes. Local gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing. In IRSP 2023, Bad Schandau, Germany, April 2023.

2022 ▾

• Birgit Achleitner, Silvia Larisegger, Michael Nelhiebel, Patrick Knaack, and Andreas Limbeck. Investigation of the imidization degree of polyimides using laser induced breakdown spectroscopy (LIBS). In European Workshop on Laser Ablation (EWLA 2022), Bern, Switzerland, July 2022.
• Birgit Achleitner, Lars Varain, Michael Nelhiebel, Günter Fafilek, Silvia Larisegger, and Andreas Limbeck. Determination of ion diffusion in polyimides using LA-ICP-MS. In European Workshop on Laser Ablation (EWLA 2022), Bern, Switzerland, July 2022.
• Birgit Achleitner, Silvia Larisegger, Michael Nelhiebel, Patrick Knaack, and Andreas Limbeck. Realisation of a libs method to determine the degree of imidization of polyimides. In European Symposium on Analytical Spectrometry, Brno, Czech Republic, September 2022.
• Birgit Achleitner, Silvia Larisegger, Michael Nelhiebel, Patrick Knaack, and Andreas Limbeck. Investigation of high-performance polymer degradation using laser induced breakdown spectroscopy (LIBS). In Colloquium Spectroscopicum Internationale XLII (CSI XLII), 2022.
• Dženana Alagić and Olivia Pfeiler. Computer vision approach for automatic measurements of sem images. In ITG Tagung: Fehlermechanismen bei kleinen Geometrien, May 2022.
• Dibakar Bala. System modelling of SMART switches in various power distribution topologies. Master’s thesis, University of Applied Sciences Darmstadt, 2022.
• Judith Berens, Manesh V. Mistry, Dominic Waldhör, Alexander Shluger, Gregor Pobegen, and Tibor Grasser. Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs. Microelectronics Reliability, 139:114789, December 2022. (doi:10.1016/j.microrel.2022.114789)
• Lena Bergmann, Gregor Pobegen, Daniel Schlogl, Holger Schulze, Heiko B. Weber, and Michael Krieger. Measurement of the PtH defect depth profiles in fully processed silicon high-voltage diodes by improved current transient spectroscopy. In 2022 IEEE 34^th International Symposium on Power Semiconductor Devices and ICs (ISPSD). IEEE, May 2022. (doi:10.1109/ispsd49238.2022.9813648)
• Sebastian Bichelmaier, Jesús Carrete, Michael Nelhiebel, and Georg K. H. Madsen. Accurate first-principles treatment of the high-temperature cubic phase of hafnia. physica status solidi (RRL) textendash Rapid Research Letters, Early View, June 2022. (doi:10.1002/pssr.202100642)
• Dominik Biermeier. Spectral analysis of defects in a SiC trench power MOSFET by electrical excitation. Master’s thesis, Johannes Kepler University Linz, August 2022.
• Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Investigating the corrosion behaviour of copper in sulphur containing atmospheres. In Colloquium Spectroscopicum Internationale XLII (CSI XLII), 2022.
• Lukas Brunnbauer, Veronika Zeller, Hans Lohninger, Stefan Schwab, Silvia Larisegger, and Andreas Limbeck. Enhancing the reliability of electronic devices: classification of encapsulation materials using tandem LIBS/LA-ICP-MS. In Colloquium Spectroscopicum Internationale XLII (CSI XLII), 2022.
• Boris Butej, Valeria Padovan, Dionyz Pogany, Gregor Pobegen, Clemens Ostermaier, and Christian Koller. Method to distinguish between buffer and surface trapping in stressed normally-ON GaN GITs using the gate-voltage dependence of recovery time constants. IEEE Transactions on Electron Devices, 69(6):3087–3093, June 2022. (doi:10.1109/TED.2022.3170293)
• Nikolaus Czepl, Dominik Zupan, and Daniel Kircher. Comparison of simulation and measurement of emi-induced offset voltages occuring at folded cascode operational amplifiers. In Austrochip Workshop on Microelectronics, Villach, Austria, October 2022.
• Patrick Damme, Marius Birkenbach, Constantinos Bitsakos, Matthias Boehm, Philippe Bonnet, Florina Ciorba, Mark Dokter, Pawel Dowgiallo, Ahmed Eleliemy, Christian Faerber, Georgios Goumas, Dirk Habich, Niclas Hedam, Marlies Hofer, Wenjun Huang, Kevin Innerebner, Vasileios Karakostas, Roman Kern, Tomaž Kosar, Alexander Krause, Daniel Krems, Andreas Laber, Wolfgang Lehner, Eric Mier, Marcus Paradies, Bernhard Peischl, Gabrielle Poerwawinata, Stratos Psomadakis, Tilmann Rabl, Piotr Ratuszniak, Pedro Silva, Nikolai Skuppin, Andreas Starzacher, Benjamin Steinwender, Ilin Tolovski, Pınar Tözün, Wojciech Ulatowski, Yuanyuan Wang, Izajasz Wrosz, Aleš Zamuda, Ce Zhang, and Xiao Xiang Zhu. DAPHNE: An open and extensible system infrastructure for integrated data analysis pipelines. In 12^th Annual Conference on Innovative Data Systems Research (CIDR 2022), Chaminade, US, January 2022.
• Sergio De Gasperi. Integrated health condition monitoring for power MOSFETs. PhD thesis, Universita degli Studi di Milano-Bicocca, 2022.
• Bernd Deutschmann and Daniel Kircher. Functional safety risks of smart power devices due to emi. In EMV Kongress 2022. Apprimus, July 2022. (doi:10.15488/12553)
• Mattia D’Urso. Predictive maintenance of semiconductor testing equipment using deep learning approaches. Master’s thesis, University of Udine, 2022.
• Stefanie Fasching and Sarah Moser. Monitoring dashboard for RPT-MOPS-systems. HTL Diploma thesis, HTBLVA Villach, Villach, March 2022.
• Bettina Findenig, Markus Sievers, Ingo Voss, and Thomas Aichinger. Robustness of sic mosfets under repetitive high current pulses. In Proceedings of the 2022 ICSCRM, 2022.
• Christoph Habernig. Development and evaluation of a generalized communication & control concept for a modular power distribution network. Master’s thesis, Carinthia University of Applied Sciences, September 2022.
• Moritz Hartleb, Thomas Walter, Johannes Zechner, Peter Imrich, and Golta Khatibi. Cross-sectional nanoindentation: investigation of polymer adhesion. In ECI Nanomechanical Testing in Materials Research and Development VIII, October 2022.
• Jessica Hautz. Real time scheduler: A feasibility study on automated optimization routines. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2022.
• Lennart Hucht. Correlation of pore formation and microstructural characteristics by linking SEM and EBSD data – application to the Cu metallization of power devices. Master’s thesis, Universität Duisburg-Essen, 2022.
• Laurenz Hundgeburth. On the process integrity and robustness of deep contrastive models for pattern recognition in analog semiconductor wafer test data. Master’s thesis, Johannes Kepler University, Linz, 2022.
• Klaus Hörmaier, Hubert Zangl, Daniel Kircher, and Bernd Deutschmann. A fault tree approach focusing on electromagnetic interference. In 13^th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Bruges, Belgium, March 2022.
• Hana T.T. Jebril, Martin Pleschberger, and Gian Antonio Susto. An autoencoder-based approach for fault detection in multi-stage manufacturing: a sputter deposition and rapid thermal processing case study. IEEE Transactions on Semiconductor Manufacturing, 35(2), 2022. (doi:10.1109/TSM.2022.3146988)
• Alphons Joseph. Development of a lithography process for a micromechanical sample. Master’s thesis, Hochschule München, 2022.
• Curran Kalha, Michael Reisinger, Pardeep Kumar Thakur, Tien-Lin Lee, Sriram Venkatesan, Mark Isaacs, Robert G. Palgrave, Johannes Zechner, Michael Nelhiebel, and Anna Regoutz. Evaluation of the thermal stability of TiW/Cu heterojunctions using a combined SXPS and HAXPES approach. Journal of Applied Physics, 131(16):165301, April 2022. (doi:10.1063/5.0086009)
• Daniel Kircher, Bernd Deutschmann, and Nikolaus Czepl. Influence of radio frequency interference on the electromagnetic emission of integrated circuits. In International Symposium on Electromagnetic Compatibility–EMC Europe, Gothenburg – Sweden, September 2022.
• Corinna Kofler, Dohr Claudia Anna, Dohr Judith, and Anja Zernig. Data-Centric Model Development to Improve the CNN Classification of Defect Density SEM Images. In IECON 2022 – 48^th Annual Conference of the IEEE Industrial Electronics Society, Brussels, Belgium, October 2022. IEEE. (doi:10.1109/IECON49645.2022.9968911)
• Peter Kolter. Development of an automated testplan for active thermal cycling of discrete power semiconductors. Bachelor’s thesis, FH Joanneum, August 2022.
• Daniel Kostynski, Steffen Sack, and Markus Sievers. Active thermal cycling of discrete power semiconductors for applications with strong Δt-profiles. In International Conference on Integrated Power Electronics Systems (CIPS2022), Berlin, GER, March 2022.
• Daniel Kostynski, Steffen Sack, Peter Kolter, and Michael Glavanovics. A multi-channel system for active thermal cycling of discrete power semiconductors based on mission profiles. In Conference Proceedings The 14^th International Conference on Advanced Semiconductor Devices and Microsystems, October 2022.
• Thomas Krametter. Evaluation and improvement of an integrated data analysis pipeline for material degradation measurement data. Bachelor’s thesis, Graz University of Technology, February 2022.
• Peter Lassnig and Simon Thamer. Automated characterization of semiconductors with a wide bandgap. HTL Diploma thesis, HTBLVA Villach, Villach, March 2022.
• Francisco López de la Rosa, José Gómez-Sirvent, Corinna Kofler, Rafael Morales, and Antonio Fernández-Caballero. Detection of unknown defects in semiconductor materials from a hybrid deep and machine learning approach. In Proceedings of the IWINAC 2022: International Work-Conference on the Interplay Between Natural and Artificial Computation. Springer International Publishing, 2022. (doi:10.1007/978-3-031-06527-9_35)
• Katharina Mairhofer, Philipp Rosenauer, Michael Nelhiebel, Stefan Radl, Silvia Larisegger, and Günter Fafilek. An inherently leakage-free inverted rotating disk electrode (IRDE) design. Journal of Electroanalytical Chemistry, 917:116392, July 2022. (doi:10.1016/j.jelechem.2022.116392)
• Katharina Mairhofer, Silvia Larisegger, and Günter Fafilek. Photoelectrochemical method for the investigation of wide-bandgap semiconductors. In 23^rd International Conference on Advanced Batteries, Accumulators, Fuel Cells and Special Electrochemical Technologies (ABAF), Brno, Czech Republic, August 2022.
• Katharina Mairhofer, Fabian Fröch, Francisco Santos, Silvia Larisegger, and Günter Fafilek. Oxidation behaviour of n-type SiC in different electrolytes. In Electrochemistry 2022, Berlin, September 2022.
• Katharina Mairhofer, Silvia Larisegger, Annette Foelske, Markus Sauer, Gernot Friedbacher, and Günter Fafilek. Electrochemistry of silicon carbide semiconductors. In 35^th European Conference on Surface Science (ECOSS), September 2022.
• Katharina Mairhofer, Silvia Larisegger, and Günter Fafilek. A newly developed inverted rotating disk electrode (IRDE) setup for the investigation of photoelectrochemical reactions. In 241^st ECS Meeting, 2022.
• Kristijan Luka Mletschnig, Mathias Rommel, Gregor Pobegen, Werner Schustereder, and Peter Pichler. Aluminum activation in 4h-SiC measured on laterally contacted MOS capacitors with a buried current-spreading layer. Materials Science Forum, 1062:38–43, May 2022. (doi:10.4028/p-sg9dq0)
• Sebastian Moser, Daniel Tscharnuter, Michael Nelhiebel, Michael Reisinger, Johannes Zechner, and Megan J. Cordill. A measurement structure for in-situ electrical monitoring of fatigue delamination. In ICMCTF 2022: 48^th International Conference on Metallurgical Coatings and Thin Films, May 2022.
• Sebastian Moser, Daniel Tscharnuter, Michael Nelhiebel, Michael Reisinger, Johannes Zechner, and Megan J. Cordill. A measurement structure for in-situ electrical monitoring of cyclic delamination. Surface and Coatings Technology, 445:128715, July 2022. (doi:10.1016/j.surfcoat.2022.128715)
• Sebastian Moser, Gerald Zernatto, Manuel Kleinbichler, Johannes Zechner, Michael Nelhiebel, and Megan J. Cordill. In-situ characterization of copper fatigue upon rapid thermo-mechanical pulsing. In ÖGV Seminar 2022: Österreichische Gesellschaft für Vakuumtechnik, July 2022.
• Sebastian Moser, Manuel Kleinbichler, Johannes Zechner, Michael Reisinger, Michael Nelhiebel, and Megan J. Cordill. Fatigue of copper films subjected to high-strain rate thermo-mechanical pulsing. Microelectronics Reliability, 137:114782, 2022. (doi:10.1016/j.microrel.2022.114782)
• Sebastian Moser. Thermo-mechanical fatigue of metallizations in microelectronic applications. PhD thesis, Montanuniversität Leoben, 2022.
• Anoop Nanjanayanapura Gopalaiah. Numerical implementation of a stress dependent vacancy diffusion model for electrochemically deposited (ECD) copper. Master’s thesis, Technische Universität Bergakademie Freiberg, 2022.
• Matteo Noli. Concept development and implementation of a flexible functional PCB test system. Master’s thesis, Politecnico di Torino, July 2022.
• Sybille Ofner, Bettina Findenig, Markus Sievers, and Michael Glavanovics. DUT board design considerations for HV application reliability testing of WBG power devices. In Proceedings of the 2022 Austrian Workshop on Microelectronics, pages 37–40. IEEE, October 2022. (doi:10.1109/austrochip56145.2022.9940635)
• Manuel Petersmann and Lennart Hucht. Correlation of pore formation and microstructural characteristics by linking SEM and EBSD data – application to the Cu metallization of power devices. In 9^th CAM Workshop – Innovation in Failure Analysis and Material Diagnostics of Electronics Components, 2022.
• Maximilian Podsednik, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Applications of an improved ArF excimer laser system: The implementation of selective imaging. In European Workshop of Laser Ablation (EWLA 2022), Bern, Switzerland, July 2022.
• Maximilian Podsednik, Maximilian Weiss, Silvia Larisegger, Michael Nelhiebel, Johannes Frank, and Andreas Limbeck. Quantitative depth profiles in novel materials by combined consideration of online laser ablation of solids in liquids and LA-ICP-MS. In European Workshop of Laser Ablation (EWLA 2022), Bern, Switzerland, July 2022.
• Maximilian Podsednik, Silvia Larisegger, Michael Nelhiebel, Ahmed Bahr, Helmut Riedl, Paul Mayrhofer, and Andreas Limbeck. Analysis of non-metals in technologically relevant materials using laser-induced breakdown spectroscopy (LIBS). In European Symposium on Analytical Spectrometry, Brno, Czech Republic, September 2022.
• Maximilian Podsednik, Maximilian Weiss, Silvia Larisegger, Michael Nelhiebel, Johannes Frank, and Andreas Limbeck. Quantitative aluminum depth-profile measurements in SiC using laser assisted methods. In 9^th CAM Workshop – Innovation in Failure Analysis and Material Diagnostics of Electronics Components, 2022.
• Maximilian Podsednik, Maximilian Weiss, Silvia Larisegger, Michael Nelhiebel, Johannes Frank, and Andreas Limbeck. Quantitative trace element analysis of novel materials using online laser ablation of solids in liquids (online-LASIL). In Colloquium Spectroscopicum Internationale XLII (CSI XLII), 2022.
• Ihsan Rasool. Development of an evaluation module for automotive power ics. Master’s thesis, Technical University of Munich, 2022.
• Philipp Rosenauer, Silvia Larisegger, Michael Nelhiebel, and Stefan Radl. Investigation of ion transport in polymers with molecular dynamics simulations. In Electrochemistry, Berlin, Germany, September 2022. GDCh.
• Paul Salmen, Maximilian Feil, Katja Waschneck, Hans Reisinger, Gerald Rescher, Ingo Voss, Markus Sievers, and Thomas Aichinger. Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation. Microelectronics Reliability, 135:114575, August 2022. (doi:10.1016/j.microrel.2022.114575)
• Gerald Schaffar, Daniel Tscharnuter, and Verena Maier-Kiener. Indentation unloading phase transformations in silicon: A new perspective. In Nanomechanical Testing in Materials Research and Development VIII, October 2022.
• Gerald Schaffar, Johann Kappacher, Daniel Tscharnuter, and Verena Maier-Kiener. The phase transformation of silicon assessed by an unloading contact pressure approach. Journal of the Minerals Metals and Materials Society, 74:2220–2230, 2022. (doi:10.1007/s11837-022-05290-4)
• Michael Scheiber, Clement Nartey, Anja Zernig, and Andre Kaestner. Improving wafer map classification in industry 4.0. In 5^th IEEE International Conference on Industrial Cyber Physical System, 2022.
• Michael Scheiber, Clement Nartey, Anja Zernig, and Andre Kaestner. Improving wafer map classification in industry 4.0. In Proceedings of the 2022 5^th International Conference on Industrial Cyber-Physical Systems (ICPS), Coventry, United Kingdom, 2022. IEEE. (doi:10.1109/ICPS51978.2022.9816887)
• Sebin Shaji Philip. Zephyr RTOS: Design of a deterministic Ethernet network for machine-to-machine (M2M) communications. Master’s thesis, University of Trento, 2022.
• Michael Georg Stadt, Michael Nelhiebel, Silvia Larisegger, and Günter Fafilek. Electrochemically controlled high-temperature oxidation of copper within a large oxygen partial pressure window. In EUROCORR – European Corrosion Congress, Berlin, September 2022.
• Michael Georg Stadt, Michael Nelhiebel, Silvia Larisegger, and Günter Fafilek. Combining high-temperature cyclic voltammetry and electrochemical impedance spectroscopy in a setup for the controlled oxidation of copper. In 242^nd ECS Meeting, Atlanta, GA, 2022. The Electrochemical Society.
• Alexander Ulbing, Daniel Kostynski, and Markus Sievers. Dynamic load emulation for automotive power IC robustness validation. In European Conference on Power Electronics and Applications, Hanover, Germany, September 2022.
• Lars Varain, Michael Nelhiebel, Silvia Larisegger, and Günter Fafilek. Electrochemical investigation and modeling of ion- and water transport through polymer membranes. In 23^rd International Conference on Advanced Batteries, Accumulators, Fuel Cells and Special Electrochemical Technologies (ABAF), Brno, Czech Republic, August 2022.
• Lars Varain, Günter Fafilek, Michael Nelhiebel, and Silvia Larisegger. Electrochemical investigation and modeling of ion- and water transport through polymer membranes. In Electrochemistry, Berlin, Germany, September 2022. GDCh.
• Lars Varain. Electrochemical Investigation and Modeling of Ion- and Water Transport Through Polymer Membranes. PhD thesis, TU Wien, 2022. (doi:10.34726/hss.2022.49863)
• Alexander Vasilev, Markus Jech, Alexander Grill, Gerhard Rzepa, Christian Schleich, Stanislav Tyaginov, Alexander Makarov, Gregor Pobegen, Tibor Grasser, and Michael Waltl. TCAD modeling of temperature activation of the hysteresis characteristics of lateral 4H-SiC MOSFETs. IEEE Transactions on Electron Devices, 69(6):3290–3295, April 2022. (doi:10.1109/ted.2022.3166123)
• Maximilian Weiss, Maximilian Podsednik, Silvia Larisegger, Michael Nelhiebel, Johannes Frank, , and Andreas Limbeck. Characterization of high-tech materials using online-LASIL. In Winter Conference on Plasma Spectrochemistry, Tucson, AZ, USA, January 2022.
• Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Limbeck Andreas. Humidity and temperature dependence of the sulfur uptake behavior of different polymers examined via LA-ICP-MS depth profile measurements. In Winter Conference on Plasma Spectrochemistry, Tucson, AZ, USA, January 2022.
• Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Quantitative assessment of sulfur uptake from polymers aged in harsh environments via LA-ICP-MS. In Winter Conference on Plasma Spectrochemistry, Tucson, AZ, USA, January 2022.
• Jakob Willner, Lukas Brunnbauer, Lars Varain, Michael Nelhiebel, Günter Fafilek, Silvia Larisegger, and Andreas Limbeck. Development and application of a new weathering setup for investigation of polymer degradation in harsh environments. In 9^th CAM Workshop – Innovation in Failure Analysis and Material Diagnostics of Electronics Components, Halle an der Salle, Germany, June 2022.
• Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Investigation of polymer ageing by combined LIBS and LA-ICP-MS analysis. In European Workshop on Laser Ablation (EWLA 2022), Bern, Switzerland, July 2022.
• Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Depth-resolved LA-ICP-MS investigations for the determination of diffusion coefficients of SO2 in thin polymer films. In European Workshop on Laser Ablation (EWLA 2022), Bern, Switzerland, July 2022.
• Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. A novel standard addition approach for matrix-matched calibration with LA-ICP-MS via spray deposition. In European Symposium on Analytical Spectrometry, Brno, Czech Republic, September 2022.
• Dominik Zupan, Nikolaus Czepl, and Daniel Kircher. Framework for developing neural network regression models predicting the influence of emi on integrated circuits. In 18^th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Villasimius – Sardinia – Italy, June 2022.
• Dominik Zupan, Daniel Kircher, and Nikolaus Czepl. Predicting the emi induced offset of a differential amplifier stage using a neural network model. In International Symposium on Electromagnetic Compatibility–EMC Europe, Gothenburg – Sweden, September 2022.

2021 ▾

• Dženana Alagić. Application of Unsupervised and Fusion Methods to Characterize the Microstructure of Polycrystalline Materials. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2021.
• Muaaz Amjad. Firmware development of an advanced stress test controller. Master’s thesis, University of Applied Sciences Upper Austria, 2021.
• Lukas Brunnbauer, Jhanis Gonzalez, Hans Lohninger, Julia Bode, Carla Vogt, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Strategies for trace metal quantification in polymer samples with an unknown matrix using laser-induced breakdown spectroscopy. Spectrochimica Acta Part B: Atomic Spectroscopy, 183:106272, September 2021. (doi:10.1016/j.sab.2021.106272)
• Lukas Brunnbauer, Jhanis Gonzalez, Hans Lohninger, Julia Bode, Carla Vogt, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Matrix-independent trace metal quantification in polymers using LIBS. In AOFKA 2021, 2021.
• Lukas Brunnbauer. Advanced Polymer Characterization using LA-ICP-MS and LIBS. PhD thesis, TU Wien, 2021. (doi:10.34726/HSS.2021.71238)
• Boris Butej. Electrical characterization of charge accumulation/depletion in GaN-based HEMTs. Master’s thesis, Graz University of Technology, February 2021.
• Sascha Einspieler, Nirmal Rathakrishnan, Arpitha Prabhakara, Benjamin Steinwender, and Wilfried Elmenreich. High accuracy software-based clock synchronization over CAN. IEEE Transactions on Systems, Man, and Cybernetics: Systems, 52(7), July 2021. (doi:10.1109/TSMC.2021.3096597)
• Sascha Einspieler, Benjamin Steinwender, and Wilfried Elmenreich. Mixed-triggered communication with limited elastic slot boundaries. Microprocessors and Microsystems, 86, August 2021. In Press. (doi:10.1016/j.micpro.2021.104323)
• Sascha Einspieler. Flexible Real-Time Control and Diagnostic System for Applicaition Related Stress Testing. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2021.
• Valeria Fedel. Optimizing a machine learning pipeline for SEM image classification. Master’s thesis, University of Milano-Bicocca, 2021.
• Markus Gratzer. Advanced controller design for a thermal stress test of power semiconductors. Master’s thesis, Carinthia University of Applied Sciences, 2021.
• Matthias Heindl. Automated image processing for the quantification of microstructural damage in materials. Bachelor’s thesis, Graz University of Technology, 2021.
• Paul Hoffmann, Sebastian Moser, Corinna Kofler, Michael Nelhiebel, Daniel Tscharnuter, Balamurugan Karunamurthy, Heinz E. Pettermann, and Melanie Todt. Thermomechanical fatigue damage modeling and material parameter calibration for thin film metallizations. International Journal of Fatigue, 155, October 2021. (doi:10.1016/j.ijfatigue.2021.106627)
• Curran Kalha, Sebastian Bichelmaier, Nathalie K. Fernando, J. V. Berens, Pardeep Kumar Thakur, Tien-Lin Lee, J.J. Gutierrez Moreno, S. Mohr, L. E. Ratcliff, Michael Reisinger, Johannes Zechner, Michael Nelhiebel, and Anna Regoutz. Thermal and oxidation stability of Ti_xW_1-x diffusion barriers investigated by soft and hard x-ray photoelectron spectroscopy. Journal of Applied Physics, 129(19):195302, May 2021. (doi:10.1063/5.0048304)
• Manuel Kleinbichler, Corinna Kofler, Manuel Stabentheiner, Michael Reisinger, Sebastian Moser, Johannes Zechner, Michael Nelhiebel, and Ernst Kozeschnik. Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films. Microelectronics Reliability, 127:114387, December 2021. (doi:10.1016/j.microrel.2021.114387)
• Christian Koller, Liverios Lymperakis, Dionyz Pogany, Gregor Pobegen, and Clemens Ostermaier. Mechanism leading to semi-insulating property of carbon-doped GaN: Analysis of donor acceptor ratio and method for its determination. Journal of Applied Physics, 130(18):185702, November 2021. (doi:10.1063/5.0060912)
• Katharina Mairhofer, Bettina Kipper-Pires, Gerhard Leitner, and Günter Fafilek. Photoassisted electrodeposition of cuprous oxide thin films. ECS Transactions, 105(1):441–452, November 2021. (doi:10.1149/10501.0441ecst)
• Katharina Mairhofer, Bettina Kipper-Pires, and Günter Fafilek. Photoassisted electrodeposition of cuprous oxide thin films. In 22^nd International Conference Advanced Batteries, Accumulators and Fuel Cells, 2021.
• Katharina Mairhofer, Silvia Larisegger, and Günter Fafilek. Photoassisted electrodeposition of cuprous oxide in a newly developed inverted rotating disk electrode (IRDE) setup. In 10^th Czech-Austrian Workshop: New trends in photo and electro catalysis, 2021.
• Katharina Mairhofer, Philipp Mayr, Michael Nelhiebel, Stefan Radl, Silvia Larisegger, and Günter Fafilek. A new design for an inverted rotating disk electrode set-up using magnetic coupling. In 72^nd Annual Meeting of the International Society for Electrochemistry, 2021.
• Manesh Mistry, Jonathon Cottom, Kamal Patel, Alexander L Shluger, Gabriele C Sosso, and Gregor Pobegen. Modelling the interactions of NO in a-SiO2. Modelling and Simulation in Materials Science and Engineering, Accepted Manuscript, 2021. (doi:10.1088/1361-651X/abdc69)
• Sebastian Moser, Gerald Zernatto, Manuel Kleinbichler, Johannes Zechner, Michael Nelhiebel, and Megan J. Cordill. Thermo-mechanical fatigue of copper films at high strain rates. In E-MRS Spring Meeting 2021: European Materials Research Society, June 2021.
• Sebastian Moser, Manuel Kleinbichler, Sabine Kubicek, Johannes Zechner, and Megan J. Cordill. Electropolishing—a practical method for accessing voids in metal films for analyses. Applied Sciences, 11(15), July 2021. (doi:10.3390/app11157009)
• Sebastian Moser, Johannes Zechner, Manuel Kleinbichler, Michael Nelhiebel, Michael Reisinger, and Megan J. Cordill. High strain rate thermo-mechanical fatigue study on differently galvanically prepared cu structures on si. In EUROMAT 2021: European Congress and Exhibition on Advanced Materials and Processes, September 2021.
• Clement Nartey. Generalization of pattern recognition framework for process patterns in analog wafer test data. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2021.
• Sybille Ofner, Michael Glavanovics Michael, and Annette Mütze. Indirect in-situ junction temperature measurement for condition monitoring of GaN HEMT devices during application related reliability testing. In 27^th international workshop on thermal investigations of ICs and systems (THERMINIC), 2021.
• Valeria Padovan. Characterization of hot electron degradation in GaN based HEMTs. PhD thesis, Vienna University of Technology, 2021.
• Lalit Patil. Control and development of measurement concepts for soft switching application. Master’s thesis, University Of Applied Sciences Upper Austria, February 2021.
• Konstantinos Patmanidis, Tobias Kist, Michael Glavanovics, and Annette Muetze. Configurable gate driver for a stress test bench of newly developed discrete silicon power devices. Microelectronics Reliability, 124:114283, September 2021. (doi:10.1016/j.microrel.2021.114283)
• Konstantinos Patmanidis, Michael Glavanovics, and Annette Muetze. Scalable multitasking dynamic pulse based reliability stress test for high voltage discrete semiconductors. In Proceedings of EPE’21, 2021.
• Konstantinos Patmanidis. Versatile Stress Test System for Dynamic Pulse Based Reliability Assessment of Discrete Power Devices. PhD thesis, Graz University of Technology, Graz, Austria, 2021.
• Giuseppe Pipero. Redesign and improvement of a test system configuration tool. Master’s thesis, Politecnico di Torino, 2021.
• Gregor Pobegen and Thomas Aichinger. Wide Bandgap Semiconductors for Power Electronics, chapter Gate Dielectrics for 4H-SiC Power Switches: Understanding the Structure and Effects of Electrically Active Point Defects at the 4H-SiC/SiO2 Interface, pages 225–248. Wiley VCH, Berlin, 1 edition, 2021.
• Arpitha Prabhakara, Benjamin Steinwender, and Wilfried Elmenreich. Statistical analysis of execution time profile for temporal validation of a distributed hard real-time system. In 22^nd IEEE International Conference on Industrial Technology (ICIT). IEEE, March 2021. (doi:10.1109/icit46573.2021.9453493)
• Florian Pribahsnik. GaN specific mechanical phenomena and their influence on reliability in power HEMT operation. PhD thesis, Otto von Guericke Universität, Magdeburg, 2021.
• Nirmal Krishna Rathakrishnan. Investigation and enhancement of a distributed time-triggered bus communication. Master’s thesis, Technical University Hamburg, 2021.
• Bernhard Ruch, Markus Jech, Gregor Pobegen, and Tibor Grasser. Applicability of shockley-read-hall theory for interface states. IEEE Transactions on Electron Devices, 68(4), 2021. (doi:10.1109/ted.2021.3049760)
• Bernhard Ruch, Gregor Pobegen, and Tibor Grasser. Localizing hot-carrier degradation in silicon trench MOSFETs. IEEE Transactions on Electron Devices, 68(4), 2021. (doi:10.1109/ted.2021.3060697)
• Bernhard Ruch. Hot-carrier degradation in planar and trench Si-MOSFETs. PhD thesis, TU Wien, 2021.
• Michael Scheiber, Anja Zernig, and Andre Kaestner. The wafer health factor: Automatic detection of critical process patterns within analog wafer test data. In 10^th Arrowhead Tools – Luebeck Workshop, 2021.
• Daniel Schirmbrand. Optimized impedance measurement accuracy for a short circuit stress test system. Master’s thesis, Carinthia University of Applied Sciences, June 2021.
• Sabina Sušnik. Analysis of thermo-mechanical deformations of thin films under high heating rates. Master’s thesis, Graz University of Technology, 2021.
• Dominic Tilly. Characterisation of defects in gallium nitride structures using conductive atomic force microscopy. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2021.
• Fabian Triendl, Georg Pfusterschmied, Claudio Berger, Sabine Schwarz, Werner Artner, and Ulrich Schmid. Ti/4H-SiC schottky barrier modulation by ultrathin a-SiC:H interface layer. Thin Solid Films, 721:138539, March 2021. article. (doi:10.1016/j.tsf.2021.138539)
• Fabian Triendl, Georg Pfusterschmied, Sabine Schwarz, Gregor Pobegen, Jens Peter Konrath, and Ulrich Schmid. Barrier height tuning by inverse sputter etching at poly-Si/4H-SiC heterojunction diodes. Semiconductor Science and Technology, 36(5):055021, April 2021. (doi:10.1088/1361-6641/abf29b)
• Fabian Triendl, Georg Pfusterschmied, Sabine Schwarz, Werner Artner, and Ulrich Schmid. Si/4h textendash SiC heterostructure formation using metal-induced crystallization. Materials Science in Semiconductor Processing, 128:105763, June 2021. article. (doi:10.1016/j.mssp.2021.105763)
• Fabian Triendl, Georg Pfusterschmied, Gregor Pobegen, Sabine Schwarz, Werner Artner, Jens Peter Konrath, and Ulrich Schmid. Growth and characterization of low pressure chemical vapor deposited Si on Si-face 4H textendash SiC. Materials Science in Semiconductor Processing, 131:105888, August 2021. (doi:10.1016/j.mssp.2021.105888)
• Daniel Tscharnuter. Simulation of delamination by thermal cycling. In 22^nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; IPCEI Short Course 1, April 2021.
• Magdalena Weger. Electric characterization of SiC trench MOSFETs with DLTS and admittance spectroscopy. Master’s thesis, Vienna University of Technology, 2021.
• Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger, and Andreas Limbeck. Quantitative determination of sulfur uptake in selected polymers via LA-ICP-MS. In AOFKA 2021, 2021.
• Jakob Willner, Lars Varain, Lukas Brunnbauer, Philipp Mayr, Michael Nelhiebel, Günter Fafilek, Silvia Larisegger, and Andreas Limbeck. Determination of protection capability of selected polymers against atmospheric corrosion in harsh environments. In Eurocorr 2021, 2021.

2020 ▾

• J. Berens, M. Weger, G. Pobegen, T. Aichinger, G. Rescher, C. Schleich, and T. Grasser. Similarities and differences of BTI in SiC and si power MOSFETs. In 2020 IEEE International Reliability Physics Symposium (IRPS). IEEE, April 2020. (doi:10.1109/irps45951.2020.9129259)
• Judith Berens. Carrier Mobility and Reliability of 4H-SiC Trench MOSFETs. PhD thesis, Vienna University of Technology, 2020.
• Lukas Brunnbauer, Silvia Larisegger, Hans Lohninger, Michael Nelhiebel, and Andreas Limbeck. Spatially resolved polymer classification using laser induced breakdown spectroscopy (LIBS) and multivariate statistics. Talanta, 209:120572, March 2020. (doi:10.1016/j.talanta.2019.120572)
• Lukas Brunnbauer, Maximilian Mayr, Silvia Larisegger, Michael Nelhiebel, Laura Pagnin, Rita Wiesinger, Manfred Schreiner, and Andreas Limbeck. Combined LA-ICP-MS/LIBS: powerful analytical tools for the investigation of polymer alteration after treatment under corrosive conditions. Scientific Reports, 10(1), July 2020. (doi:10.1038/s41598-020-69210-9)
• Michael Fuchs, Markus Sievers, and Bernd Deutschmann. Voltage dependence and characterization of ceramic capacitors under electrical stress. In Proceedings of the 2020 IEEE Applied Power Electronics Conference and Exposition, 2020. (doi:10.1109/APEC39645.2020.9124365)
• Angelos Georgakas. Development and evaluation of a reliability stress test system. Master’s thesis, Aristotle University of Thessaloniki, 2020.
• Davide Rosario Grasso. Design of a local controller for the execution of reliability tests by use of an embedded system. Master’s thesis, Politecnico di Milano, 2020.
• Ayman Hatoum. Designing a scheduling tool for distributed real-time communication. Master’s thesis, Politecnico di Torino, 2020.
• Paul Hoffmann, Michael Nelhiebel, Balamurugan Karunamurthy, Heinz E. Pettermann, and Melanie Todt. Simulation of fatigue damage in clusters of DMOS cells subjected to non-uniform transient thermo-mechnical loading. In 21^st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, July 2020. (doi:10.1109/eurosime48426.2020.9152728)
• Hana T.T. Jebril. A Deep Learning Approach for Feature Extraction using Time-Dependent Sensor Data. Master’s thesis, University of Padova, 2020.
• Ankit Jotwani. Advanced magnetics design for high power SiC converters. Master’s thesis, Technical University of Denmark, 2020.
• Stefan Kamper. Influence of process variations on avalanche breakdown in power trench MOSFETs. Master’s thesis, Graz University of Technology, 2020.
• Sabine Kubicek. Deposition Mechanism and Stability of Copper Oxide on Copper. PhD thesis, Vienna University of Technology, 2020.
• Bernhard Leitl, Gerhard Schmidt, Gregor Pobegen, Peter Knoll, and Heinz Krenn. Conduction mechanisms in hydrogenated amorphous silicon carbide. JNCS, 528:119750, January 2020. (doi:10.1016/j.jnoncrysol.2019.119750)
• Gerhard Leitner. Electrochemical deposition and characterization of copper oxide films. Master’s thesis, Vienna University of Technology, 2020.
• Foued Makhloufi. Design of an Advanced DC/DC-Converter Test Module for the Execution of Reliability Tests of Power Semiconductors. Master’s thesis, University of Applied Sciences Technikum Wien, 2020.
• Maximilian Mayr, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. LA-ICP-MS/LIBS analysis of polymer coatings: Investigation of degradation and S-diffusion under exposure to UV-radiation, H2S and SO2. In EUROCORR 2020, 2020.
• Philipp Mayr. CFD simulation of transport processes within a weathering cell. Master’s thesis, Graz University of Technology, 2020.
• Sebastian Moser, Gerald Zernatto, Manuel Kleinbichler, Johannes Zechner, Michael Nelhiebel, and Megan J. Cordill. In-situ study of copper fatigue induced by high strain rate thermo-mechanical pulsing. In MSE 2020: Materials Science and Engineering Congress, September 2020.
• Konstantinos Patmanidis, Michael Glavanovics, Angelos Georgakas, and Annette Muetze. Modular dynamic pulse stress test system for discrete high power semiconductors. Microelectronics Reliability, In press, 2020. (doi:10.1016/j.microrel.2020.113852)
• Barbara Pedretscher, Michael Nelhiebel, and Barbara Kaltenbacher. Applying a statistical model to the observed texture evolution of fatigued metal films. IEEE Transactions on Device and Materials Reliability, 20(3):517–523, September 2020. (doi:10.1109/TDMR.2020.3004044)
• Prashanth Pillamari. Evaluation and development of in-situ diagnostic concepts for stress testing of SiC MOSFETs. Master’s thesis, Technical University of Hamburg, 2020.
• Patrick Plum, Horst Lewitschnig, and Jürgen Pilz. Exact confidence intervals for the hazard rate of a series reliability system. In Proceedings of 66^th Annual Reliability and Maintainability Symposium, Palm Springs, CA, 2020. IEEE.
• Bernhard Ruch, Gregor Pobegen, Christian Schleich, and Tibor Grasser. Generation of hot-carrier induced border and interface traps, investigated by spectroscopic charge pumping. In IEEE International Reliability Physics Symposium, page 8A.3, April 2020. (doi:10.1109/IRPS45951.2020.9129513)
• Bernhard Ruch, Gregor Pobegen, and Tibor Grasser. Investigation of the temperature dependence of hot-carrier degradation in Si MOSFETs using spectroscopic charge pumping. IEEE Transactions on Electron Devices, 67(10):4092–4098, October 2020. (doi:10.1109/TED.2020.3018091)
• Bernhard Ruch, Markus Jech, Gregor Pobegen, and Tibor Grasser. Applicability of shockley-read-hall theory for interface states. In IEEE International Electron Devices Meeting (IEDM). IEEE, December 2020. (doi:10.1109/iedm13553.2020.9372032)
• Matthias Röcklinger. Electro-thermo-mechanically coupled simulation of actively heated silicon chips. Master’s thesis, Vienna University of Technology, 2020.
• Stefan Schrunner, Bernhard C. Geiger, Anja Zernig, and Roman Kern. A generative semi-supervised classifier for datasets with unknown classes. In Proceedings of the 35^th Annual ACM Symposium on Applied Computing. ACM, March 2020. (doi:10.1145/3341105.3373890)
• Markus Sievers, Bettina Findenig, Michael Glavanovics, Thomas Aichinger, and Bernd Deutschmann. Monitoring of parameter stability of SiC MOSFETs in real application tests. Microelectronics Reliability, 114:113731, 2020. 31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2020. (doi:10.1016/j.microrel.2020.113731)
• Fabian Triendl, Georg Pfusterschmied, Gernot Fleckl, S. Schwarz, and Ulrich Schmid. On the crystallization behavior of sputter-deposited a-Si films on 4H-SiC. Thin Solid Films, 697:137837, March 2020. Article. (doi:10.1016/j.tsf.2020.137837)
• Fabian Triendl, Georg Pfusterschmied, C. Zellner, W. Artner, K. Hradil, and Ulrich Schmid. Low-temperature epitaxial Si on 4H-SiC using metal-induced crystallization. Materials Letters: X, 6:100040, June 2020. Article. (doi:10.1016/j.mlblux.2020.100040)
• Fabian Triendl, Georg Pfusterschmied, Gregor Pobegen, Jens Peter Konrath, and Ulrich Schmid. Theoretical and experimental investigations of barrier height inhomogeneities in poly-Si/4H-SiC heterojunction diodes. Semiconductor Science and Technology, 35(11):115011, September 2020. (doi:10.1088/1361-6641/abae8d)
• Lars Varain, Silvia Larisegger, Michael Nelhiebel, and Günter Fafilek. Electrochemical investigation and FEM modeling of ion- and water-transport through polymer membranes. In EUROCORR 2020, 2020.
• Milan Ťapajna and Christian Koller. Reliability Issues in GaN Electronic Devices, chapter 6, pages 199–252. Wiley‐VCH Verlag GmbH & Co. KGaA, September 2020. (doi:10.1002/9783527825264.ch6)

2019 ▾

• Dženana Alagić and Jürgen Pilz. Microstructure image segmentation using patch-based clustering approach. In 10^th International Workshop on Simulation and Statistics, September 2019.
• Mohammad Alshawabkeh. Control design for a multiphase converter system. Master’s thesis, Carinthia University of Applied Sciences, 2019.
• Sergei Bauer and Peter Schartner. Reducing risk potential by evaluating specialized countermeasures for electronic control units. In Embedded Security in Cars escar USA, 2019.
• Sergei Bauer, Martin Brunner, and Peter Schartner. Lightweight authentication for low-end control units with hardware based individual keys. In IEEE International Conference on Robotic Computing, 2019. (doi:10.1109/IRC.2019.00082)
• Judith Berens, Fabian Rasinger, Thomas Aichinger, Michael Heuken, Michael Krieger, and Gregor Pobegen. Detection and cryogenic characterization of defects at the SiO2/4h-SiC interface in trench MOSFET. IEEE Transactions on Electron Devices, 66(3):1213–1217, March 2019. (doi:10.1109/ted.2019.2891820)
• Judith Berens, Gregor Pobegen, Thomas Aichinger, Gerald Rescher, and Tibor Grasser. Cryogenic characterization of nh3 post oxidation annealed 4h-sic trench mosfets. In Material Science Forum, volume 963 of Materials Science Forum, pages 175–179. Trans Tech Publications Ltd, September 2019. (doi:10.4028/www.scientific.net/MSF.963.175)
• Judith Berens, Gregor Pobegen, Gerald Rescher, Thomas Aichinger, and Tibor Grasser. NH3 and NO + NH3 annealing of 4H-SiC trench MOSFETs: Device performance and reliability. IEEE Transactions on Electron Devices, 66(11):4692–4697, November 2019. (doi:10.1109/TED.2019.2941723)
• Judith Berens, Sebastian Bichelmaier, Nathalie K. Fernando, Pardeep K. Thakur, Tien-Lin Lee, Manfred Mascheck, Tomas Wiell, Susanna K. Eriksson, J. Matthias Kahk, Johannes Lischner, Manesh V. Mistry, Thomas Aichinger, Gregor Pobegen, and Anna Regoutz. Effects of nitridation on sic/sio2 structures studied by hard x-ray photoelectron spectroscopy. arXiv, preprint, 2019.
• Judith Berens, Gregor Pobegen, and Tibor Grasser. Tunneling effects in NH3 annealed 4H-SiC Trench MOSFETs. In ICSCRM: International Conference on Silicon Carbide and Related Materials, Kyoto, Japan, 2019.
• Sebastian Bichelmaier. Ab initio and experimental investigation of titanium-tungsten diffusion barriers. Master’s thesis, Vienna University of Technology, 2019.
• Lukas Brunnbauer, Maximilian Mayr, Silvia Larisegger, Michael Nelhiebel, Johann Lohninger, and Andreas Limbeck. Investigation of polymer degradation under corrosive conditions using tandem LA-ICP-MS/LIBS. In European Winter Conference on Plasma Spectrochemistry, Pau, France, February 2019.
• Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. Lateral resolved polymer classification using laser induced breakdown spectroscopy (LIBS). In CANAS, Freiberg, Germany, 2019.
• Lukas Brunnbauer, Maximilian Mayr, Maximilian Bonta, Walter Mack, Harald Preu, Carsten Schäffer, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. LA-ICP-MS and LIBS: Analytical techniques for lateral resolved elemental analysis applied to corrosion studies in semiconductor devices. In European Corrosion Congress, 2019.
• Lukas Brunnbauer, Maximilian Mayr, Silvia Larisegger, Michael Nelhiebel, and Andreas Limbeck. Tandem LA-ICP-MS/LIBS analysis of polymer coatings: Investigating degradation under exposure to UV-radiation and SO2. In European Corrosion Congress, Seville, Spain, 2019.
• Dominik Büchl, Tobias Glück, Wolfgang Kemmetmüller, Bernd Deutschmann, and Andreas Kugi. Optimal current slew rate control for a three-phase MOSFET inverter driving a PMSM. In IFAC Mechatronics & NOLCOLS 2019, September 2019. (doi:10.1016/j.ifacol.2019.11.655)
• Dominik Büchl, Tobias Glück, Wolfgang Kemmetmüller, Bernd Deutschmann, and Andreas Kugi. A dynamic model of power metal-oxide-semiconductor field-effect transistor half-bridges for the fast simulation of switching induced electromagnetic emissions. Mathematical and Computer Modelling of Dynamical Systems, 0, 2019. (doi:10.1080/13873954.2019.1610899)
• Mikkel Caschetto-Böttcher. Implementation of USB Test and Measurement Class for Stress Test Applications. Master’s thesis, University of Glasgow, December 2019.
• Jonathon Cottom, Manesh V. Mistry, Gernot Gruber, Gregor Pobegen, Thomas Aichinger, and Alexander L. Shluger. Evidence for an abrupt transition between SiO lesssub greater 2 less /sub greater and SiC from EELS and lessi greaterab initio less /i greater modelling. Materials Science Forum, 963:199–203, July 2019. (doi:10.4028/www.scientific.net/msf.963.199)
• Chaowei Du, Kurt Matoy, Johannes Zechner, Michael Reisinger, Werner Robl, Robert Hart, Christoph Kirchlechner, and Dehm Gerhard. Microstructure of ni-p and its mechanical characterization by micro-compression testing. In International Conference on Advances in Experimental Mechanics, 2019.
• Chaowei Du, Kurt Matoy, Johannes Zechner, Michael Reisinger, Werner Robl, Robert Hartl, Martin Kotzbauer, Christoph Kirchlechner, and Gerhard Dehm. Ni-p microstructure and micro-compression. In ECI – Nanomechanical Testing in Materials Research and Development VII, 2019.
• Chaowei Du, Rafael Soler, Bernhard Voelker, Kurt Matoy, Johannes Zechner, Gregor Langer, Kirchlechner Christoph, and Gerhard Dehm. Reliable lead-free solders for harsh enviroments: microstructure and fracture behavior. In TMS 2019 – 148^th annual meeting & exhibition, 2019.
• Bernhard C. Geiger, Stefan Schrunner, and Roman Kern. An information-theoretic measure for pattern similarity in analog wafermaps. In 19^th European Advanced Process Control and Manufacturing Conference, Villach, Austria, April 2019.
• Devendra Giramkar. Automated microcontroller HIL testing framework. Master’s thesis, Carinthia University of Applied Sciences, 2019.
• Maximilian Goller. Evaluation of the dynamic R_{DS_on} of power gan hemts under hard switching condition at wafer level. Master’s thesis, Chemnitz University of Technology, 2019.
• Martin Hauck, Johannes Lehmeyer, Gregor Pobegen, Heiko B. Weber, and Michael Krieger. An adapted method for analyzing 4H silicon carbide metal-oxide-semiconductor field-effect transistors. Nature Communications Physics, 2(5), January 2019. (doi:10.1038/s42005-018-0102-8)
• Wieland Heyn, Malgorzata Kopycinska-Müller, André Clausner, Johannes Zechner, and Ehrenfried Zschech. The influence of surface roughness on elastic nanoindentation measurements. In 7^th Dresden Nanoanalysis Symposium, Dresden, Germany, August 2019.
• Wieland Heyn, Malgorzata Kopycinska-Müller, André Clausner, Johannes Zechner, and Ehrenfried Zschech. The influence of surface roughness on elastic nanoindentation measurements. In ECI Nanomechanical Testing in Materials Research and Development VII, Malaga, Spain, 2019.
• Manishkumar Jain. Test cost efficient implementation of a current diagnostic function. Master’s thesis, Technische Universität Darmstadt, 2019.
• Anna Jenul, Stefan Schrunner, Anja Zernig, Andre Kaestner, and Jürgen Pilz. An investigation of statistical measures for intensity comparison of process patterns in analog wafer test data. In 19^th European Advanced Process Control and Manufacturing Conference, Villach, Austria, April 2019.
• Anna Jenul. Intensity quantification of process patterns in wafer test data. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2019.
• Tobias Hans Kist. Design of an intelligent current controlled gate driver for flexible stress testing of discrete high power semiconductors. Master’s thesis, Ostbayerische Technische Hochschule Regensburg, 2019.
• Manuel Kleinbichler, Sebastian Moser, Johannes Zechner, Gerald Zernatto, Michael Nelhiebel, and Ernst Kozeschnik. In-situ deformation monitoring of thin electrochemically deposited copper lines during thermo-mechanical pulsing. In ECI Nanomechanical Testing in Materials Research and Development VII, Malaga, Spain, 2019.
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, Gebhard Hecke, Richard Neumann, Martin Holzbauer, Gottfried Strasser, and Dionyz Pogany. Trap-related breakdown and filamentary conduction in carbon doped GaN. physica status solidi (b), 0:1800527, 2019. (doi:10.1002/pssb.201800527)
• Christian Koller. The Role of Carbon in Creating Insulating Behavior in GaN-on-Si Buffers: A Physical Model. PhD thesis, Vienna University of Technology, January 2019.
• Daniel Kostynski. Development of in-situ characterization methodologies for power semiconductors within application stress tests. Master’s thesis, FH Joanneum, Kapfenberg, 2019.
• Katharina Mairhofer. Conditioning of copper by deposition of Cu2O thin films. Master’s thesis, Vienna University of Technology, 2019.
• Maximilian Mayr, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Johann Lohninger, and Andreas Limbeck. Investigation of polymer degradation under corrosive conditions using tandem LA-ICP-MS/LIBS. In MassSpec-Forum Vienna, Vienna, February 2019.
• Maximilian Mayr. Investigation of polymer and copper degradation under corrosive conditions using LIBS and LA-ICP-MS. Master’s thesis, Vienna University of Technology, 2019.
• Manesh V. Mistry, Jonathon Cottom, K. Patel, Al-Moatassem El-Sayed, Gregor Pobegen, Thomas Aichinger, and Alexander L. Shluger. First principles study of the influence of the local steric environment on the incorporation and migration of NO in a-SiO lesssub greater 2 less /sub greater . Materials Science Forum, 963:194–198, July 2019. (doi:10.4028/www.scientific.net/msf.963.194)
• Sebastian Moser, Gerald Zernatto, Manuel Kleinbichler, Michael Nelhiebel, Johannes Zechner, Megan J. Cordill, and Reinhard Pippan. A novel setup for in situ monitoring of thermomechanically cycled thin film metallizations. JOM Journal of the Minerals Metals and Materials Society, Online, July 2019. (doi:10.1007/s11837-019-03695-2)
• Valeria Padovan, Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. Stress and recovery dynamics of drain current in GaN HD-GITs submitted to DC semi-ON stress. Microelectronics Reliability, 100–101:113482, 2019. (doi:10.1016/j.microrel.2019.113482)
• Barbara Pedretscher, Barbara Kaltenbacher, and Olivia Pfeiler. Parameter identification and uncertainty quantification in stochastic state space models and its application to texture analysis. Applied Numerical Mathematics, 146:38–54, 2019. (doi:10.1016/j.apnum.2019.06.020)
• Barbara Pedretscher. State Space Modeling of Thermo-Mechanical Fatigue. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2019.
• Martin Pleschberger, Michael Scheiber, and Stefan Schrunner. Simulated analog wafer test data for pattern recognition, January 2019. (doi:10.5281/ZENODO.2542504)
• Martin Pleschberger, Anja Zernig, and Andre Kaestner. Novel challenges for root cause investigation in semiconductor manufacturing. In 19^th European Advanced Process Control and Manufacturing Conference, Villach, Austria, April 2019.
• Martin Pleschberger, Stefan Schrunner, and Jürgen Pilz. An explicit solution for image restoration using markov random fields. Journal of Signal Processing Systems, online, August 2019. (doi:10.1007/s11265-019-01470-9)
• Patrick Plum, Horst Lewitschnig, and Jürgen Pilz. Exact confidence bounds for a series reliability system. In 10^th International Workshop on Simulation and Statistics, Salzburg, Austria, September 2019.
• Gregor Pobegen and Hans-Joachim Schulze. Die 4H-SiC/SiO2-Grenzfläche in SiC-basierten Power-MOSFETs, 2019.
• Gregor Pobegen, Thomas Aichinger, and Gerald Rescher. Threshold voltage instabilities in 4H-SiC MOSFETs. In ICSCRM: International Conference on Silicon Carbide and Related Materials, Kyoto, Japan, 2019.
• Lydia Pock. Hierarchical stochastic models in frontend production. Master’s thesis, Universität Wien, 2019.
• Fabian Rasinger, Jennifer Prohinig, Holger Schulze, Hans-Joachim Schulze, and Gregor Pobegen. Annealing of pt-h defects in high-voltage si p mathplus /n- diodes. physica status solidi (a), 216(17):1900197, July 2019. (doi:10.1002/pssa.201900197)
• Fabian Rasinger, Martin Hauck, Gerald Rescher, Thomas Aichinger, Heiko B. Weber, Michael Krieger, and Gregor Pobegen. On the origin of drain current transients and subthreshold sweep hysteresis in 4H-SiC MOSFETs. Applied Physics Letters, 115(15):152102, 2019. (doi:10.1063/1.5117829)
• Bernhard Ruch, Gregor Pobegen, Maximilian Rosch, Rajeev Krishna Vytla, and Tibor Grasser. Charge pumping of low-voltage silicon trench powers MOSFETs. IEEE Transactions on Device and Materials Reliability, 19(1):133–139, March 2019. (doi:10.1109/tdmr.2019.2891794)
• Tiago Santos, Stefan Schrunner, Bernhard C. Geiger, Olivia Pfeiler, Anja Zernig, Andre Kaestner, and Roman Kern. Feature extraction from analog wafermaps: A comparison of classical image processing and a deep generative model. IEEE Transactions on Semiconductor Manufacturing, 32(2):190–198, May 2019. (doi:10.1109/TSM.2019.2911061)
• Daniel Schirmbrand. Design of an intelligent gate driver test system for stress testing of power MOSFETs. Bachelor’s thesis, Munich University of Applied Sciences, Munich, Germany, 2019.
• Christian Schleich, Judith Berens, Gerhard Rzepa, Gregor Pobegen, Gerald Rescher, Stanislav Tyaginov, Tibor Grasser, and Michael Waltl. Physical modeling of bias temperature instabilities in SiC MOSFETs. In 2019 IEEE International Electron Devices Meeting (IEDM). IEEE, December 2019. (doi:10.1109/iedm19573.2019.8993446)
• Stefan Schrunner, Olivia Pfeiler, Anja Zernig, and Jürgen Pilz. How to predict the lifetime of semiconductors in real-world applications with limited test resources? In Jürgen Wittmann and Werner Bergholz, editors, Quality Management in Technology 2019, pages 53–92. Independently published, Berlin, Germany, July 2019.
• Stefan Schrunner, Anna Jenul, Michael Scheiber, Anja Zernig, Andre Kaestner, and Roman Kern. A health factor for process patterns enhancing semiconductor manufacturing by pattern recognition in analog wafermaps. In IEEE International Conference on Systems, Man and Cybernetics (SMC), pages 3555–3560. IEEE, 2019.
• Stefan Schrunner. Pattern Recognition in Analog Wafer Test Data – A Health Factor for Process Patterns. PhD thesis, Graz University of Technology, Graz, Austria, August 2019.
• Markus Sievers, Michael Glavanovics, Christoph Rhinow, and Bettina Findenig. Modular application relevant stress testing for next generation power semiconductors. Microelectronics Reliability, 100–101:113330, 2019. (doi:10.1016/j.microrel.2019.06.022)
• Imane Souli, Georg C. Gruber, Velislava L. Terziyska, Johannes Zechner, and Christian Mitterer. Thermal stability of immiscible sputter-deposited Cu-Mo thin films. Journal of Alloys and Compounds, 783:208–218, April 2019. (doi:10.1016/j.jallcom.2018.12.250)
• Benjamin Steinwender. Modular test system using Lua script language. In European Certified LabVIEW Architect Summit, AGH University of Science and Technology, Krakow, Poland, April 2019.
• Fabian Triendl, Gernot Fleckl, Michael Schneider, Georg Pfusterschmied, and Ulrich Schmid. Evaluation of interface trap characterization methods in 4H-SiC metal oxide semiconductor structures over a wide temperature range. Journal of Vacuum Science & Technology B, 37(3):032903, May 2019. Article. (doi:10.1116/1.5094137)
• Yashas Nagaraj Udupa. Real-time efficient scaling mechanism for high speed processing of analog measurements. Master’s thesis, Graz University of Technology, 2019.
• Lars Varain, Silvia Larisegger, Michael Nelhiebel, and Günter Fafilek. Electrochemical investigation of ion diffusion through polymer membranes in combination with FEM modelling. In European Corrosion Congress, Seville, Spain, 2019.
• Mark Witczak. Simulation study of the goodness-of-fit analysis of parameter estimates in bivariate lifetime models. Master’s thesis, Technical University Berlin, 2019.
• Anja Zernig, Stefan Schrunner, and Martin Pleschberger. Data science along the semiconductor frontend production. In Statistische Woche, Linz, Austria, September 2019.
• Anja Zernig, Stefan Schrunner, Martin Pleschberger, Anna Jenul, Michael Scheiber, and Andre Kaestner. Machine learning techniques for automated wafer health assessment using wafer test data. In 19^th European Advanced Process Control and Manufacturing Conference, 2019.

2018 ▾

• Thomas Aichinger, Gerald Rescher, and Gregor Pobegen. Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs. Microelectronics Reliability, 80:68–78, January 2018. (doi:10.1016/j.microrel.2017.11.020)
• Dženana Alagić and Jürgen Pilz. Unsupervised algorithm to detect damage patterns in microstructure images of metal films. In IEEE International Conference on Image Processing, Applications and Systems (IPAS), Sophia Antipolis, France, December 2018. IEEE. (doi:10.1109/IPAS.2018.8708852)
• Dženana Alagić, Olivia Bluder, and Jürgen Pilz. Quantification and prediction of damage in sam images of semiconductor devices. In Image Analysis and Recognition, pages 490–496. Springer, June 2018. (doi:10.1007/978-3-319-93000-8_55)
• Julia Appenroth. Ion diffusion in polyimides from aqueous solution, measured with ToF-SIMS. Master’s thesis, Vienna University of Technology, 2018.
• Sergei Bauer. Autonomous driving vehicle internal communication enclosure advice. In IKT-Sicherheitskonferenz, Alpbach, Tirol, 2018.
• Sergei Bauer. Lightweight authentication for electrical control units (ecus) in led modules. In IKT-Sicherheitskonferenz, Alpbach, Tirol, 2018.
• Judith Berens. Cryogenic characterization of 4H-SiC high power MOSFET. Master’s thesis, RWTH Aachen University, Aachen, 2018.
• Mirko Bernardoni, Nicola Delmonte, Diego Chiozzi, and Paolo Cova. Non-linear thermal simulation at system level: compact modelling and experimental validation. Microelectronics Reliability, 80:223–229, January 2018. (doi:10.1016/j.microrel.2017.12.005)
• Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Johann Lohninger, and Andreas Limbeck. Spatial distinction of different polymers for the accurate determination of their trace metal content using libs. In Junganalytiker Forum 2018, Vienna, May 2018.
• Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Johann Lohninger, and Andreas Limbeck. Accurate analysis of trace metals in polymers with varying composition using libs and multivariate statistics. In European Workshop on Laser Ablation, Pau, France, 2018.
• Jonathon Cottom, Gernot Gruber, Gregor Pobegen, Thomas Aichinger, and Alexander L. Shluger. Recombination defects at the 4H-SiC/SiO2 interface investigated with electrically detected magnetic resonance and ab initio calculations. Journal of Applied Physics, 124(4):045302, 2018. (doi:10.1063/1.5024608)
• Sergio De Gasperi. Horizontal crack detection structures forpower technologies. Master’s thesis, Università degli Studi di Milano-Bicocca, 2018.
• Chaowei Du, Rafael Soler, Bernhard Voelker, Kurt Matoy, Johannes Zechner, Gregor Langer, Kirchlechner Christoph, and Gerhard Dehm. Pathways for reliable lead-free solder joints: Micro-fracture properties of Au-Sn based solder. In ESMC – European Solid Mechanics Conference, Bologna, IT, July 2018.
• Sascha Einspieler, Benjamin Steinwender, and Wilfried Elmenreich. Integrating Time-Triggered and Event-Triggered Traffic in a Hard Real-Time System. In 1^st IEEE International Conference on Industrial Cyber-Physical Systems (ICPS), pages 122–128, May 2018. (doi:10.1109/ICPHYS.2018.8387647)
• Bettina Findenig. Design of a power supply for a diagnostic gate driver in a high voltage application stress test. Master’s thesis, Carinthia University of Applied Sciences, 2018.
• Tibor Grasser, B. Stampfer, Michael Waltl, Gerhard Rzepa, K. Rupp, F. Schanovsky, Gregor Pobegen, K. Puschkarsky, Hans Reisinger, B. O’Sullivan, and Ben Kaczer. Characterization and physical modeling of the temporal evolution of near-interfacial states resulting from nbti/pbti stress in nmos/pmos transistors. In International Reliability Physics Symposium, pages 2A.2–1–2A.2–10. IEEE, 2018. (doi:10.1109/IRPS.2018.8353540)
• Gernot Gruber, Christian Gspan, Evelin Fisslthaler, Martina Dienstleder, Gregor Pobegen, Thomas Aichinger, Robert Meszaros, Werner Grogger, and Peter Hadley. Impact of the no anneal on the microscopic structure and chemical composition of the si‐face 4H‐sic/sio2 interface. Advanced Materials Interfaces, 0(0):1800022, 2018. (doi:10.1002/admi.201800022)
• Dieter Haerle. Trends and challenges in analog and mixed-signal-verification. In Frontiers of Analog Design 2018 (FAC2018), 2018.
• Paul Hoffmann. Elasto-plastic finite element simulations of nanoindentation problems utilizing hill’s potential. Master’s thesis, TU Wien, 2018.
• Barbara Kaltenbacher and Barbara Pedretscher. Parameter estimation in sdes via the Fokker–planck equation: Likelihood function and adjoint based gradient computation. Journal of Mathematical Analysis and Applications, In Press, 2018. (doi:10.1016/j.jmaa.2018.05.048)
• Andreas Kleinbichler. Adhesion of critical interfaces in microelectronics. PhD thesis, Montanuniversität Leoben, 2018.
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. Trap-related localized breakdown in carbon-doped GaN. In International Conference on the Physics of Semiconductors (ICPS), July 2018.
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. Effect of carbon-doping on charging/discharging dynamics and leakage behavior of carbon-doped gan. Transactions on Electron Devices, 65(12):5314–5321, December 2018. (doi:10.1109/TED.2018.2872552)
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. The role and mechanism of carbon in insulating gan buffers. In International Workshop on Nitride Semiconductors (IWN), 2018.
• Marco Kraigher. Verification of an HTOL Test by Use of an Advanced Embedded System. Bachelor’s thesis, Carinthia University of Applied Sciences, 2018.
• Elke Ludwig. Accelerated Corrosion Testing of the Copper/Polyimide System in Semiconductor Devices. PhD thesis, Vienna University of Technology, 2018.
• Niveditha Manjunath, Mario Heindl, Dieter Haerle, Stephen Sabanal, Herbert Eichinger, Hermann Tauber, Andreas Machne, Christian Manthey, Mikko Väänänen, Radu Grosu, and Dejan Nickovic. Production tests coverage analysis in the simulation environment. In IEEE International Test Conference (ITC), 2018. (doi:10.1109/TEST.2018.8624870)
• Barbara Pedretscher, Barbara Kaltenbacher, and Olivia Bluder. Parameter estimation in sdes via the fokker-planck equation: Likelihood function and adjoint based gradient computation. In 89^th GAMM Annual Meeting, 2018.
• Barbara Pedretscher, Barbara Kaltenbacher, Olivia Bluder, and Michael Nelhiebel. Fatigue degradation modeling with stochastic differential equations: Adjoint based parameter estimation & profile likelihood based uncertainty quantification. In 14^th Austrian Numerical Analysis Days, 2018.
• Martin Pleschberger. Runtime optimization for automated pattern analysis. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2018.
• Florian Peter Pribahsnik, Michael Nelhiebel, Marianne Mataln, Mirko Bernardoni, and Andreas Lindemann. Combined experimental and numerical approach to study electromechanical resonant phenomena in gan-on-si heterostructures. Microelectronics Reliability, 88-90:389–392, September 2018. (doi:10.1016/j.microrel.2018.07.042)
• Jennifer Prohinig, Fabian Rasinger, Hans-Joachim Schulze, and Gregor Pobegen. Influence of platinum-hydrogen complexes on silicon p+/n-diode characteristics. In 2018 International Semiconductor Conference (CAS), pages 223–226. IEEE, 2018.
• Jennifer Prohinig. Influence of Pt-H defects on Si p+/n diode characteristics. Master’s thesis, Graz University of Technology, 2018.
• Fabian Rasinger, Gregor Pobegen, Thomas Aichinger, Heiko B. Weber, and Michael Krieger. Determination of performance-relevant trapped charge in 4H silicon carbide MOSFETs. Materials Science Forum, 924:277–280, 2018. (doi:10.4028/www.scientific.net/MSF.924.277)
• Fabian Rasinger, Gregor Pobegen, Gerald Rescher, Thomas Aichinger, Heiko B. Weber, and Michael Krieger. On the understanding of drain current transients of 4h-sic trench mosfets. In European Conference on Silicon Carbide and Related Materials (ECSCRM), Birmingham, UK, 2018.
• Anna Regoutz, Gregor Pobegen, and Thomas Aichinger. Interface chemistry and electrical characteristics of 4h-SiC/SiO2 after nitridation in varying atmospheres. Journal of Materials Chemistry C, 6(44):12079–12085, 2018. (doi:10.1039/c8tc02935k)
• Clemens Reichel. Fracture mechanical simulation of indentation testing in gallium nitride. Master’s thesis, Vienna University of Technology, 2018.
• Michael Reisinger, Clemens Ostermaier, Manuel Tomberger, Johannes Zechner, B. Sartory, W. Ecker, I. Daumiller, and Jozef Keckes. Matching in-situ and ex-situ recorded stress gradients in an AlxGa1-xN heterostructure: Complementary wafer curvature analyses in time and space. Scripta Materialia, 147:50–54, April 2018. (doi:10.1016/j.scriptamat.2017.12.016)
• Michael Reisinger, Johannes Zechner, Manuel Tomberger, and Jozef Keckes. Cross-sectional residual stress gradient and dislocation analyses in alxga1-xn heterostructures. In Gordon Research Conference, Lewsiston, July 2018.
• Michael Reisinger, Johannes Zechner, Manuel Tomberger, and Jozef Keckes. Cross-sectional residual stress gradient and dislocation analyses in alxga1-xn heterostructures. In GDRi Mecano, Cargèse, France, October 2018.
• Gerald Rescher, Gregor Pobegen, Thomas Aichinger, and Tibor Grasser. Preconditioned bti on 4H-SiC: Proposal for a nearly delay time-independent measurement technique. IEEE Transactions on Electron Devices, 65(4):1419–1426, April 2018. (doi:10.1109/TED.2018.2803283)
• Gerald Rescher, Gregor Pobegen, Thomas Aichinger, and Tibor Grasser. Comprehensive evaluation of bias temperature instabilities on 4H-SiC mosfets using device preconditioning. Material Science Forum, 924, 2018. (doi:10.4028/www.scientific.net/MSF.924.671)
• Gerald Rescher. Behavior of SiC-MOSFETs under Temperature and Voltage Stress. PhD thesis, Vienna University of Technology, 2018.
• Stefan Schrunner, Olivia Bluder, Anja Zernig, Andre Kästner, and Roman Kern. A comparison of supervised approaches for process pattern recognition in analog semiconductor wafer test data. In 17^th IEEE International Conference on Machine Learning and Applications (ICMLA), pages 820–823, December 2018. (doi:10.1109/ICMLA.2018.00131)
• Markus Sievers, Michael Glavanovics, Benjamin Steinwender, Thomas Aichinger, Christoph Rhinow, and Christof Kofler. Modular HV application SiC stress testing. In Infineon Power Conference 2018, 2018.
• Roland Sleik. System Level Reliability Testing Under Application Stress Conditions. PhD thesis, Graz University of Technology, June 2018.
• Julia Straeussnigg. Adhesion of sin and algan interface. Bachelor’s thesis, University of Leoben, 2018.
• Stanislav E. Tyaginov, M. Jech, Gerhard Rzepa, Alexander Grill, Al-Moatassem El-Sayed, Gregor Pobegen, A. Makarov, and Tibor Grasser. Border trap based modeling of sic transistor transfer characteristics. In International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, Lake Tahoe, CA, October 2018.
• Valentin Unger. Non-linear finite element simulaitons of nanoindentation in gallium nitride considering fracture mechanics and plasticity. Master’s thesis, Vienna University of Technology, 2018.
• Anja Zernig. Investigation of multi-run independent component analysis on simulated semiconductor data. In 18^th Annual Conference of the European Network for Business and Industrial Statistics (ENBIS-18), Nancy, France, September 2018.
• Anja Zernig. Product health assessment in semiconductor wafer test data. In APC-M: 18^th European Advanced Process Control and Manufacturing Conference, 2018.

2017 ▾

• Dženana Alagić. A statistical measure for fatigue induced degradation in metal layers. Master’s thesis, Alpen-Adria-Universität Klagenfurt, April 2017.
• Vedo Alagić. Test pattern extraction for semiconductor wafer test data. Master’s thesis, Alpen-Adria-Universität Klagenfurt, September 2017.
• Stephan Bigl, Claus O.W. Trost, Stefan Wurster, Megan J. Cordill, and Daniel Kiener. Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. Journal of Materials Research, 32(11):2022–2034, June 2017. (doi:10.1557/jmr.2017.199)
• Stephan Bigl. Thermo-mechanical behaviour of thick copper metallizations for power microelectronics. PhD thesis, Montanuniversität Leoben, 2017.
• Lukas Brunnbauer. Corrosion investigations with the system copper/polyimide for microelectronics. Master’s thesis, Vienna University of Technology, 2017.
• Diego Chiozzi. Electro-thermal simulations methodologies for automotive power electronic systems. PhD thesis, Università degli Studi di Parma, 2017.
• Antonio D’Amico, Christian Djelassi, Octavian Barbu, Dieter Haerle, Luca Petruzzi, and Andrea Baschirotto. A mixed-signal multi-functional system for current measurement and stress detection. In 13^th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), 2017. (doi:10.1109/PRIME.2017.7974099)
• Antonio D’Amico. Innovative analog and mixed-signal solutions for precise measurement of electrical quantities in power transistors. PhD thesis, Università di Milano-Bicocca, 2017.
• Sebastian Eiser, Mirko Bernardoni, Michael Nelhiebel, and Manfred Kaltenbacher. Finite-element analysis of coupled electro-thermal problems with strong scale separation. IEEE Transactions on Power Electronics, 32(1):561–570, January 2017. (doi:10.1109/tpel.2016.2527690)
• Marvin Engels. Thermomechanical characterization of thin metal films via laser-scannin-doppler vibrometry. Master’s thesis, FH Düsseldorf, 2017.
• Dario Esposito. Investigation of impact of mg out-diffusion profile on device behavior of gan enhancement mode power transistorsinvestigation of impact of mg out-diffusion profile on device behavior of gan enhancement mode power transistors. Master’s thesis, University of Padova, 2017.
• Alexander Fritzer. Design and evaluation of a new method for speed improved fault injection simulations in analog circuits. Master’s thesis, Carinthia University of Applied Sciences, 2017.
• Germano Galasso. Modelling the Nanosecond LASER Ablation of a Silicon Target. PhD thesis, Vienna University of Technology, Vienna, 2017.
• Michael Glavanovics, Sybille Ofner, Roland Sleik, Michael Nelhiebel, Abhimanyu Madan, and Oliver Haeberlen. Application Related Reliability Test Concept for GaN HEMT Power Devices. In Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE), pages 93–94, May 2017.
• Tibor Grasser, Michael Waltl, K. Puschkarsky, B. Stampfer, Gerhard Rzepa, Gregor Pobegen, Hans Reisinger, H. Arimura, and Ben Kaczer. Implications of gate-sided hydrogen release for post-stress degradation build-up after bti stress. In International Reliability Physics Symposium, pages 6A–2.1–6A–2.6. IEEE, 2017. (doi:10.1109/IRPS.2017.7936334)
• Gernot Gruber, Jonathon Cottom, Robert Meszaros, Markus Koch, Gregor Pobegen, Thomas Aichinger, Dethard Peters, and Peter Hadley. Electrically detected magnetic resonance of carbon dangling bonds at the si-face 4H-SiC/sio2 interface. Journal of Applied Physics, 123(16):161514, 2017. (doi:10.1063/1.4985856)
• Ramin Hasani, Dieter Haerle, Christian F. Baumgartner, and Radu Grosu. Compositional neural-network modeling of complex analog circuits. In International Joint Conference on Neural Networks (IJCNN), pages 2235–2242. IEEE, May 2017. (doi:10.1109/IJCNN.2017.7966126)
• Ramin Hasani, Dieter Haerle, and Radu Grosu. Behavioral modeling of a CMOS band-gap voltage reference circuit using narx neural networks. In DATE 2017, 2017.
• Martin Hauck, Julietta Weisse, Johannes Lehmeyer, Gregor Pobegen, Heiko B. Weber, and Michael Krieger. Quantitative investigation of near interface traps in 4H-SiC mosfets via drain current deep level transient spectroscopy. In Material Science Forum, volume 897, pages 111–114, 2017. (doi:10.4028/www.scientific.net/MSF.897.111)
• Mario Heindl. Systematic testing of analog-mixed signal systems. Master’s thesis, Vienna University of Technology, 2017.
• Sabine Holzer. Migration Behaviour of Mobile Ions within Chemical Vapour Deposited Silicon Oxide Layers. PhD thesis, TU Wien, 2017.
• Tariqul Islam, Johannes Zechner, Mirko Bernardoni, Michael Nelhiebel, and Reinhard Pippan. A novel setup for wafer curvature measurement at very high heating rates. Review of Scientific Instruments, 88(2):024709, February 2017. (doi:10.1063/1.4975378)
• Anna Jenul. Application and verification study of independent component analysis. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2017.
• Andreas Kleinbichler, Johannes Zechner, and Megan J. Cordill. Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces. Microelectronic Engineering, 167:63–68, January 2017. (doi:10.1016/j.mee.2016.10.020)
• Andreas Kleinbichler, Juraj Todt, Johannes Zechner, Stefan Wöhlert, Daniel M. Többens, and Megan J. Cordill. Influence of annealing treatments on the adhesion of tungsten based barrier layers. In 44^th International Conference on Metallurgical Coatings and Thin Films (ICMCTF), April 2017.
• Andreas Kleinbichler, Manuel Pfeifenberger, Johannes Zechner, Neville Moody, David Bahr, and Megan J. Cordill. New insights into nanoindentation-based adhesion testing. JOM, 69(11):2237–2245, August 2017. (doi:10.1007/s11837-017-2496-2)
• Andreas Kleinbichler, Johannes Zechner, and Megan J. Cordill. Indentation and scratch induced delamination of silicon nitride films with stressed overlayers for interfacial adhesion measurements. In European Congress and Exhibition on Advanced Materials and Processes (EUROMAT), September 2017.
• Andreas Kleinbichler, Juraj Todt, Johannes Zechner, Stefan Wöhlert, Daniel M. Többens, and Megan J. Cordill. Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers. Surface and Coatings Technology, 332:376–381, December 2017. (doi:10.1016/j.surfcoat.2017.07.087)
• Christof Kofler. Interfacing digital diagnostic gate-drivers in a high voltage application stress test. Master’s thesis, Carinthia University of Applied Sciences, 2017.
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. Leakage and voltage blocking behavior of carbon-doped gan buffer layers. In Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE), Las Palmas de Gran Canaria, Spain, May 2017.
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. Transient capacitance analysis of thin carbon-doped gan (gan:c) layers. In International Conference on Nitride Semiconductors (ICNS), Strasbourg, France, July 2017.
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, and Dionyz Pogany. Evidence of defect band in carbon-doped GaN controlling leakage current and trapping dynamics. In International Electron Devices Meeting, pages 3341–3344. IEEE, December 2017. (doi:10.1109/IEDM.2017.8268491)
• Christian Koller, Gregor Pobegen, Clemens Ostermaier, Martin Huber, and Dionyz Pogany. The interplay of blocking properties with charge and potential redistribution in thin carbon-doped GaN on n-doped GaN layers. Applied Physics Letters, 111(3):032106, 2017. (doi:10.1063/1.4993571)
• Andrea Lavarda, Bernd Deutschmann, and Dieter Haerle. Enhancement of the dpi method for IC immunity characterization. In 11^th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMCCompo), 2017. (doi:10.1109/EMCCompo.2017.7998106)
• Andrea Lavarda, Bernd Deutschmann, and Dieter Haerle. On the robustness of CMOS chopped operational amplifiers to conducted electromagnetic interferences. IEEE Transactions on Electromagnetic Compatibility, 60(2), 2017. (doi:10.1109/TEMC.2017.2729781)
• Elke Ludwig, Paul Linhardt, Maximilian Bonta, Andreas Limbeck, J. Frank, Silvia Larisegger, and Michael Nelhiebel. Corrosion of copper in combination with polyimid. In European Corrosion Congress, 2017.
• Horst Moskalenko. Prototype design of a time triggered real-time network. Master’s thesis, Hochschule für Technik und Wirtschaft, 2017.
• Barbara Pedretscher, Olivia Bluder, and Barbara Kaltenbacher. Mathematical degradation modeling for metal films. In 88^th GAMM Annual Meeting, 2017.
• Barbara Pedretscher, Barbara Kaltenbacher, and Olivia Bluder. Parameter identification in stochastic differential equations to model the degradation of metal films. Proceedings in Applied Mathematics and Mechanics, 17(1):775–776, 2017. (doi:10.1002/pamm.201710355)
• Bastian Albrecht Philippi, Kurt Matoy, Johannes Zechner, Christoph Kirchlechner, and Gerhard Dehm. Microcantilever fracture testing of intermetallic cu3sn in lead-free solder interconnects. Journal of Electronic Materials, 46(3):1607–1611, January 2017. (doi:10.1007/s11664-016-5203-0)
• Arpitha Prabhakara. Design and implementation of a bootloader applied in a distributed microcontroller network for power semiconductor stress test system. Master’s thesis, Hochschule Darmstadt – University of Applied Sciences, 2017.
• Florian Peter Pribahsnik, Michael Nelhiebel, Marianne Mataln, Mirko Bernardoni, Gerhard Prechtl, Frank Altmann, David Poppitz, and Andreas Lindemann. High temperature failure mode in power GaN devices. In Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE), May 2017.
• Florian Peter Pribahsnik, Michael Nelhiebel, Marianne Mataln, Mirko Bernardoni, Gerhard Prechtl, Frank Altmann, David Poppitz, and Andreas Lindemann. Exploring the thermal limit of GaN power devices under extreme overload conditions. Microelectronics Reliability, 76(Supplement C):304–308, 2017. (doi:10.1016/j.microrel.2017.07.046)
• Fabian Rasinger, Gregor Pobegen, Thomas Aichinger, H. Weber, and M. Krieger. Determination of performance-relevant trapped charge in 4H silicon carbide mosfets. In ICSCRM, page TU.B1.4, 2017.
• Michael Reisinger, Manuel Tomberger, Johannes Zechner, I. Daumiller, B. Sartory, W. Ecker, Jozef Keckes, and Rainer T. Lechner. Resolving alternating stress gradients and dislocation densities across AlxGa1-xN multilayer structures on si(111). Applied Physics Letters, 111(16):162103, October 2017. (doi:10.1063/1.4998694)
• Michael Reisinger, Clemens Ostermaier, Manuel Tomberger, Johannes Zechner, and Jozef Keckes. Residual stress depth gradient analysis in GaN heterostructures. In MRS Fall Meeting, Boston, MA, November 2017.
• Michael Reisinger. Depth resolved stress gradient and dislocation analyses in III-N multilayer structures. PhD thesis, Montanuniversität Leoben, 2017.
• Sabine Reither, Werner Artner, Andreas Eder, Silvia Larisegger, Michael Nelhiebel, Christoph Eisenmenger-Sittner, and Günther Fafilek. On the in-situ grazing incidence x-ray diffraction of electrochemically formed thin films. ECS Transactions, 80(10):1231–1238, 2017. (doi:10.1149/08010.1231ecst)
• Sabine Reither, Maximilian Bonta, Silvia Larisegger, Michael Nelhiebel, Andreas Limbeck, and Günther Fafilek. Electrochemical characterization of copper films and comparison of strategies for corrosion protection. In European Corrosion Congress, 2017.
• Gerald Rescher, Gregor Pobegen, Thomas Aichinger, and Tibor Grasser. Comprehensive evaluation of bias temperature instabilities of 4H-SiC mosfets using device preconditioning. In ICSCRM, page MO.DP.12, 2017.
• Gerald Rescher, Gregor Pobegen, Thomas Aichinger, and Tibor Grasser. Improved interface trap density close to the conduction band edge of a-face 4H-SiC mosfets revealed using the charge pumping technique. Materials Science Forum, 897:143–146, 2017. (doi:10.4028/www.scientific.net/MSF.897.143)
• Christoph Rhinow. Development and validation of a diagnostic gate driver for high-voltage transistors. Master’s thesis, Politecnico di Milano, 2017.
• Stefan Schrunner, Olivia Bluder, Anja Zernig, Andre Kaestner, and Roman Kern. Markov random fields for pattern extraction in analog wafer test data. In 17^th International Conference on Image Processing Theory, Tools and Applications (IPTA), November 2017. (doi:10.1109/IPTA.2017.8310124)
• Stefan Schrunner, Olivia Bluder, and Jürgen Pilz. Optimal experimental design for semiconductor lifetime mission profile testing. Journal of Multidisciplinary Engineering Science Studies, 3(2), 2017.
• Stefan Schwab, Julia Appenroth, Maximilian Bonta, Sabine Holzer, Michael Bauer, Stefan Miethaner, Andreas Limbeck, Michael Nelhiebel, Peter Weinberger, and Herbert Hutter. Measuring sodium migration in mold compounds using a sodium amalgam electrode as an infinite source. In 2017 IEEE 67^th Electronic Components and Technology Conference (ECTC). IEEE, May 2017. (doi:10.1109/ectc.2017.52)
• Stefan Schwab, Julia Appenroth, Sabine Holzer, Stefan Miethaner, Michael Bauer, Holger Doepke, Michael Nelhiebel, and Herbert Hutter. Measurement of ion diffusion in polymers used for semiconductor packaging. In 21^st International Conference on Secondary Ion Mass Spectrometry (SIMS21), Kraków, Poland, September 2017.
• Stefan Schwab, Julia Appenroth, J. Jung, Sabine Gruber, Michael Bauer, Stefan Miethaner, Michael Nelhiebel, and Herbert Hutter. Reduction of sodium migration in polymers by addition of 15-crown-5 as getter substance. In Proceedings of STEP 10, 2017.
• Stefan Schwab, Maximilian Bonta, T. Anderl, Andreas Limbeck, S. Kayser, Z. Julia, Stefan Miethaner, Michael Bauer, Michael Nelhiebel, and Herbert Hutter. Direct measurement of sodium concentration in different poly-imides with la-icp-ms, libs, ar-cluster tof-sims and o2-cluster tof-sims: a method comparison. In European Conference on Applications of Surface and Interface Analysis (ECASIA), 2017.
• Stefan Schwab. Ion Diffusion and Migration in Semiconductor Passivation and Encapsulation Materials. PhD thesis, Vienna University of Technology, Wien, 2017.
• Roland Sleik, Michael Glavanovics, Yevhen Nikitin, Marco Di Bernardo, Annette Muetze, and Klaus Krischan. Performance enhancement of a modular test system for power semiconductors for HTOL testing by use of an embedded system. In Proceedings of the 19^th European Conference on Power Electronics and Applications (EPE’17 ECCE Europe). IEEE, September 2017. (doi:10.23919/EPE17ECCEEurope.2017.8098933)
• Roland Sleik, Michael Glavanovics, Sascha Einspieler, Annette Muetze, and Klaus Krischan. Modular test system architecture for device, circuit and system level reliability testing and condition monitoring. IEEE Transactions on Industry Applications, 53(6):5698–5708, November 2017. (doi:10.1109/TIA.2017.2724501)
• Imane Souli, Velislava L. Terziyska, Jozef Keckes, Werner Robl, Johannes Zechner, and Christian Mitterer. Effect of growth conditions on interface stability and thermophysical properties of sputtered cu films on si with and without WTi barrier layers. Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, 35(2):022201, March 2017. (doi:10.1116/1.4975805)
• Martin Springer. Modeling and Simulation of Fatigue Damage in Power Semiconductors. PhD thesis, Vienna University of Technology, 2017.
• Roberta Stradiotto, Gregor Pobegen, Clemens Ostermaier, Michael Waltl, Alexander Grill, and Tibor Grasser. Characterization of interface defects with distributed activation energies in GaN-based MIS-HEMTs. IEEE Transactions on Electron Devices, 64(3):1045–1052, March 2017. (doi:10.1109/ted.2017.2655367)
• Alexander Ulbing. Grade zero – evaluation of an advanced per site thermal management system for power device qualification under grade-zero conditions. Master’s thesis, Carinthia University of Applied Sciences, 2017.
• Paul Ullmann. Method for real-time observation of thermo-mechanical induced fatigue in copper thin films. Master’s thesis, Vienna University of Technology, 2017.
• Philipp Wedenig. Machine learning methods to detect damage patterns in microstructure images. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2017.
• Magdalena Weger. Impact of high temperature annealing in ammonia on the gate oxide of sic mosfets. Bachelor’s thesis, University of Vienna, 2017.
• Johannes Zechner, Tariqul Islam, Mirko Bernardoni, and Michael Nelhiebel. Strain rate influence on the thermo-mechanical deformation behavior of aluminum thin films. In Nanomechanical Testing in Materials Research and Development VI, 2017.
• Anja Zernig, Olivia Bluder, Jürgen Pilz, Andre Kästner, and Alban Krauth. Identification of risk devices using independent component analysis for semiconductor measurement data. International Journal of Industrial Engineering: Theory, Applications and Practice, 23(5), 2017.
• Anja Zernig. Applicability and robustness of ICA for semiconductor data. In i-KNOW, Graz, Austria, 2017.

2016 ▾

• Julia Appenroth, Stefan Schwab, Michael Bauer, Stefan Miethaner, Michael Nelhiebel, and Herbert Hutter. Bestimmung von diffusionkoeffizienten für mobile ionen in mold compound. In 19. Arbeitstagung Angewandte Oberflächenanalytik, Soest, 2016.
• Sergei Bauer, Yevhen Nikitin, and Benjamin Steinwender. Comparing the sbRIO-9651 to the XMC4500 for a Real-Time Environment in HTOL Testing Systems. In NIDays 2016. National Instruments, March 2016.
• Sergei Bauer. Log-File Management with Database Structures Using Object Oriented Programming in LabVIEW. Technical report, Alpen-Adria-Universität Klagenfurt, February 2016.
• Sergei Bauer. Implementation of a Scalable Software Environment for HTOL Qualification Procedures. Master’s thesis, Alpen-Adria-Universität Klagenfurt, November 2016.
• Stephan Bigl, Thomas Schöberl, Stefan Wurster, Megan J. Cordill, and Daniel Kiener. Correlative Microstructure and Topography Informed Nanoindentation of Copper Films. Surface and Coatings Technology, 308:404–413, 2016. (doi:10.1016/j.surfcoat.2016.07.104)
• Diego Chiozzi, Mirko Bernardoni, Nicola Delmonte, and Paolo Cova. A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies. Microelectronics Reliability, 58:126–132, March 2016. (doi:10.1016/j.microrel.2015.11.029)
• Jonathon Cottom, Gernot Gruber, Gregor Pobegen, Thomas Aichinger, and Alexander L. Shluger. Identifying performance limiting defects in silicon carbide pn-junctions: A theoretical study. Materials Science Forum, 858:257–260, May 2016. (doi:10.4028/www.scientific.net/msf.858.257)
• Jonathon Cottom, Gernot Gruber, Peter Hadley, Markus Koch, Gregor Pobegen, Thomas Aichinger, and Alexander L. Shluger. Recombination centers in 4H-SiC investigated by electrically detected magnetic resonance and ab initio modeling. Journal of Applied Physics, 119(18), 2016. (doi:10.1063/1.4948242)
• Marco Di Bernardo. Hardware Development of an Embedded System for Automated Reliability Testing. Master’s thesis, Carinthia University of Applied Sciences, 2016.
• Antonio D’Amico, Florian Brugger, Dieter Haerle, Luca Petruzzi, and Andrea Baschirotto. A 10 bit A-to-D converter development within power optimized BCD technology. In 12^th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), June 2016. (doi:10.1109/PRIME.2016.7519505)
• Sebastian Eiser. An Extension to Nitsche-type Mortaring for Non-conforming Finite Elements. PhD thesis, Vienna University of Technology, 2016.
• Sabine Gruber, Stefan Krivec, Gregor Pobegen, Stefan Schwab, and Herbert Hutter. Insertion behavior of sodium and potassium ions into thin CVD-SiOxlayers by means of a triangular voltage sweep method. Surface and Interface Analysis, 48(7):636–649, March 2016. (doi:10.1002/sia.5974)
• Gernot Gruber. Identification of defects in 4H-SiC devices using electrically detected magnetic resonance. PhD thesis, Graz University of Technology, 2016.
• Stefan Hartl, Johannes Zechner, Megan J. Cordill, and Reinhard Pippan. Fatigue behavior of thin-film power copper on silicon substrate under cyclic bending conditions. In Materials for advanced metallization conference (MAM), 2016.
• Ramin Hasani, Dieter Haerle, and Radu Grosu. Efficient modeling of complex analog integrated circuits using neural networks. In 2016 12^th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). Institute of Electrical and Electronics Engineers (IEEE), June 2016. (doi:10.1109/prime.2016.7519486)
• Tariqul Islam, Johannes Zechner, Mirko Bernardoni, and Michael Nelhiebel. Access to the thermo-mechanical deformation behavior of thin films during ultra-fast pulsed heating. In 14^th International Conference on Reliability and Stress-Related Phenomena in Nanoelectronics, 2016.
• Andreas Kleinbichler, Johannes Zechner, and Megan J. Cordill. Influence of annealing treatments on the adhesion of metal barrier layers. In Gordon Research Seminar, Lewiston, US, July 2016.
• Andreas Kleinbichler, Johannes Zechner, and Megan J. Cordill. Influence of annealing treatments on the adhesion of metal barrier layers. In Gordon research conference, Lewiston, USA, 2016.
• Andreas Kleinbichler, Johannes Zechner, and Megan J. Cordill. Mechanical adhesion testing techniques for metal dielectric interfaces. In Materials for advanced metallization conference (MAM), Brussels, Belgium, 2016.
• Helmut Kock, Sebastian Eiser, and Manfred Kaltenbacher. Electrothermal multiscale modeling and simulation concepts for power electronics. IEEE Transactions on Power Electronics, 31(4):3128–3140, April 2016. (doi:10.1109/tpel.2015.2453480)
• Elke Ludwig, G. Ball, J. Frank, Maximilian Bonta, Silvia Larisegger, Michael Nelhiebel, and Paul Linhardt. Corrosion of copper in combination with polymers. In European Corrosion Congress, Montpellier, France, September 2016.
• Sebastian Maasz. Development and characterization of high-temperature stress tests for IGBT devices. Master’s thesis, Vienna University of Technology, 2016.
• Frederic Maurer. Outlier detection zur identifikation auffälliger stresstestergebnisse von intelligenten leistungshalbleitern. Master’s thesis, Universität Trier, 2016.
• Robert Meszaros. Cryogenic electrically detected magnetic resonance of defects at the SiC-sio2 interface. Master’s thesis, Graz University of Technology, Graz, 2016.
• Nils Kristian Möse. Development of a simulation framework to study moisture propagation in packaged electronic devices. Master’s thesis, Universität Bremen, 2016.
• Bastian Philippi, Kurt Matoy, Johannes Zechner, Christoph Kirchlechner, and Gerhard Dehm. Micro-cantilever fracture testing of intermetallic cu3sn in lead-free solder microelectronics. In Gordon Research Conference, Lewiston, USA, July 2016.
• Bastian Albrecht Philippi, Kurt Matoy, Johannes Zechner, Christoph Kirchlechner, and Gerhard Dehm. Fracture toughness of intermetallic cu 6 sn 5 in lead-free solder microelectronics. Scripta Materialia, 123:38–41, October 2016. (doi:10.1016/j.scriptamat.2016.05.039)
• Bastian Albrecht Philippi, Kurt Matoy, Johannes Zechner, Christoph Kirchlechner, and Gerhard Dehm. Micromechanical testing of individual microstructure elements in lead-free solder joints. In Materials Science and Engineering, 2016.
• Bastian Albrecht Philippi. Micromechanical characterization of lead-free solder and its individual microstructure elements. PhD thesis, Ruhr-Universität Bochum, Bochum, 2016.
• Gregor Pobegen, Julietta Weisse, Martin Hauck, Heiko B. Weber, and Michael Krieger. On the origin of threshold voltage instability under operating conditions of 4h-SiC n-channel MOSFETs. Materials Science Forum, 858:473–476, May 2016. (doi:10.4028/www.scientific.net/msf.858.473)
• Florian Peter Pribahsnik. Impact of reverse piezoelectric effect on power gan devices. In 27^th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Halle, Germany, 2016. ESREF.
• Jennifer Prohinig. Electrical properties of SiC-mosfets annealed in nitric oxide and oxygen atmospheres. Bachelor’s thesis, Graz University of Technology, Graz, 2016.
• Michael Reisinger, B. Sartory, M. Meindlhumer, Johannes Zechner, I. Daumiller, W. Ecker, and Jozef Keckes. Fracture behaviour and internal stress gradients in gan heterostructures studied by fib techniques. In 44^th International conference on metallurgical coatings and thin films (ICMCTF), San Diego, CA, USA, April 2016.
• Michael Reisinger, J. Zalesak, R. Daniel, Manuel Tomberger, J.K. Weiss, A.D. Darbal, M. Petrenec, Johannes Zechner, I. Daumiller, W. Ecker, B. Sartory, and Jozef Keckes. Cross-sectional stress distribution in alxga1-xn heterostructure on si(111) substrate characterized by ion beam layer removal method and precession electron diffraction. In 14^th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (IRSP), Bad Schandau, Germany, May 2016.
• Michael Reisinger, J. Zalesak, Manuel Tomberger, J.K. Weiss, M. Petrenec, Johannes Zechner, B. Sartory, Rainer T. Lechner, and Jozef Keckes. Residual stress gradients in gan heterostructures studied by fib and tem and xrd techniques. In International Materials Research Congress (IMRC), Canun, Mexico, August 2016.
• Michael Reisinger, J. Zalesak, R. Daniel, Manuel Tomberger, J.K. Weiss, A.D. Darbal, M. Petrenec, Johannes Zechner, I. Daumiller, W. Ecker, B. Sartory, and Jozef Keckes. Cross-sectional stress distribution in AlxGa1-xN heterostructure on si(111) substrate characterized by ion beam layer removal method and precession electron diffraction. Materials & Design, 106:476–481, September 2016. (doi:10.1016/j.matdes.2016.06.001)
• Sabine Reither, Silvia Larisegger, Michael Nelhiebel, and Günther Fafilek. Study on corrosion behavior of metallic copper in aqueous solutions of hno3 and hcl and the corrosion inhibiting effects of n and s. In European Corrosion Congress, Montpellier, France, September 2016.
• Gerald Rescher, Gregor Pobegen, Thomas Aichinger, and Tibor Grasser. On the subthreshold drain current sweep hysteresis of 4H-SiC nMOSFETs. In International Electron Devices Meeting (IEDM). Institute of Electrical and Electronics Engineers (IEEE), December 2016. (doi:10.1109/iedm.2016.7838392)
• Stefan Schrunner, Olivia Bluder, and Jürgen Pilz. Optimal design of experiments for crossover semiconductor lifetime studies. In 13^th Applied Statistics (AS2016), Bled, Slovenia, September 2016.
• Stefan Schrunner, Olivia Bluder, Anja Zernig, Andre Kästner, and Roman Kern. Health factor for process patterns. In SamI40 – 1^st International Workshop on Science, Application and Methods in Industry 4.0 at International Conference on Knowledge Technologies and Data-driven Business (i-KNOW 2016), Graz, Austria, October 2016.
• Stefan Schrunner, Olivia Bluder, and Jürgen Pilz. Optimal bayesian experimental design for crossover semiconductor lifetime studies. In International Conference of Applied Statistics, 2016.
• Stefan Schrunner. Optimal bayesian experimental design for crossover semiconductor lifetime studies. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2016.
• Stefan Schwab, T. Anderl, Sabine Gruber, Michael Bauer, Stefan Miethaner, Michael Nelhiebel, Andreas Limbeck, and Herbert Hutter. Vergleich der quantifizierung der natriumkonzentration in polyimiddünnfilmen mittels la-icp-ms u. tof sims. In 19. Arbeitstagung Angewandte Oberflächenanalytik, Soest, Germany, September 2016.
• Stefan Schwab, J. Jung, Sabine Gruber, Michael Bauer, Stefan Miethaner, Michael Nelhiebel, and Herbert Hutter. Investigation of electric field induced ion migration in semiconductor encapsulation materials without the interference of electron conductivity. ECS Journal of Solid State Science and Technology, 5(10):N72–N76, 2016. (doi:10.1149/2.0231610jss)
• Roland Sleik, Michael Glavanovics, Sascha Einspieler, Annette Muetze, and Klaus Krischan. Modular Test System Architecture for Device, Circuit and System Level Reliability Testing. In Proceedings of the 31^st annual IEEE Applied Power Electronics Conference and Exposition (APEC 2016), pages 759–765, Long Beach Convention Center, California, USA, April 2016. IEEE. (doi:10.1109/APEC.2016.7467957)
• Imane Souli, Christian Mitterer, Velislava L. Terziyska, Jozef Keckes, and Johannes Zechner. Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered cu films on si with and without wti barrier layers. In International Conference on Thin Films, Singapore, July 2016.
• Martin Springer, Michael Nelhiebel, and Heinz E. Pettermann. Fatigue crack growth modeling in the metallization of power semiconductors under cyclic thermo-mechanical loading. In 2016 17^th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), April 2016. (doi:10.1109/eurosime.2016.7463373)
• Martin Springer, Michael Nelhiebel, and Heinz E. Pettermann. Combined simulation of fatigue crack nucleation and propagation based on a damage indicator. Fracture and Structural Integrity, 38(38):155–161, October 2016. (doi:10.3221/IGF-ESIS.38.21)
• Benjamin Steinwender. A Distributed Controller Network for Modular Power Stress Tests. PhD thesis, Alpen-Adria-Universität Klagenfurt, June 2016.
• Roberta Stradiotto, Gregor Pobegen, Clemens Ostermaier, and Tibor Grasser. Characterization of charge trapping phenomena at III textendash n/dielectric interfaces. Solid-State Electronics, 125:142–153, November 2016. (doi:10.1016/j.sse.2016.07.017)
• Roberta Stradiotto. Characterization of electrically active defects at III-N/dielectric interfaces. PhD thesis, Vienna University of Technology, Vienna, 2016.
• Raphael Unterrainer. Arbeitstitel: Metallisierungssysteme zum temperaturmanagement für elektronische komponenten. Master’s thesis, Vienna University of Technology, Wien, 2016.
• Anja Zernig. Device Level Maverick Screening. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2016.

2015 ▾

• Raffaele Coppeta. Dislocation Modeling in III-Nitrides. PhD thesis, Vienna University of Technology, 2015.
• Tibor Grasser, Michael Waltl, Yannick Wimmer, Wolfgang Goes, Robert Kosik, Gerhard Rzepa, Hans Reisinger, Gregor Pobegen, Al-Moatassem El-Sayed, Alexander L. Shluger, and Ben Kaczer. Gate-sided hydrogen release as the origin of “permanent” NBTI degradation: From single defects to lifetimes. In 2015 IEEE International Electron Devices Meeting (IEDM). IEEE, December 2015. (doi:10.1109/iedm.2015.7409739)
• Tariqul Islam, Johannes Zechner, Mirko Bernardoni, and Michael Nelhiebel. A novel setup to study deformation mechanisms of thin films undergoing thermo-mechanical loading at high strain rates. In Materials Research Society Fall Meeting & Exhibit, 2015.
• Silvia Larisegger. Corrosion Phenomena and Corrosion Prevention of Copper Electrodes in Semiconductor Devices. PhD thesis, Vienna University of Technology, 2015.
• Andrea Lavarda and Bernd Deutschmann. Direct power injection (DPI) simulation framework and postprocessing. In 2015 IEEE International Symposium on Electromagnetic Compatibility, pages 1248–1253, August 2015. (doi:10.1109/ISEMC.2015.7256349)
• Andrea Lavarda and Bernd Deutschmann. Effects of single tone RF interferences on chopped operational amplifiers. In 2015 IEEE International Symposium on Electromagnetic Compatibility, pages 96–101, August 2015. (doi:10.1109/ISEMC.2015.7256139)
• Andrea Lavarda and Bernd Deutschmann. EMI improved chopped operational amplifier. In 10^th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, pages 72–76, November 2015. (doi:10.1109/EMCCompo.2015.7358333)
• Andrea Lavarda, Dominik Amschl, Susanne Bauer, and Bernd Deutschmann. Characterization of the immunity of integrated circuits (ICs) at wafer level. In 10^th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, pages 196–201, November 2015. (doi:10.1109/EMCCompo.2015.7358356)
• Yevhen Nikitin and Benjamin Steinwender. Dynamic Load Emulation using NI Single-Board RIO and LabVIEW FPGA. In NIDays 2015, 2015.
• Gerald Palatin. User-Configurable Firmware Generation for a local Microcontroller Node in a Modular Semiconductor Stress Test System. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2015.
• Barbara Pedretscher. An Inverse Problem to Simulate the Degradation Process of Semiconductor Devices. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2015.
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Bayesian Network Model with Application to Smart Power Semiconductor Lifetime Data. Risk Analysis, 35(9):1623–1639, September 2015. (doi:10.1111/risa.12342)
• Kathrin Plankensteiner. Application of Bayesian Networks and Stochastic Models to Predict Smart Power Switch Lifetime. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2015.
• Klaus Plankensteiner. Test Plan Generation and Verification for a Modular Power Stress Test System. Master’s thesis, Graz University of Technology, 2015.
• Gregor Pobegen and Andreas Krassnig. Instabilities of SiC MOSFETs during use conditions and following bias temperature stress. In 2015 IEEE International Reliability Physics Symposium. IEEE, April 2015. (doi:10.1109/irps.2015.7112771)
• Tiphaine Pélisset. Degradation Analysis of Thin Die-Attach Layer Under Cyclic Thermal Load in Microelectronics Packaging. PhD thesis, Montanuniversität, Leoben, 2015.
• Gerald Rescher, Gregor Pobegen, and Tibor Grasser. Threshold voltage instabilities of present SiC-power MOSFETs under positive bias temperature stress. In Silicon Carbide and Related Materials 2015, volume 858 of Materials Science Forum, pages 481–484. Trans Tech Publications Ltd, June 2015. (doi:10.4028/www.scientific.net/MSF.858.481)
• Gerald Rescher, Gregor Pobegen, and Thomas Aichinger. Impact of nitric oxide post oxidation anneal on the bias temperature in-stability and the on-resistance of 4H-SiC nMOSFETs. Materials Science Forum, 821-823:709–712, 2015. (doi:10.4028/www.scientific.net/MSF.821-823.709)
• Gerald Rescher. Electrical characterization of SiC MOSFET interface properties. Master’s thesis, Graz University of Technology, 2015.
• Benjamin Steinwender, Michael Glavanovics, and Wilfried Elmenreich. Executable Test Definition for a State Machine Driven Embedded Test Controller Module. In Proceedings of the 13^th IEEE International Conference on Industrial Informatics, 2015. (doi:10.1109/INDIN.2015.7281729)
• Roberta Stradiotto, Gregor Pobegen, Clemens Ostermaier, and Tibor Grasser. On the fly characterization of charge trapping phenomena at GaN/dielectric and GaN/AlGaN/dielectric interfaces using impedance measurements. In Solid State Device Research Conference (ESSDERC), 2015 45^th European, pages 72–75, September 2015. (doi:10.1109/ESSDERC.2015.7324716)
• Alexander Ulbing. Characterization of advanced power MOSFET devices with integrated current sensor structures. Bachelor’s thesis, Carinthia University of Applied Sciences, 2015.
• Bernhard Völker, Sriram Venkatesan, Walther Heinz, Kurt Matoy, Roman Roth, Jörg-Martin Batke, Megan J. Cordill, and Gerhard Dehm. Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending. Journal of Materials Research, 30(08):1090–1097, April 2015. (doi:10.1557/jmr.2015.88)
• Bernhard Völker, Walther Heinz, Kurt Matoy, Roman Roth, Jörg Batke, Thomas Schöberl, Megan J. Cordill, and Gerhard Dehm. Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass. Thin Solid Films, 583:170–176, May 2015. (doi:10.1016/j.tsf.2015.03.047)
• Bernhard Völker, Walther Heinz, Roman Roth, Jörg Batke, Megan J. Cordill, and Gerhard Dehm. Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM. Surface and Coatings Technology, 270, May 2015. (doi:10.1016/j.surfcoat.2015.03.027)
• Alexander Wimmer, Walther Heinz, Thomas Detzel, Werner Robl, M. Nellessen, Christoph Kirchlechner, and Gerhard Dehm. Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction. Acta Materialia, 83:460–469, January 2015. (doi:10.1016/j.actamat.2014.10.012)
• Alexander Wimmer, Walther Heinz, Alexander Leitner, Thomas Detzel, Werner Robl, Christoph Kirchlechner, and Gerhard Dehm. Micro-tension and ratcheting study of miniaturized cu lines at variable temperature. Acta Materialia, 92, July 2015. (doi:10.1016/j.actamat.2015.03.056)
• Anja Zernig, Olivia Bluder, Jürgen Pilz, and Andre Kästner. Sequential outlier detection to reveal risk devices in semiconductor industry. In ENBIS-15 Programme and Abstracts, 2015.
• Anja Zernig, Olivia Bluder, Jürgen Pilz, and Andre Kästner. Statistical hypothesis testing to detect unreliable semiconductor devices. In Eighth International Workshop on Simulation (IWS), 2015.
• Anja Zernig, Olivia Bluder, Jürgen Pilz, Andre Kästner, and Alban Krauth. Identification of risk devices usign Independent Component Analysis for semiconductor measurement data. In Proceedings of the International Symposium on Semiconductor Manufacturing Intelligence, 2015.

2014 ▾

• Thomas Aichinger and Michael Nelhiebel. Characterization of MOSFET interface states using the charge pumping technique. In Hot Carrier Degradation in Semiconductor Devices, pages 231–255. Springer International Publishing, October 2014. (doi:10.1007/978-3-319-08994-2_8)
• Thomas Aichinger, Gregor Pobegen, and Michael Nelhiebel. Application of on-chip device heating for BTI investigations. In Tibor Grasser, editor, Bias Temperature Instability for Devices and Circuits, pages 33–51. Springer New York, 2014. (doi:10.1007/978-1-4614-7909-3_2)
• Mathias Blank, Tobias Glück, Andreas Kugi, and Hans-Peter Kreuter. Slew rate control strategies for smart power ICs based on iterative learning control. In IEEE Applied Power Electronics Conference and Exposition – APEC. IEEE, March 2014. (doi:10.1109/apec.2014.6803710)
• Mathias Blank, Tobias Glück, Andreas Kugi, and Hans-Peter Kreuter. Power optimal gate current profiles for the slew rate control of smart power ICs. IFAC Proceedings Volumes, 47(3):7190–7195, 2014. (doi:10.3182/20140824-6-za-1003.00124)
• Olivia Bluder and Kathrin Plankensteiner. A Bayesian Model to Approximate DeltaT for Semiconductor Cyclic Stress Testing. In Second Bayesian Young Statisticians Meeting, BAYSM 2014, Vienna, Austria, 2014.
• Olivia Bluder, Schreiber Christoph, Michael Ebner, and Glavanovics Michael. A Model for DeltaT Approximation in Power Semiconductor Devices with Different DMOS Areas based on Energy Ramp Up Tests. In 14^th annual Conference of European Network on Business and Industrial Statistics, ENBIS-14, Linz, Austria, 2014.
• Olivia Bluder, Kathrin Plankensteiner, and Glavanovics Michael. Estimation of safe operating areas for power semiconductors via Bayesian reliability modeling. In International Bayesian Society World Meeting, ISBA 2014, Cancun, Mexico, 2014.
• Marx Raghu Raja Dharmaraj. Thermal and mechanical stress modeling of smart power switches under active loading in ANSYS. Master’s thesis, Carinthia University of Applied Sciences, 2014.
• Michael Fugger. Integrity of diffusion barriers in moder high-voltage power semiconductros. PhD thesis, Vienna University of Technology, 2014.
• Germano Galasso, Manfred Kaltenbacher, Balamurugan Karunamurthy, Hannes Eder, and Tobias Polster. Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers. In Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15^th international conference on, April 2014. (doi:10.1109/EuroSimE.2014.6813840)
• Gernot Gruber, Peter Hadley, Markus Koch, Thomas Aichinger, Stefan Kirnstötter, Holger Schulze, and Werner Schustereder. Electrically detected magnetic resonance study on defects in si pn-junctions created by proton implantation. In EMRS Spring Meeting, Lille, France, May 2014.
• Gernot Gruber, Stefan Kirnstötter, Peter Hadley, Markus Koch, Thomas Aichinger, Holger Schulze, and Werner Schustereder. Electrically detected magnetic resonance study on defects in Si pn-junctions created by proton implantation. physica status solidi (c), 11(11-12):1593–1596, August 2014. (doi:10.1002/pssc.201400053)
• Gernot Gruber, Peter Hadley, Markus Koch, and Thomas Aichinger. Electrically detected magnetic resonance study of defects created by hot carrier stress at the SiC/SiO2 interface of a SiC n-channel metal-oxide-semiconductor field-effect transistor. Applied Physics Letters, 105(4), 2014. (doi:10.1063/1.4891847)
• Gernot Gruber, Peter Hadley, Markus Koch, Dethard Peters, and Thomas Aichinger. Interface defects in SiC power MOSFETs – An electrically detected magnetic resonance study based on spin dependent recombination. In AIP Conference Proceedings, volume 1583, pages 165–168, 2014. (doi:10.1063/1.4865627)
• Walther Heinz, Werner Robl, and Gerhard Dehm. Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering, 137(0):5–10, 2014. Materials for Advanced Metallization 2014. (doi:10.1016/j.mee.2014.10.024)
• Walther Heinz, Werner Robl, and Gerhard Dehm. Thermo-mechanical fatigue behaviour of cu films on substrates. In Materials Science & Technology, 2014.
• Walther Heinz. Influence of initial microstructure on thermo-mechanical fatigue behaviour of cu films on substrates. In Materials for Advanced Metallization (MAM), 2014.
• Balamurugan Karunamurthy, Thomas Ostermann, Monojit Bhattacharya, and Sandipan Maity. A novel simulation methodology for full chip-package thermo-mechanical reliability investigations. Microelectronics Journal, 45(7), 2014. (doi:10.1016/j.mejo.2013.12.009)
• Grygoriy Kravchenko, Balamurugan Karunamurthy, and Heinz E. Pettermann. FEM Study of Fatigue Crack Growth in a Power Semiconductor Chip Subjected to Transient Thermal Loading. Procedia Materials Science, 3:63–70, 2014. (doi:10.1016/j.mspro.2014.06.014)
• Grygoriy Kravchenko. Numerical simulations of fatigue crack problems in semiconductor devices subjected to thermomechanical loading. PhD thesis, Vienna University of Technology, 2014.
• Helmut Köck, Caitlin A. Chapin, Clemens Ostermaier, Oliver Häberlen, and Debbie G. Senesky. Emerging GaN-based HEMTs for mechanical sensing within harsh environments. In Proc. SPIE, volume 9113, pages 91130D–91130D–8, 2014. (doi:10.1117/12.2051568)
• Abhimanyu Madan. Gallium Nitride Power JFET Stress Test. Master’s thesis, Technical University of Munich, 2014.
• Michael Nelhiebel, Michael Glavanovics, Benjamin Steinwender, Roland Sleik, Gerhard Glatte, and Gerald Palatin. Active cycling test of smart power devices. In ECPE Workshop on Intelligent Reliability Testing, December 2014.
• Yevhen Nikitin. Modeling and Emulation of Dynamic Load Conditions for Stress Testing of Smart Power Devices. Master’s thesis, Carinthia University of Applied Sciences, 2014.
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. A gaussian process model to predict smart power lifetime data. In WoQIM, TU Dortmund, June 2014.
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Modeling and prediction of smart power semiconductor lifetime data using a gaussian process prior. In Proceedings of the Winter Simulation Conference 2014. IEEE, December 2014. (doi:10.1109/wsc.2014.7020111)
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. A Bayesian Application of a Gaussian Process Model to Predict Smart Power Semiconductor Lifetime Data. In International Bayesian Society World Meeting 2014, ISBA 2014, Cancun, Mexico, 2014.
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Application of a Gaussian Process Prior to Predict Smart Power Semiconductor Lifetime Data. In Second Bayesian Young Statisticians Meeting, BAYSM2014, Vienna, Austria, 2014.
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Bayesian prediction of SMART power semiconductor lifetime with Bayesian Networks. In Ettore Lanzarone and Francesca Ieva, editors, The Contribution of Young Researchers to Bayesian Statistics, volume 63 of Springer Proceedings in Mathematics & Statistics, pages 109–112. Springer, Cham, 2014. (doi:10.1007/978-3-319-02084-6_22)
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Smart Power Semiconductor Reliability Evaluation Using a Gaussian Process based Norris-Landzberg Model. In 14^th annual Conference of European Network on Business and Industrial Statistics, ENBIS-14, Linz, Austria, 2014.
• Gregor Pobegen, Thomas Aichinger, Alberto Salinaro, and Tibor Grasser. Impact of hot carrier degradation and positive bias stress on lateral 4h-sic nmosfets. Materials Science Forum, 778–780:959–962, February 2014. (doi:10.4028/www.scientific.net/MSF.778-780.959)
• Gregor Pobegen, Michael Nelhiebel, Stefano de Filippis, and Tibor Grasser. Accurate High Temperature Measurements Using Local Polysilicon Heater Structures. Device and Materials Reliability, IEEE Transactions on, 14(1):169–176, March 2014. (doi:10.1109/TDMR.2013.2265015)
• Gregor Pobegen, Thomas Aichinger, and Michael Nelhiebel. Impact of Hydrogen on the Bias Temperature Instability. In Tibor Grasser and Tibor Grasser, editors, Bias Temperature Instability for Devices and Circuits, Bias Temperature Instability for Devices and Circuits, pages 485–505. Springer-Verlag GmbH, Tiergartenstrasse 17, 69121-Heidelberg, Germany, 1 edition, 2014. (doi:10.1007/978-1-4614-7909-3_18)
• Gregor Pobegen. Recovery from hot carrier induced degradation through temperature treatment. In Hot Carrier Degradation in Semiconductor Devices, pages 221–230. Springer International Publishing, October 2014. (doi:10.1007/978-3-319-08994-2_7)
• Tiphaine Pélisset, Balamurugan Karunamurthy, R. Otremba, and Thomas Antretter. Characterization and modeling of the AuCuSn thin solder joint under thermal cycling. In Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 2014 15^th international conference on, April 2014. (doi:10.1109/EuroSimE.2014.6813832)
• Tiphaine Pélisset, Mirko Bernardoni, Michael Nelhiebel, and Thomas Antretter. A fast passive-heating setup to investigate die-attach delamination in packaged devices. In Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16^th, pages 52–56, December 2014. (doi:10.1109/EPTC.2014.7028310)
• Stefan Schrunner. Investigation Of First-Passage-Time Distributions In Degradation-Path Models. Bachelor’s thesis, Alpen-Adria-Universität Klagenfurt, 2014.
• Bernhard Völker, Walther Heinz, Kurt Matoy, Roman Roth, Jörg Batke, Thomas Schöberl, Megan J. Cordill, Christina Scheu, and Gerhard Dehm. Mechanical and chemical investigation of interfaces between w based metallizations and annealed borophosphosilicate glass. In GRC-Thin Film & Small Scale Mechanical Behavior, 2014.
• Bernhard Völker, Walther Heinz, Kurt Matoy, Roman Roth, Jörg Batke, Thomas Schöberl, Christina Scheu, and Gerhard Dehm. Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine, 45:1967–1981, 2014. (doi:10.1080/14786435.2014.913108)
• Bernhard Völker. Investigation of interface properties of barrier metals on dielectric substrates. PhD thesis, Montanuniversität Leoben, 2014.
• Thomas Walter, G. Khatibi, Michael Nelhiebel, Walther Heinz, and Werner Robl. High cycle fatigue properties of Cu films. Microelectronic Engineering, 137:64–69, April 2014. (doi:10.1016/j.mee.2014.12.003)
• Thomas Walter. High cycle fatigue properties of Cu films. Master’s thesis, University of Vienna, 2014.
• Alexander Wimmer, Alexander Leitner, Thomas Detzel, Werner Robl, Walther Heinz, Reinhard Pippan, and Gerhard Dehm. Damage evolution during cyclic tension-tension loading of micron-sized cu lines at temperatures up to 673 k. In TMS 2014 143^rd Annual Meeting & Exhibition, San Diego, California, February 2014.
• Alexander Wimmer, Alexander Leitner, Thomas Detzel, Werner Robl, Walther Heinz, Reinhard Pippan, and Gerhard Dehm. Damage evolution during cyclic tension–tension loading of micron-sized Cu lines. Acta Materialia, 67:297–307, April 2014. (doi:10.1016/j.actamat.2013.12.006)
• Alexander Wimmer, Walther Heinz, Thomas Detzel, Werner Robl, and Gerhard Dehm. Dynamic bending experiments on freestanding Cu micron lines observed by in situ EBSD. In RMS Annual EBSD Meeting, 2014.
• Alexander Wimmer, Martin Smolka, Walther Heinz, Thomas Detzel, Werner Robl, Christian Motz, Volkert Eyert, Erich Wimmer, F. Jahnel, R. Treichler, and Gerhard Dehm. Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering: A, 618(0):398–405, 2014. (doi:10.1016/j.msea.2014.09.029)
• Alexander Wimmer. Plasticity and fatigue of miniaturized Cu structures. PhD thesis, Montanuniversität Leoben, 2014.
• Anja Zernig, Olivia Bluder, Andre Kästner, and Jürgen Pilz. Device Level Maverick Screening – Application of Independent Component Analysis in Semiconductor Industry. In ICPRAM 2014: 3^rd International Conference on Pattern Recognition Applications and Methods (Doctoral Consortium). INSTICC, SCITEPRESS Digital Library, 2014.
• Anja Zernig, Olivia Bluder, Jürgen Pilz, and Andre Kästner. An adapted screening concept to detect risk devices. In ENBIS-14: European Network for Business and Industrial Statistics, Linz, Austria, 2014.
• Anja Zernig, Olivia Bluder, Jürgen Pilz, and Andre Kästner. Device level Maverick screening – detection of risk devices through Independent Component Analysis. In 2014 Winter Simulation Conference (WSC), pages 2661–2670, 2014. (doi:10.1109/WSC.2014.7020110)

2013 ▾

• Thomas Aichinger, Michael Nelhiebel, and Tibor Grasser. Refined NBTI characterization of arbitrarily stressed PMOS devices at ultra-low and unique temperatures. Microelectronics Reliability, 53(7):937–946, 2013. (doi:10.1016/j.microrel.2013.03.007)
• Stephan Bigl. The Influence of Hydrogen and Nitrogen Impurities on the Annealing Behaviour of Undoped Silicon Glass. Master’s thesis, Vienna University of Technology, Vienna, 2013.
• Mathias Blank, Tobias Glück, Andreas Kugi, and Kreuter Hans-Peter. Modellierung eines Smart High-Side ICs. at – Automatisierungstechnik, 61(12):849–858, 2013. (doi:10.1515/auto.2013.1003)
• Olivia Bluder, Kathrin Plankensteiner, and Anja Zernig. Conscientious and sustained handling of energy and material resources at semiconductor reliability testing by applying a combination of optimal DOEs and reliable lifetime modeling. In SCo2013, Milano, 2013. via Ampère 2, Politecnico di Milano, Aula Rogers, Milan, Italy. Poster presentation.
• Raffaele Coppeta, H. Ceric, Balamurugan Karunamurthy, and Tibor Grasser. Epitaxial Volmer-Weber growth modelling. In Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on, pages 45–48, Glasgow, UK, September 2013. (doi:10.1109/SISPAD.2013.6650570)
• Stefano de Filippis, Robert Illing, Michael Nelhiebel, Stefan Decker, Helmut Köck, and Andrea Irace. Validated electro-thermal simulations of two different power MOSFET technologies and implications on their robustness. In Power Semiconductor Devices and ICs (ISPSD), 2013 25^th International Symposium on, pages 325–328, Kanazawa (JAPAN), May 2013. (doi:10.1109/ISPSD.2013.6694414)
• Stefano de Filippis. Modeling, Simulation and Validation of the Electro-Thermal Interaction in Power MOSFETs. PhD thesis, Università degli Studi di Napoli “Federico II”, Naples, 2013.
• Astrid Della Mea. Development of a HiL System Verification Method for SmartPower Applications. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2013.
• Sascha Einspieler. Distributed Microcontroller Network for Smart Power Device Life Testing and In-Situ Monitoring. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2013.
• Sebastian Eiser, Manfred Kaltenbacher, and Michael Nelhiebel. Non-conforming Meshes in Multi-scale Thermo-mechanical Finite Element Analysis of Semiconductor Power Devices. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14^th International Conference on, Breslau, Poland, April 2013. (doi:10.1109/EuroSimE.2013.6529946)
• Daniela Florian, Helmut Köck, Kathrin Plankensteiner, and Michael Glavanovics. Auto focus and image registration techniques for infrared imaging of microelectronic devices. Measurement Science and Technology, 24(7):11, 2013. (doi:10.1088/0957-0233/24/7/074020)
• Michael Fugger, C. Schäffer, Michael Nelhiebel, Herbert Danninger, and Herbert Hutter. ToF-SIMS analysis of W and Ti based diffusion barriers for Cu on Si (100) due to failure mechanism and diffusion processes. In Österreichische Chemietage, Graz, Austria, September 2013.
• Michael Fugger, C. Schäffer, Mathias Plappert, Michael Nelhiebel, Herbert Danninger, and Herbert Hutter. ToF-SIMS Analysis of W and Ti based Diffusion Barriers for Cu on Si (100) due to Failure Mechanism and Diffusion Processes. In 15^th European Conference on Applications of Surface and Interface Analysis, Cagliari, Sardinia, Italy, October 2013.
• Germano Galasso, Manfred Kaltenbacher, Balamurugan Karunamurthy, and Hannes Eder. Dynamics of the nanosecond laser ablation dicing of thin silicon wafers. In COLA: 12^th International Conference on Laser Ablation, Ischia, Italy, October 2013.
• Walther Heinz. Influence of Microstructure on Thermo-mechanical Fatigue of Cu Films on Substrates. In Nanomechanical Testing in Materials Research and Development IV, Olhão (Algarve), Portugal, October 2013. Poster.
• Walther Heinz. A laser based system for thermomechanical fatigue. In Nanoindentation and Surface Characterisation Workshop, 2013.
• Grygoriy Kravchenko, Balamurugan Karunamurthy, Michael Nelhiebel, and Heinz E. Pettermann. Finite element analysis of fatigue cracks formation in power metallization of a semiconductor device subjected to active cycling. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14^th International Conference on, Wroclaw, Poland, April 2013. (doi:10.1109/EuroSimE.2013.6529951)
• Helmut Köck, Stefano de Filippis, Michael Nelhiebel, Michael Glavanovics, and Manfred Kaltenbacher. Multiscale FE Modeling Concepts applied to Mircoelectronic Device Simulations. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14^th International Conference on, Breslau, Poland, April 2013. (doi:10.1109/EuroSimE.2013.6529950)
• Peter Lagger, Alexander Schiffmann, Gregor Pobegen, Dionyz Pogany, and Clemens Ostermaier. Very Fast Dynamics of Threshold Voltage Drifts in GaN based MIS-HEMTs. Electron Device Letters, IEEE, 34(9):1112–1114, September 2013. (doi:10.1109/LED.2013.2272095)
• Peter Lagger, Alexander Schiffmann, Gregor Pobegen, Dionyz Pogany, and Clemens Ostermaier. New insights on forward gate bias induced threshold voltage instabilities of GaN-based MIS-HEMTs. In 37^th Workshop on Compound Semiconductor Devices and Integrated Circuits held in Europe (WOCSDICE 2013), Warnemünde, Germany, 2013.
• Silvia Larisegger, E. Eitenberger, M. Rogalli, Holger Schulze, Michael Nelhiebel, Herbert Danninger, and Herbert Hutter. Migration and corrosion studies of copper metallization systems in semiconductor devices. In Österreichische Chemietage, Graz, Austria, September 2013.
• Silvia Larisegger, E. Eitenberger, M. Rogalli, Holger Schulze, Michael Nelhiebel, Herbert Danninger, and Herbert Hutter. Migration and Corrosion Studies of Copper Metallization Systems in Semiconductor Devices. In 15^th European Conference on Applications of Surface and Interface Analysis, Cagliari, Italy, October 2013.
• Oleksandr Melnychenko and Hans-Peter Kreuter. A Metric Driven Verification and Validation Approach for Smart Power Devices. In 9^th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), 2013, pages 289–292, Villach, June 2013. (doi:10.1109/PRIME.2013.6603177)
• Oleksandr Melnychenko and Hans-Peter Kreuter. Interfacing UVM Test Bench and Laboratory Equipment for Power Devices Verification. In Tagungsband Austrochip, Linz, 2013.
• Michael Nelhiebel, Robert Illing, Thomas Detzel, Stefan Wöhlert, Bernhard Auer, S. Lanzerstorfer, M. Rogalli, Werner Robl, Stefan Decker, Josef Fugger, and Markus Ladurner. Effective and reliable heat management for power devices exposed to cyclic short overload pulses. Microelectronics Reliability, 53(9–11):1745–1749, 2013. European Symposium on Reliability of Electron Devices, Failure Physics and Analysis. (doi:10.1016/j.microrel.2013.07.123)
• Sybille Ofner. Development of a Digital Controlled Smart Gate Driver forPower MOSFETs on a Rapid Control Prototyping System. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2013.
• Gerald Palatin. Firmware eines intelligenten In-situ Testsystems zur Lebensdaueruntersuchung von Power-MOSFETs. Bachelor’s thesis, Carinthia University of Applied Sciences, 2013.
• Barbara Pedretscher. Ein inverses problem zur vorhersage der lebensdauer von leistungshalbleiterbauteilen. Bachelor’s thesis, Alpen-Adria-Universität Klagenfurt, 2013.
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Application of Bayesian networks to predict SMART power semiconductor lifetime. In Proceedings of the 2013 9^th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). IEEE, June 2013. (doi:10.1109/prime.2013.6603175)
• Kathrin Plankensteiner, Olivia Bluder, and Jürgen Pilz. Prediction of Smart Power Semiconductor Lifetime Data with Bayesian Networks. In y- BIS 2013: Joint meeting of young business and industrial statisticians, Istanbul, Turkey, September 2013. Invited Talk.
• Kathrin Plankensteiner. Application of Bayesian Causal Models and Time Dependent Models for Semiconductor Lifetime Data. In Bayes by the Bay, Pondicherry, India, 2013. Poster.
• Gregor Pobegen and Tibor Grasser. On the Distribution of NBTI Time Constants on a Long, Temperature-Accelerated Time Scale. Electron Devices, IEEE Transactions on, 60(7):2148–2155, July 2013. (doi:10.1109/TED.2013.2264816)
• Gregor Pobegen and Tibor Grasser. Efficient Characterization of Threshold Voltage Instabilities in SiC nMOSFETs Using the Concept of Capture-Emission-Time Maps. Materials Science Forum, 740-742:757–760, 2013. (doi:10.4028/www.scientific.net/MSF.740-742.757)
• Gregor Pobegen, Michael Nelhiebel, and Tibor Grasser. Detrimental impact of hydrogen passivation on NBTI and HC degradation. In Reliability Physics Symposium (IRPS), 2013 IEEE International, pages XT.10.1–XT.10.6, Monterey, CA, USA, April 2013. (doi:10.1109/IRPS.2013.6532125)
• Gregor Pobegen, Stanislav E. Tyaginov, Michael Nelhiebel, and Tibor Grasser. Observation of normally distributed energies for interface trap recovery after hot-carrier degradation. IEEE Electron Device Letters, 34(8):939–941, August 2013. (doi:10.1109/led.2013.2262521)
• Gregor Pobegen. Degradation of Electrical Parameters of Power Semiconductor Devices – Process Influences and Modeling. PhD thesis, Vienna University of Technology, Vienna, 2013.
• Tiphaine Pélisset, Walther Heinz, Balamurugan Karunamurthy, and Thomas Antretter. Constitutive Modeling of Thin Films Under Thermal Cycling. In Microelectronics Packaging Conference (EMPC) , 2013 European, Grenoble, France, September 2013.
• Benjamin Steinwender, Sascha Einspieler, Michael Glavanovics, and Wilfried Elmenreich. Distributed power semiconductor stress test & measurement architecture. In Proceedings of the 11^th IEEE International Conference on Industrial Informatics, pages 129–134, Bochum, Germany, July 2013. (doi:10.1109/INDIN.2013.6622870)
• Roberta Stradiotto. Experimental characterization of negative bias temperature instability in power MOSFETs. Master’s thesis, University of Trieste, Trieste, 2013.
• Bernhard Völker, Megan J. Cordill, Walther Heinz, Roman Roth, Kurt Matoy, and Gerhard Dehm. Investigation of interface properties of barrier metals on dielectric substrates. In Nanomechanical Testing in Materials Research and Development IV, Olhão, Portugal, October 2013.
• Thomas Walter, Goltha Khatibi, Michael Nelhiebel, and Walther Heinz. High cycle fatigue properties of cu films. In 24^th Colloquium on Fatigue Mechanisms, March 2013.
• Alexander Wimmer, Alexander Leitner, Thomas Detzel, Werner Robl, Walther Heinz, Reinhard Pippan, and Gerhard Dehm. Static and dynamic behavior of freestanding Cu micron lines observerd by in situ EBSD. In Microscopy Conference (MC) 2013, 2013.
• Alexander Wimmer, Alexander Leitner, Thomas Detzel, Werner Robl, Walther Heinz, Reinhard Pippan, and Gerhard Dehm. Static and dynamic behavior of freestanding cu micron lines observerd by in situ ebsd. In Hysitron Nanobrücken Workshop, 2013.
• Anja Zernig, Olivia Bluder, and Gunter Spöck. Optimal design of experiments for semiconductor lifetime data. In Ph.D. Research in Microelectronics and Electronics (PRIME), 2013 9^th Conference on, pages 285–288, Villach, June 2013. (doi:10.1109/PRIME.2013.6603176)
• Anja Zernig. Optimal Design of Experiments for Semiconductor Data following a Mixtures-of-Experts Model. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2013.

2012 ▾

• Thomas Aichinger, P.M. Lenahan, Tibor Grasser, Gregor Pobegen, and Michael Nelhiebel. Evidence for Pb center-hydrogen complexes after subjecting PMOS devices to NBTI stress – A combined DCIV/SDR study. In Reliability Physics Symposium (IRPS), 2012 IEEE International, pages XT.2.1–XT.2.6, April 2012. (doi:10.1109/IRPS.2012.6241932)
• Mathias Blank, Tobias Glück, Kreuter Hans-Peter, and Andreas Kugi. Modellierung eines Smart High-Side ICs. In GMA Fachausschuss 1.30 “Modellbildung, Identifikation und Simulation in der Automatisierungstechnik”, pages 49–65. Technische Universität Darmstadt Institut für Automatisierungstechnik und Mechatronik, September 2012. (doi:20.500.12708/73236)
• Olivia Bluder, Jürgen Pilz, Michael Glavanovics, and Kathrin Plankensteiner. A Bayesian Mixture Coffin-Manson Approach to Predict Semiconductor Lifetime. In Proceedings of SMTDA 2012: Stochastic modeling Techniques and Data Analysis, 2012.
• Olivia Bluder. Investigation of Bayesian Mixtures-of-Experts models to predict semiconductor lifetime. LINSTAT 2012, 2012. Invited Talk.
• Stefano de Filippis, Helmut Köck, Michael Nelhiebel, Vladimír Košel, Stefan Decker, Michael Glavanovics, and Andrea Irace. Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices. Microelectronics Reliability, 52(9-10):2374–2379, 2012. (doi:10.1016/j.microrel.2012.06.103)
• Daniela Florian, Sascha Einspieler, Helmut Köck, Michael Glavanovics, and Daniel Wischounig-Strucl. Implementation of real time auto focus methods for static and dynamic infrared imaging of power semiconductor chips. In Quantitative InfraRed Thermography, 2012.
• Daniela Florian, Helmut Köck, Kathrin Plankensteiner, and Michael Glavanovics. Infrared Image System for Microelectronic Devices: Auto Focus and Image Correlation Techniques. In 2012 IEEE International Conference on Imaging Systems and Techniques Proceedings, pages 285–290, 2012. (doi:10.1109/IST.2012.6295497)
• Michael Fugger, C. Schäffer, Michael Nelhiebel, Herbert Danninger, and Herbert Hutter. ToF-SIMS analysis of copper diffusion in silicon and diffusion barriers in power semiconductor devices. In SIMS Europe, 2012.
• Gernot Gruber, Markus Koch, Gregor Pobegen, Michael Nelhiebel, and Peter Hadley. An extended EDMR setup for SiC defect characterization. Materials Science Forum, 740-742:365–368, 2012. (doi:10.4028/www.scientific.net/MSF.740-742.365)
• Gernot Gruber. Characterization of point defects in semiconductors using electrically detected magnetic resonance. Master’s thesis, Graz University of Technology, 2012.
• Rui Huang. Stress and Microstructural Evolution of Electroplated Copper Films. PhD thesis, Vienna University of Technology, 2012.
• Severin Kampl. Modelling and Simulation of High Efficiency Power Electronics. Master’s thesis, Carinthia University of Applied Sciences, 2012.
• Vladimír Košel, Stefano de Filippis, L. Chen, Stefan Decker, and Andrea Irace. FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D. Microelectronics Reliability, 53(3):356–362, 2012. (doi:10.1016/j.microrel.2012.09.002)
• Hans-Peter Kreuter. Virtual Current and Temperature Sensors for Smart Power Switches. PhD thesis, Vienna University of Technology, Vienna, 2012.
• Helmut Köck. Experimental and numerical study on heat transfer problems in microelectronic devices. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2012.
• Peter Lagger, Clemens Ostermaier, Gregor Pobegen, and Dionyz Pogany. Towards understanding the origin of threshold voltage instability of AlGaN/GaN MIS-HEMTs. In 2012 International Electron Devices Meeting, 2012. (doi:10.1109/IEDM.2012.6479033)
• Silvia Larisegger, M. Rogalli, Holger Schulze, Michael Nelhiebel, Herbert Danninger, and Herbert Hutter. Tof-sims characterization of passivation systems for the copper metallization in semiconductor devices. In SIMS Europe, 2012.
• Michael Nelhiebel. Reliability challenges for automotive semiconductor devices: the power metal perspective. AMC2012, 2012. invited talk.
• Gerald Palatin. Entwicklung eines intelligenten In-situ Testsystems zur Lebensdaueruntersuchung von Power-MOSFETs. Bachelor’s thesis, Carinthia University of Applied Sciences, November 2012.
• Klaus Plankensteiner. Design of a dynamic database for semiconductor stress test data. Bachelor’s thesis, Graz University of Technology, 2012.
• Gregor Pobegen, Michael Nelhiebel, and Tibor Grasser. Recent Results Concerning the Influence of Hydrogen on the Bias Temperature Instability. In 2012 IEEE International Integrated Reliability Workshop Final Report, 2012. (doi:10.1109/IIRW.2012.6468920)
• Gerald Rescher. Power-cycling induced degradation of aluminium metal lines. Bachelor’s thesis, Graz University of Technology, 2012.
• Matthias Schratter. Design of a Modular Application Level Stress Test System for Power Semiconductors. Master’s thesis, Carinthia University of Applied Sciences, 2012.
• Martin Smolka, Christian Motz, Thomas Detzel, Werner Robl, T. Griesser, Alexander Wimmer, and Gerhard Dehm. Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments, 83(6):064702, 2012. (doi:10.1063/1.4725529)
• Roberta Stradiotto, Gregor Pobegen, and Michael Nelhiebel. Impact of Copper and Aluminum Power Metallization on the Negative Bias Temperature Instability. In 2012 IEEE International Integrated Reliability Workshop Final Report, 2012. (doi:10.1109/IIRW.2012.6468922)
• Bernhard Völker, Walther Heinz, Kurt Matoy, Roman Roth, and Gerhard Dehm. Interface fracture and chemistry of metallic films on borophosphosilicate glass. In The Gordon Research Seminar on Thin Film & Small Scale Mechanical Behavior – The world of Small: Old and New Challenges, Waterville, USA, 2012. Poster.
• Alexander Wimmer, Thomas Detzel, Werner Robl, Walther Heinz, and Gerhard Dehm. Low Cycle Fatigue of micron sized copper lines. In The Gordon Research Seminar on Thin Film & Small Scale Mechanical Behavior – The world of Small: Old and New Challenges, Waterville, USA, 2012. Poster.

2011 ▾

• Ioannis Anastasiadis. Modeling and Simulation of GMR Sensor Circuits for Automotive Applications. PhD thesis, Graz University of Technology, Graz, 2011.
• Olivia Bluder, Michael Glavanovics, and Jürgen Pilz. Applying Bayesian mixtures-of-experts models to statistical description of smart power semiconductor reliability. Microelectronics Reliability, 51(9-11):1464–1468, 2011. (doi:10.1016/j.microrel.2011.06.038)
• Olivia Bluder. Prediction of Smart Power Device Lifetime based on Bayesian Modeling. PhD thesis, Alpen-Adria-Universität Klagenfurt, 2011.
• Stefano de Filippis, Vladimír Košel, Donald Dibra, Stefan Decker, Helmut Köck, and Andrea Irace. ANSYS based 3-D electro-thermal simulations for the evaluation of power MOSFETs robustness. Microelectronics Reliability, 51(9-11):1954–1958, 2011. (doi:10.1016/j.microrel.2011.06.047)
• Christian Djelassi, Thomas Aichinger, Michael Glavanovics, and Manfred Kaltenbacher. In-Situ Sensor-Matrix to Determine Package-Induced Stresses. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1(11):1677–1684, 2011. Best Paper Award of IEEE Transactions on Components, Packaging and Manufacturing Technology in the Packaging Technologies category. (doi:10.1109/TCPMT.2011.2163311)
• Christian Djelassi. Investigation on degradation of aluminum lines caused by fast and defined temperature cycling. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2011.
• Daniela Florian. Implementation and Evaluation of an Autofocus and Registration Algorithm for Infrared Microscope Imaging. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2011.
• Tibor Grasser, Thomas Aichinger, Gregor Pobegen, Hans Reisinger, Paul-Jürgen Wagner, Jacopo Franco, Michael Nelhiebel, and Ben Kaczer. The ‘Permanent’ Component of NBTI: Composition and Annealing. In 2011 International Reliability Physics Symposium, pages 605–613, Monterey, CA, USA, 2011. IEEE. (doi:10.1109/IRPS.2011.5784543)
• Tibor Grasser, Ben Kaczer, Wolfgang Goes, Hans Reisinger, Thomas Aichinger, Philipp Hehenberger, Paul-Jürgen Wagner, Franz Schanovsky, Jacopo Franco, Maria Toledano Luque, and Michael Nelhiebel. The paradigm shift in understanding the bias temperature instability: From reaction–diffusion to switching oxide traps. IEEE Transactions on Electron Devices, 58(11):3652–3666, 2011. (doi:10.1109/TED.2011.2164543)
• Tibor Grasser, Paul-Jürgen Wagner, Hans Reisinger, Thomas Aichinger, Gregor Pobegen, Michael Nelhiebel, and Ben Kaczer. Analytic modeling of the bias temperature instability using capture/emission time maps. In 2011 International Electron Devices Meeting, page 2741. IEEE, 2011. (doi:10.1109/IEDM.2011.6131624)
• Stefan Krivec, Michael Buchmayr, Thomas Detzel, Till Froemling, Juergen Fleig, and Herbert Hutter. The effect of bias-temperature stress on Na+ incorporation into thin insulating films. Analytical and Bioanalytical Chemistry, 400(3):649–657, 2011. (doi:10.1007/s00216-011-4686-z)
• Stefan Krivec. Investigations of mobile ion transport processes in thin layers upon bias-temperature stress. PhD thesis, Vienna University of Technology, Vienna, 2011.
• Helmut Köck, Christian Djelassi, Stefano de Filippis, Robert Illing, Michael Nelhiebel, Markus Ladurner, Michael Glavanovics, and Dionyz Pogany. Improved thermal management of low voltage power devices with optimized bond wire positions. Microelectronics Reliability, 51(9-11):1913–1918, September 2011. (doi:10.1016/j.microrel.2011.06.052)
• Helmut Köck, Stefano de Filippis, Djelassi Christian, Hans-Peter Kreuter, Robert Illing, Michael Glavanovics, and Manfred Kaltenbacher. In-situ calibration procedure for infrared microscopy temperature measurements. In Proceedings of the Microtechnology and Thermal Problems in Electronics, Lodz, Poland, 2011.
• Helmut Köck, Robert Illing, Thomas Ostermann, Stefan Decker, Donald Dibra, Gregor Pobegen, Stefano de Filippis, Michael Glavanovics, and Dionyz Pogany. Design of a test chip with small embedded temperature sensor structures realized in a common-drain power trench technology. In 2011 IEEE ICMTS International Conference on Microelectronic Test Structures, pages 176–181, Amsterdam, Netherlands, 2011. (doi:10.1109/ICMTS.2011.5976842)
• Liana Musat. Development of a Compact Thermal Behavioral Model for Power MOSFETs Applying Model Order Reduction. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2011.
• Michael Nelhiebel, Robert Illing, Christoph Schreiber, Stefan Wöhlert, S. Lanzerstorfer, Markus Ladurner, C. Kadow, Stefan Decker, Donald Dibra, Hubert Unterwalcher, M. Rogalli, Werner Robl, T. Herzig, M. Poschgan, M. Inselsbacher, Michael Glavanovics, and Stéphane Fraissé. A reliable technology concept for active power cycling to extreme temperatures. Microelectronics Reliability, 51(9-11):1927–1932, 2011. (doi:10.1016/j.microrel.2011.06.042)
• Kathrin Plankensteiner. Application of Bayesian Models to Predict Smart Power Switch Life Time. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2011.
• Kathrin Plankensteiner. Predicting Censored Semiconductor Lifetimes with Bayesian Regression Models Using Mixtures of Experts. In Young Statisticians’ Meeting, Dublin, 2011.
• Gregor Pobegen, Thomas Aichinger, Tibor Grasser, and Michael Nelhiebel. Impact of gate poly doping and oxide thickness on the N- and PBTI in MOSFETs. Microelectronics Reliability, 51(9-11):1530–1534, 2011. (doi:10.1016/j.microrel.2011.06.024)
• Gregor Pobegen, Thomas Aichinger, Michael Nelhiebel, and Tibor Grasser. Understanding Temperature Acceleration for NBTI. In 2011 International Electron Devices Meeting, pages 2731–2734, Washington, DC, 2011. (doi:10.1109/IEDM.2011.6131623)
• Stefan Puchner. Characterization of contaminations on semiconductor sufaces and thin layer systems with Time of Flight – Secondary Ion Mass Spectrometry. PhD thesis, Vienna University of Technology, Wien, 2011.
• Martin Smolka. Temperaturabhängige mechanische Eigenschaften miniaturisierter Kupferstrukturen aus der Leistungshalbleiterelektronik. PhD thesis, Montanuniversität Leoben, Leoben, 2011.
• Benjamin Steinwender. Hardware-kompatible Messdatenkomprimierung in Echtzeit für LabVIEW FPGA. In Virtuelle Instrumente in der Praxis 2011: Begleitband zum 16. VIP-Kongress, pages 20–24. VDE Verlag GmbH, Berlin, 2011.

2010 ▾

• Thomas Aichinger, Michael Nelhiebel, Stefan Decker, and Tibor Grasser. Energetic distribution of oxide traps created under negative bias temperature stress and their relation to hydrogen. Applied Physics Letters, 96(13):133511, 2010. (doi:10.1063/1.3374452)
• Thomas Aichinger, Michael Nelhiebel, Sascha Einspieler, and Tibor Grasser. In Situ Poly Heater – A Reliable Tool for Performing Fast and Defined Temperature Switches on Chip. IEEE Transactions on Device and Materials Reliability, 10(1):3–8, 2010. (doi:10.1109/TDMR.2009.2033467)
• Thomas Aichinger, Michael Nelhiebel, Sascha Einspieler, and Tibor Grasser. Observing two stage recovery of gate oxide damage created under negative bias temperature stress. Journal of Applied Physics, 107(2):024508, 2010. (doi:10.1063/1.3276178)
• Thomas Aichinger, Stefan Puchner, Michael Nelhiebel, Tibor Grasser, and Herbert Hutter. Impact of hydrogen on recoverable and permanent damage following negative bias temperature stress. In 2010 IEEE International Reliability Physics Symposium, pages 1063–1068, Anaheim, LA, USA, 2010. IEEE. (doi:10.1109/IRPS.2010.5488672)
• Thomas Aichinger. On the role of hydrogen in silicon device degradation and metalization processing. PhD thesis, Vienna University of Technology, Wien, 2010.
• Ioannis Anastasiadis, Tobias Werth, and Kurt Preis. Investigation and optimization of magnetic sensor gear wheels for automotive applications. In Proceedings of 14^th International IGTE Symposium, Graz, Austria, 2010.
• Olivia Bluder and Jürgen Pilz. Prediction of Semiconductor Lifetime using Bayesian Linear Models with mixed distributions. In Book of Abstracts of LinStat2010, 2010.
• Christian Djelassi, Helmut Köck, and Michael Glavanovics. Comparison of two calibration methods for a package stress measurement testchip. In 2010 IEEE International Reliability Physics Symposium, pages 446–452, Anaheim, CA, 2010. IEEE. (doi:10.1109/IRPS.2010.5488788)
• Sascha Einspieler. Development of a LabVIEW-based position control for an infrared thermal imaging system. Bachelor’s thesis, Carinthia University of Applied Sciences, Villach, 2010.
• Daniela Florian. Sources of Error in statistic life time testing of Smart Power Switches. Bachelor’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2010.
• Jakob Gager, Balamurugan Karunamurthy, Michael Nelhiebel, and Heinz E. Pettermann. Finite Element Based Simulations of Interface Cracks in Semiconductor Devices – A Study on Geometry Parameters and Delamination Configurations. In Proceedings of the 18^th European conference on fracture, Dresden, Germany, 2010.
• Jakob Gager. Numerical Simulation of Interface Cracks in Glued Die-Attach Semiconductor Devices. Master’s thesis, Vienna University of Technology, Wien, 2010.
• Tibor Grasser, Thomas Aichinger, Hans Reisinger, Jacopo Franco, Paul-Jürgen Wagner, Michael Nelhiebel, C. Ortolland, and Ben Kaczer. The ‘Permanent’ Component of NBTI: Creation, Composition, and Annealing. In 2010 IEEE International Electron Devices Meeting, San Francisco, CA, USA, 2010.
• Rui Huang, Werner Robl, Gerhard Dehm, Hajdin Ceric, and Thomas Detzel. Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In 2010 17^th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, 2010. (doi:10.1109/IPFA.2010.5532222)
• Rui Huang, Werner Robl, Thomas Detzel, and Hajdin Ceric. Modeling of stress evolution of electroplated Cu films during self-annealing. In 2010 IEEE International Reliability Physics Symposium, pages 911–917, Anaheim, CA, USA, 2010. IEEE. (doi:10.1109/IRPS.2010.5488706)
• Rui Huang, Chuck Taylor, Stefan Himmelsbach, Hajdin Ceric, and Thomas Detzel. Apparatus for measuring local stress of metallic films, using an array of parallel laser beams during rapid thermal processing. Measurement Science and Technology, 21(5):055702, 2010. (doi:10.1088/0957-0233/21/5/055702)
• Vladimír Košel, Christian Djelassi, Helmut Köck, Michael Glavanovics, and Arno Zechmann. Electro-thermal simulation of a semiconductor device based on simulatively extracted electrical parameters from measurements. In 7^th EUROSIM Congress on Modelling and Simulation, Prague, 2010.
• Vladimír Košel, Milan Držík, Alexander Šatka, Juraj Chlpík, Michael Glavanovics, and Daniel Donoval. Transient thermo-mechanical analysis of smart power switches by a laser Doppler vibrometer and numerical simulations. Measurement Science and Technology, 22(1):015704, 2010. (doi:10.1088/0957-0233/22/1/015704)
• Vladimír Košel, Robert Illing, Michael Glavanovics, and Alexander Šatka. Non-linear thermal modeling of DMOS transistor and validation using electrical measurements and FEM simulations. Microelectronics Journal, 41(12):889–896, 2010. (doi:10.1016/j.mejo.2010.07.016)
• Hans-Peter Kreuter, Vladimír Košel, and Glavanovics Michael. Compact VHDL-AMS System Level Model of Smart Power Switches for Control Concept Verification. In 7^th EUROSIM Congress on Modelling and Simulation, Prague, 2010.
• Stefan Krivec, Michael Buchmayr, Thomas Detzel, Michael Nelhiebel, and Herbert Hutter. Voltage assisted sodium ion incorporation ans transport in thin silicon dioxide films. Surface and Interface Analysis, 42(6-7):886–890, 2010. (doi:10.1002/sia.3240)
• Stefan Krivec, Thomas Detzel, Michael Buchmayr, and Herbert Hutter. On the temperature dependence of Na migration in thin SiO2 films during ToF-SIMS O2+ depth profiling. Applied Surface Science, 257(1):25–32, 2010. (doi:10.1016/j.apsusc.2010.06.019)
• Helmut Köck, Stefano de Filippis, Roland Sleik, Michael Glavanovics, and Dionyz Pogany. A transient temperature mapping system for integrated circuits operating in the microsecond time scale. In Austrian Workshop on Microelectronics, pages 73–78, Villach, Austria, 2010.
• Martin Lederer, Javad Zarbakhsh, Rui Huang, Thomas Detzel, and Brigitte Weiss. Thermomechanical Stresses in Copper Films at Elevated Temperature. Journal of Microelectronics and Electronic Packaging, 7(2):99–104, 2010.
• Martin Lederer, Javad Zarbakhsh, Rui Huang, Thomas Detzel, and Brigitte Weiss. Thermomechanical Stresses in Copper Films at Elevated Temperature. In International Conference on High Temperature Electronics, Albuquerque, New Mexico, USA, 2010.
• Kurt Matoy, Thomas Detzel, Matthias Müller, Christian Motz, and Gerhard Dehm. Interface fracture properties of thin films studied by using the micro-cantilever fraction technique. Surface and Coatings Technology, 204(6-7):878–881, 2010. (doi:10.1016/j.surfcoat.2009.09.013)
• Kurt Matoy, Helmut Schönherr, Thomas Detzel, and Gerhard Dehm. Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers. Thin Solid Films, 518(20):5796–5801, 2010. (doi:10.1016/j.tsf.2010.05.114)
• Thang Nguyen and Georg Pelz. Non-standard CAN network topologies verification at high speed transmission rate using VHDL-AMS. Technical Report 2010-01-0688, SAE Technical Paper, Detroit, Michigan, USA, 2010. (doi:10.4271/2010-01-0688)
• Gregor Pobegen, Thomas Aichinger, Michael Nelhiebel, and Tibor Grasser. Dependence of the Negative Bias Temperature Instability on the Gate Oxide Thickness. In 2010 IEEE International Reliability Physics Symposium, Anaheim, LA, USA, 2010. IEEE. (doi:10.1109/IRPS.2010.5488670)
• Gregor Pobegen. Advanced electrical characterization of NBTI induce gate oxide defects. Master’s thesis, Graz University of Technology, Graz, 2010.
• Stefan Puchner, Arno Zechmann, Thomas Detzel, and Herbert Hutter. Titanium layers on aluminum bond pads: Characterisation of thin layers on rough substrates. Surface and Interface Analysis, 42(6-7):779–782, 2010. (doi:10.1002/sia.3471)
• Roland Sleik. Investigation of Integrated Protection Functions in Smart Power Switches based on the Development of an Advanced Control and Measurement Interface. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2010.
• Benjamin Steinwender. Design of a Real-time System for in-situ Characterization of Smart Power Switches during Cycle Stress Testing. In Virtuelle Instrumente in der Praxis 2010: Messtechnik, Automatisierung; Begleitband zum 15. VIP-Kongress, pages 155–159. VDE Verlag GmbH, Berlin, 2010.
• Benjamin Steinwender. In-situ characterization of smart power switches during cycle stress testing. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2010.
• Alfred Waukmann and Michael Glavanovics. Energy Ramp-Up Test Method for SOA Definition of Smart Power Switches with Application Relevant Stress Pulses. In Austrian Workshop on Microelectronics, pages 105–108, Villach, 2010.
• Alfred Waukmann. Electro-thermal Characterization of Smart Power Devices. Bachelor’s thesis, Carinthia University of Applied Sciences, Villach, 2010.
• Javad Zarbakhsh, Balamurugan Karunamurthy, Carlos Omar Trejo Caballero, Endre Barti, and Thomas Detzel. Microscopic stress simulation of non-planar chip technologies. Microelectronics Reliability, 50:1666–1671, 2010. (doi:10.1016/j.microrel.2010.07.015)
• Javad Zarbakhsh, Balamurugan Karunamurthy, Carlos Omar Trejo Caballero, Endre Barti, and Thomas Detzel. Microscopic stress simulation of non-planar chip technologies. In 21^st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Gaeta – Italy, 2010.
• Javad Zarbakhsh, Martin Lederer, Rui Huang, Thomas Detzel, and Brigitte Weiss. Modeling of Multi-Temperature-Cycle Wafer Curvature. In 2010 12^th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA, 2010. (doi:10.1109/ITHERM.2010.5501268)

2009 ▾

• Thomas Aichinger, Michael Nelhiebel, and Tibor Grasser. A Combined Study of p- and n-Channel MOS Devices to Investigate the Energetic Distribution of Oxide Traps After NBTI. IEEE Transactions on Electron Devices, 56(12):3018–3026, 2009. (doi:10.1109/TED.2009.2033008)
• Thomas Aichinger, Michael Nelhiebel, and Tibor Grasser. Unambiguous identification of the NBTI recovery mechanism using ultra-fast temperature changes. In 2009 IEEE International Reliability Physics Symposium, pages 2–7, Montreal, CA, 2009. IEEE.
• Ioannis Anastasiadis, Tobias Werth, and Kurt Preis. Evaluation and Optimization of Back-Bias Magnets for Automotive Applications Using Finite-Element Methods. IEEE Transactions on Magnetics, 45(3):1332–1335, 2009. (doi:10.1109/TMAG.2009.2012618)
• Lukas Bellwald. Implementation of a Data Acquisition System for Performance Measurements of Magnetic Field Sensor Products within an Application Gear Test-Bench. Bachelor’s thesis, Carinthia University of Applied Sciences, Villach, 2009.
• Olivia Bluder and Alfred Waukmann. Bayesian Lifetime Modeling for Power Semiconductor Devices. In Proceedings of the World Congress on Engineering and Computer Science, pages 826–831, 2009.
• Stefano de Filippis. Development of an experimental setup for Infrared Camera characterization aimed at Smart Power devices Thermography. Master’s thesis, Università degli Studi di Napoli – Federico II, Naples, 2009.
• Christian Djelassi. Development of an Automated Measurement System for a Smart Power Technology Testchip to Characterize Mechanical Package Stress. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2009.
• Martin Duregger. Development of an Automatic CAN Measurement and Evaluation System. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2009.
• Michael Glavanovics, Hans-Peter Kreuter, Roland Sleik, and Christoph Schreiber. Cycle stress test equipment for automated short circuit testing of smart power switches according to the AEC Q100-012 standard. In Proceedings of the 13^th European Conference on Power Electronics and Applications, Barcelona, Spain, 2009.
• Tibor Grasser, Ben Kaczer, Wolfgang Goes, Thomas Aichinger, Philip Hehenberger, and Michael Nelhiebel. A Two-Stage Model for Negative Bias Temperature Instability. In Proceedings of the 2009 IEEE International Reliability Physics Symposium, pages 33–44, Montreal, CA, USA, 2009. (doi:10.1109/IRPS.2009.5173221)
• Tibor Grasser, Ben Kaczer, Wolfgang Goes, Thomas Aichinger, Philip Hehenberger, and Michael Nelhiebel. Understanding negative bias temperature instability in the context of hole trapping. Microelectronic Engineering, 86(7-9):1876–1882, 2009. (doi:10.1016/j.mee.2009.03.120)
• Tibor Grasser, Hans Reisinger, Wolfgang Goes, Thomas Aichinger, Philip Hehenberger, Paul-Jürgen Wagner, Michael Nelhiebel, Jacopo Franco, and Ben Kaczer. Switching oxide traps as the missing link between negative bias temperature instability and random telegraph noise. In Proceedings of the 2009 IEEE International Electron Devices Meeting, Baltimore, USA, 2009. (doi:10.1109/IEDM.2009.5424235)
• Philip Hehenberger, Thomas Aichinger, Tibor Grasser, Wolfgang Goes, Oliver Triebl, Ben Kaczer, and Michael Nelhiebel. Do NBTI-induced interface states show fast recovery? A study using a corrected on-the-fly charge-pumping measurement technique. In 2009 IEEE International Reliability Physics Symposium, pages 1033–1038, Montreal, CA, 2009. (doi:10.1109/IRPS.2009.5173406)
• Rui Huang, Werner Robl, Hajdin Ceric, Thomas Detzel, and Gerhard Dehm. Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions on Device and Materials Reliability, 10(1):47–54, 2009. (doi:10.1109/TDMR.2009.2032768)
• Vladimír Košel. Thermo-Mechanical Analysis of a Smart Power Switch Subjected to Transient Thermal Stress. Infoplaner CADFEM, 1:40–41, 2009.
• Hans-Peter Kreuter and Helmut Köck. FPGA based Closed Loop Control to Accelerate Life Time Stress Tests for Smart Power Switches. In Virtuelle Instrumente in der Praxis: Begleitband zum Kongress VIP 2009. Hüthig, Fürstenfeldbruck, Germany, 2009.
• Hans-Peter Kreuter, Michael Glavanovics, and Christoph Schreiber. Closed Loop Temperature and Repetition Rate Control for Accelerated Pulse Stress Testing of Smart Power Switches. In 13^th European Conference on Power Electronics and Applications, Barcelona, Spain, 2009.
• Hans-Peter Kreuter, Vladimír Košel, Michael Glavanovics, and Robert Illing. System level modeling of smart power switches using SystemC-AMS for digital protection concept verification. In 2009 IEEE Behavioral Modeling and Simulation Workshop, pages 37–42, San Jose, California, USA, 2009. (doi:10.1109/BMAS.2009.5338890)
• Helmut Köck, Vladimír Košel, Christian Djelassi, Michael Glavanovics, and Dionyz Pogany. IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in-situ heated structures. Microelectronics Reliability, 49(9-11):1132–1136, 2009. (doi:10.1016/j.microrel.2009.06.032)
• Kurt Matoy, Thomas Detzel, Christian Motz, and Gerhard Dehm. Mechanical characterization of silicon based dielectrics and dielectric/metal interfaces. In European Congress and Exhibition on Advanced Materials and Processes, Glasgow, 2009.
• Kurt Matoy, Thomas Detzel, Matthias Müller, Christian Motz, and Gerhard Dehm. Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. In International Conference on Metallurgical Coatings and Thin Films, San Diego, CA, US, 2009.
• Kurt Matoy, Thomas Detzel, Helmut Schönherr, Christian Motz, and Gerhard Dehm. A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films, 518(1):247–256, 2009. (doi:10.1016/j.tsf.2009.07.143)
• Kurt Matoy. Micro-Mechanical Characterization of Silicon based Dielectric Films and Metal/Dielectric Interfaces. PhD thesis, Montanuniversität Leoben, Leoben, 2009.
• Thang Nguyen, Martin Duregger, and Georg Pelz. Full system verification of CAN Network at high speed transmission rate using VHDL-AMS. In 2009 IEEE Behavioral Modeling and Simulation Workshop, pages 84–89, San Jose, USA, 2009. (doi:10.1109/BMAS.2009.5338882)
• Thang Nguyen, Mihriban Gürsoy, and Dieter Metzner. System level modeling, simulation and verification of a CAN physical layer star network using behavior modeling language. In 23^rd EUROPEAN Conference on Modelling and Simulation, Universidad Rey Juan Carlos – Madrid – SPAIN, 2009.
• Thang Nguyen. Virtual Prototyping of the CAN Physical Layer Using VHDL-AMS. PhD thesis, Vienna University of Technology, Vienna, 2009.
• Anton Pirker-Frühauf. A knowledge-based test program following the ATML Standard. In 2009 IEEE AUTOTESTCON, pages 195–199, Anaheim, CA, USA, 2009. IEEE. (doi:10.1109/AUTEST.2009.5314090)
• Anton Pirker-Frühauf. New methods and concepts to speed-up the verification process of integrated circuits. PhD thesis, Vienna University of Technology, Vienna, 2009.
• Stefan Puchner, Arno Zechmann, Thomas Detzel, and Herbert Hutter. Titanium layers on aluminum bond pads: Characterisation of thin layers on rough substrates. In 13^th European Conference on Applications of Surface and Interface Analysis, Antalya, Turkey, 2009.
• Michele Riccio, Vladimír Košel, Andrea Irace, Giovanni Breglio, Paolo Spirito, Michael Glavanovics, and Alexander Šatka. Thermal Simulation and Ultrafast IR Temperature Mapping of a Smart Power Switch for Automotive Applications. In 2009 21^st International Symposium on Power Semiconductor Devices & IC’s, Barcelona, Spain, 2009. (doi:10.1109/ISPSD.2009.5158036)
• Armin Satz, Dirk Hammerschmidt, and David Tumpold. Capacitive passenger detection utilizing dielectric dispersion in human tissues. Sensors and Actuators A: Physical, 152(1), 2009. (doi:10.1016/j.sna.2009.03.005)
• Armin Satz. New methods and concepts for capacitive passenger detection. PhD thesis, Vienna University of Technology, Vienna, 2009.
• Carlos Omar Trejo Caballero. Study of On-Chip Stress Distribution Orginated from Copper Patterns in Package Interaction Test Chip. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2009.
• David Tumpold and Armin Satz. Contactless Seat Occupation Detection System Based on Electric Field Sensing. In 2009 35^th Annual Conference of IEEE Industrial Electronics, pages 1823–1828, Porto / Portogal, 2009. (doi:10.1109/IECON.2009.5414836)
• David Tumpold. Smart Seat Occupand Detection System for Non-contact People Recognition, Based on Electric Fields. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2009.
• Paul-Jürgen Wagner, Thomas Aichinger, Tibor Grasser, Michael Nelhiebel, and Lode K. J. Vandamme. Possible Correlation between Flicker Noise and Bias Temperature Stress. In NOISE AND FLUCTUATIONS: 20^th International Conference on Noise and Fluctuations (ICNF-2009), pages 621–624, Pisa, Italy, 2009. (doi:10.1063/1.3140551)

2008 ▾

• Thomas Aichinger and Michael Nelhiebel. Advanced Energetic and Lateral Sensitive Charge Pumping Profiling Methods for MOSFET Device Characterization – Analytical Discussion and Case Studies. IEEE Transactions on Device and Materials Reliability, 8(3):509–518, 2008. (doi:10.1109/TDMR.2008.2002352)
• Thomas Aichinger, Michael Nelhiebel, and Tibor Grasser. On the temperature dependence of NBTI recovery. Microelectronics Reliability, 48(8-9):1178–1184, 2008. Best paper at ESREF 2008. (doi:10.1016/j.microrel.2008.06.018)
• Ioannis Anastasiadis, Tobias Werth, and Kurt Preis. Evaluation and optimization of back-bias magnets for automotive applications using finite element methods. In IEEE Conference on Electromagnetic Field Computation, 2008.
• Olivia Bluder and Kathrin Plankensteiner. Comparing log-normal and Weibull distribution for modeling lifetimes of Smart Power ICs. In Proceedings of Austrian Workshop on Microelectronics, pages 67–72, 2008.
• Olivia Bluder. Statistical analysis of smart power switch life test results. Master’s thesis, Alpen-Adria-Universität Klagenfurt, 2008.
• Christian Djelassi, Hans-Peter Kreuter, and Michael Glavanovics. Development and Verification of an IC Case Temperature Measurement System. In Austrian Workshop on Microelectronics, Linz, Austria, 2008.
• Michael Glavanovics, Roland Sleik, and Christoph Schreiber. A compact high current system for short circuit testing of smart power switches according to AEC standard Q100-012. In 2008 IEEE Power Electronics Specialists Conference, pages 1828–1832, Rhodes, Greece, 2008. IEEE. (doi:10.1109/PESC.2008.4592209)
• Tibor Grasser, Ben Kaczer, Thomas Aichinger, Wolfgang Goes, and Michael Nelhiebel. Defect Creation Stimulated by Thermally Activated Hole Trapping as the Driving Force Behind Negative Bias Temperature Instability in SiO2, SiON, and High-k Gate Stacks. In 2008 IEEE International Integrated Reliability Workshop Final Report, pages 91–95, 2008. (doi:10.1109/IRWS.2008.4796094)
• Jovan Hadzi-Vukovic, M. Jevtic, Michael Glavanovics, and Hubert Rohleitner. The study of esd induced defects in grounded gate nmos using low frequency noise measurements. physica status solidi (a), 205(11):2544–2547, November 2008. (doi:10.1002/pssa.200780115)
• Simon Hainz and Dirk Hammerschmidt. Compensation of Angular Errors using Decision Feedback Equalizer Approach. IEEE Sensors Journal, 8(9):1548–1556, 2008. (doi:10.1109/JSEN.2008.925456)
• Simon Hainz. Compensation of the Systematic Angle Error Caused by Air Gap Variations Using Decision Feedback Equalizer Approach. PhD thesis, Vienna University of Technology, Wien, 2008.
• Hendrik Husstedt. Kalibrierung eines Referenzsensors zur ortsabhängigen Erfassung inhomogener Magnetfelder. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2008.
• Vladimír Košel, Michael Glavanovics, and Erich Scheikl. Evaluation of an electrical method for detection of die attach imperfections in Smart Power Switches using transient thermal FEM simulations. In 2008 14^th International Workshop on Thermal Inveatigation of ICs and Systems, pages 204–207, Rom, 2008. IEEE. (doi:10.1109/THERMINIC.2008.4669909)
• Vladimír Košel. Thermo-Mechanical Analysis of Smart Power Switches under Dynamic Thermal Stress Conditions. PhD thesis, Slovak University of Technology in Bratislava, Bratislava, 2008.
• Kurt Matoy, Thomas Detzel, Helmut Schönherr, Thomas Schöberl, Christian Motz, Reinhard Pippan, and Gerhard Dehm. Mechanical behavior of PECVD silicon oxide, oxynitride and nitride: A comparative micro-cantilever deflection study. In GRC Conference on Thin Film & Small Scale Mechanical Behavior, Waterville (Maine, US), 2008.
• Thang Nguyen and Magnus-Maria Hell. Verification of the Controller Area Network physical layer with behavior modeling and simulation. In Proceedings of the 19^th IASTED International Conference on Modelling and Simulation, pages 217–222, Quebec, Canada, 2008.
• Thang Nguyen, Joachim Haase, and Georg Pelz. A Sensitivity analysis of passive CAN bus components to investigate signal integrity of CAN network physical layer. In 2008 IEEE International Behavioral Modeling and Simulation Workshop, San Jose, California, USA, 2008. (doi:10.1109/BMAS.2008.4751240)
• Satish Patil. Conception and Design of the Vibration Test Bench for Gaint Magneto Resistive (GMR) sensors. Master’s thesis, RWTH Aachen, Aachen, 2008.
• Anton Pirker-Frühauf and Matthias Kunze. A novel methodology to combine and speed-up the verification process of simulation and measurement of integrated circuits. In Proceedings of the 2008 IEEE AUTOTESTCON Conference, Salt Lake Citiy, Utah, USA, 2008. (doi:10.1109/AUTEST.2008.4662622)
• Anton Pirker-Frühauf, Wolfgang Gallent, Matthias Kunze, and Georg Pelz. Acceleration of IC verification process using advanced flexible modular measurement systems and software architectures. In Proceedings of the 2008 IEEE Instrumentation and Measurement Technology Conference, pages 1845–1847, Victoria, Vancouver Island, Canada, 2008. IEEE. (doi:10.1109/IMTC.2008.4547345)
• Armin Satz and Dirk Hammerschmidt. New Modeling & Evaluation Approach for Capacitive Occupant Detection in Vehicles. In 2008 IEEE International Behavioral Modeling and Simulation Workshop, pages 25–28, 2008. (doi:10.1109/BMAS.2008.4751234)
• Tobias Smorodin, Peter Nelle, Jörg Busch, Jörg Wilde, Michael Glavanovics, and Matthias Stecher. Investigation and improvement of DMOS switches under fast electro-thermal cycle stress. Solid-State Electronics, 52(9):1353–1358, 2008. (doi:10.1016/j.sse.2008.04.025)
• Javad Zarbakhsh, Thomas Detzel, Rui Huang, Markus Leicht, Peter Nelle, and Stefan Woehlert. Prediction of wafer bow through thermomechanical simulation of patterned hard coated copper films. In EuroSimE 2008 – International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg im Breisgau, Germany, 2008. (doi:10.1109/ESIME.2008.4525036)

2007 ▾

• Thomas Aichinger and Michael Nelhiebel. Charge Pumping revisited – the benefits of an optimized constant base level charge pumping technique for MOS-FET analysis. In 2007 IEEE International Integrated Reliability Workshop Final Report, pages 63–69, Lake Tahoe, CA, USA, 2007. IEEE. (doi:10.1109/IRWS.2007.4469223)
• Olivia Bluder, Helmut Köck, and Michael Glavanovics. Comparison of Statistical Models describing Power Semiconductor Cycle Life Data. In Book of Abstracts of the Applied Statistics 2007, page 27, 2007.
• Matthias Fill. Die thermische Ausdehnung von miniaturisierten Mehrlagen-Schichtstrukturen. Master’s thesis, University of Vienna, Wien, 2007.
• Wolfgang Gallent. KLAX – An Automated Laboratory Test System for the Characterization of Smart Power Switches. Master’s thesis, Carinthia University of Applied Sciences, Villach, 2007.
• Michael Glavanovics, Helmut Köck, Herbert Eder, Vladimír Košel, and Tobias Smorodin. A new cycle test system emulating inductive switching waveforms. In 2007 European Conference on Power Electronics and Applications, Aalborg, Denmark, 2007. IEEE. (doi:10.1109/EPE.2007.4417742)
• Michael Glavanovics, Helmut Köck, Vladimír Košel, and Tobias Smorodin. Flexible active cycle stress testing of smart power switches. Microelectronics Reliablity, 47(9-11):1790–1794, 2007. Identical with the ESREF 2007 publication – submitted to the journal by ESREF committee. (doi:10.1016/j.microrel.2007.07.065)
• Michael Glavanovics, Helmut Köck, Vladimír Košel, and Tobias Smorodin. Flexible active cycle stress testing of Smart Power switches. In European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Arcachon, France, 2007. Elsevier B.V., Radarweg 29, 1043 NX Amsterdam, The Netherlands. (doi:10.1016/j.microrel.2007.07.065)
• Simon Hainz and Mario Jungwirth. Magnetic Field Sensor Using a Physical Model to Pre-Calculate the Magnetic Field and to Remove Systematic Error due to Physical Parameters. In 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, 2007. (doi:10.1109/ESIME.2007.359929)
• Vladimír Košel, Roland Sleik, and Michael Glavanovics. Transient non-linear thermal FEM simulation of smart power switches and verification by measurements. In 2007 13^th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC), Budapest, Hungary, 2007. IEEE. (doi:10.1109/THERMINIC.2007.4451757)
• Vladimír Košel, Javad Zarbakhsh, and Michael Glavanovics. Plastic deformation of aluminum bonding wire impressed by wedge bonding tool. In 6^th EUROSIM Congress on Modelling and Simulation, Ljubljana, Slovenia, 2007.
• Hans-Peter Kreuter. Development of an Accelerated Short Circuit Life Test Method for Smart Power Switches. Master’s thesis, Alpen-Adria-Universität Klagenfurt, Klagenfurt, 2007.
• Helmut Köck and Hans-Peter Kreuter. A Novel Lifetime Cycle Test System for Integrated Power Devices. In Virtuelle Instrumente in der Praxis: Begleitband zum Kongress VIP 2007, pages 370–373. Hüthig Verlag, München, 2007.
• Helmut Köck. Software Development for Cycle Test Systems based on a Multi-Tier Architecture. Master’s thesis, Carinthia University of Applied Sciences, Klagenfurt, 2007.
• Melanie Lackner, Vladimír Košel, and Michael Glavanovics. Evaluation of deltaVSD Measuring Method to detect Package Irregularities in Smart Power Switches. In Austrian Workshop on Microelectronics, Graz, Austria, 2007.
• Melanie Lackner. Evaluation of DeltaVSD measuring method to detect package irregularities in smart power switches. Master’s thesis, Carinthia University of Applied Sciences, Villach, Austria, 2007.
• Anton Pirker-Frühauf, Karsten Schönherr, Arnaud Laroche, and Georg Pelz. Worst-Case Modeling and Simulation of an Automotive Throttle in VHDL-AMS. In 2007 IEEE International Behavioral Modeling and Simulation Workshop, Santa Clara, California, USA, 2007. IEEE. (doi:10.1109/BMAS.2007.4437542)
• Stefan Puchner, Herbert Hutter, Christoph Eisenmenger-Sittner, and M. Kiniger. TOF-SIMS investigations on thermally treated copper–molybdenum films on a carbon substrate. Analytical and Bionalanlytical Chemistry, 390(6):1537–1541, 2007. (doi:10.1007/s00216-007-1734-9)
• Armin Satz and Dirk Hammerschmidt. Dynamical Characterization of a vibrating member gyroscope using finite element method. In 6^th EUROSIM Congress on Modelling and Simulation, Ljubljana, Slovenia, 2007.
• Armin Satz. Dynamical characterization of a vibrating member gyroscope using fem. In Federation of European Simulation Societies, 2007.
• Tobias Smorodin, Matthias Stecher, Jörg Wilde, and Michael Glavanovics. Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms. In 37^th European Solid State Device Research Conference, pages 139–142, Munich, Germany, 2007. (doi:10.1109/ESSDERC.2007.4430898)

2006 ▾

• Herbert Eder, Köck Helmut, Hans-Peter Kreuter, and Michael Glavanovics. Advanced Repetitive Clamping Test Integrated System, 2006.
• Herbert Eder. Development of a repetitive clamping test system hardware for smart power switches. Master’s thesis, Carinthia University of Applied Sciences, Villach, Austria, 2006.
• Simon Hainz, Dirk Hammerschmidt, Tobias Werth, and Herbert Grünbacher. Improving Phase Accuracy by removing systematic phase error introduced by Inter Symbol Interference. In 20^th Eurosensors Conference, 2006.
• Simon Hainz, Erwin Ofner, Dirk Hammerschmidt, Tobias Werth, and Herbert Grünbacher. Position Detection in Automotive Application by Adaptive Inter Symbol Interference Removal. In 5^th IEEE Conference on Sensors, pages 1103–1106, South Korea, 2006. (doi:10.1109/ICSENS.2007.355818)
• Helmut Köck. Development of LabVIEW realtime FPGA software for cycle test systems. Master’s thesis, Carinthia University of Applied Sciences, Klagenfurt, 2006.