Michael Reisinger and Sebastian Moser received the 2nd place at the poster award of the 17th IRSP conference with their poster: “Characterization of the thermo-mechanical behavior of Cu metallizations in microelectronic applications”.
Tobias Ziegelwanger and Michael Reisinger received the 3rd place at the poster award of the 17th IRSP conference with their poster: ” Local gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing”.
Congratulations to you for this great success!
