News

Ze Scales, a PhD candidate in our device physics group, attended the 49th International Symposium for Testing and Failure Analysis (ISTFA) held in Phoenix, Arizona from November 12th to November 16th, 2023. During the symposium, Ze presented a talk and her paper...

Sabina Sušnik, a member of our device physics group, attended the International Integrated Reliability Workshop (IIRW), which took place in the beautiful surroundings of Fallen Leaf Lake (CA, USA). Her talked  entitled “Hot-carrier-degradation measured with...

We congratulate Boris Butej who has been selected to receive the Best Student Award at ICNS-14 conference in Fukuoka, Japan in November 2023. Boris presented his topic with the Title: Role of Lateral Hole Transport and Evacuation in dR_(DS,on) during Off-State Stress...

On 25-27th of September the 36th Conference of ELECTRICAL DRIVES AND POWER ELECTRONICS was held in Slovakia with the great venue in Slovakia/Poprad/Nový Smokovec. The conference was sponsored from Infineon and IPCEI etc. IPCEI is part of KAI's funding projects and...

Six months already passed, and we got very effectively through the set-up phase. Read more about the project and its achievements here ALL2GaN.eu. You can also follow the project on social media too at LinkedIn and Twitter.

Publication accepted at Journal of Applied PhysicsWe are pleased to announce that a publication from our device physics team has been accepted and selected as an Editor´s Pick by the Journal of Applied Physics. Here you find the link to the paper...

Infineon AI Days 2023KAI Data Science team presented at Infineon AI Days 2023 This year's #InfineonAIDays served as a valuable platform that brought together approximately 1000 participants, including members of the AI community, guests, and experts, facilitating an...

AIMS5.0 – project startProject start of AIMS5.0 - "Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0" With a budget of approximately 70 million euros makes AIMS5.0 one of Europe's major research projects. It is being funded under the...

Moritz Hartleb presented at the ISSE 2023 conferenceThe talk titled “Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components” presented the first results of his PhD-Thesis.