News

AIMS5.0 – project startProject start of AIMS5.0 - "Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0" With a budget of approximately 70 million euros makes AIMS5.0 one of Europe's major research projects. It is being funded under the...

Moritz Hartleb presented at the ISSE 2023 conferenceThe talk titled “Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components” presented the first results of his PhD-Thesis.

All2GaN project startIn May 2023 KAI started as a partner in project "ALL2GaN". In May 2023 KAI started as one of 45 partners from 12 countries the project "ALL2GaN"- Affordable smart GaN IC solutions for greener applications. In this project, with an overall research...

Manuel Petersmann presented at MTEX workshop 2023Manuel Petersmann, presented KAI and Infineon activities on electron back-scatter diffraction (EBSD) studies. The talk was called: "Use cases of MTEX for semiconductor metalizations" and dealt with the increasing...

Michael Nelhiebel presented at Coast​​​​​​​ conference at the TU Vienna on 2 May 2023. He was invited to present his topic "The new semiconductor materials for power electronic applications – or why we need surface and interface characterization".

Olivia Pfeiler as lecturer at University of KlagenfurtOn May 8, 2023, Olivia Pfeiler gave a motivational lecture for students in the Robotics & AI bachelor's program with Prof. Konstantin Schekotihin at the University of Klagenfurt.

Olivia Pfeiler, data science group lead, attended the EMMC workshop, held in Vienna from 26 – 28 April 2023. She introduced the Horizon Europe project “Advanced modelling and characterization for power semiconductor materials and technologies – AddMorePower” and...

Michael Reisinger and Sebastian Moser received the 2nd place at the poster award of the 17th IRSP conference with their poster: "Characterization of the thermo-mechanical behavior of Cu metallizations in microelectronic applications". Tobias Ziegelwanger and Michael...

During the Infineon POWERcon 2023 held in Villach, Austria, April 26 – 27, 2023, Michael Scheiber, Laurenz Hundgeburth and Daniel Tosone were awarded for their poster "The Wafer Health Factor – Automatic Detection of Critical Process Patterns within Analog Wafer Test...